Microcontrollers, Microprocessor, FPGA Modules

Use the filters and product table below to compare Microcontrollers, Microprocessor, FPGA Modules components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.

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Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Module/Board Type	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0813-01-4AE11-A MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	4,404	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU4CG-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0813-02-4AE81-A MPSOC MODULE WITH AMD ZYNQ ULTRA Trenz Electronic GmbH	3,142	-	RFQ	Datasheet	Zynq UltraScale+	Bulk	Active	MPU Core	Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0813-01-3BE11-A MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	3,799	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0813-02-3BE81-A MPSOC MODULE WITH AMD ZYNQ ULTRA Trenz Electronic GmbH	2,821	-	RFQ	Datasheet	Zynq UltraScale+	Bulk	Active	MPU Core	Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0821-01-3BE21ML MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	1,709	-	RFQ	Datasheet	TE0823	Bulk	Discontinued at Digi-Key	MPU Core	Zynq UltraScale+ XCZU3EG-1SFVC784E	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	2GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0820-05-3BE81MA MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	1,289	-	RFQ	Datasheet	-	Bulk	Active	-	-	-	-	-	-	-	-	-
TE0821-01-3BE21MA MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	4,195	-	RFQ	Datasheet	TE0823	Bulk	Discontinued at Digi-Key	MPU Core	Zynq UltraScale+ XCZU3EG-1SFVC784E	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	2GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
AM0010-02-4AE21MA MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	2,954	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	MPU Core	Zynq™ UltraScale+™ ZU4CG-1E	-	-	128MB	4GB	Board-to-Board (BTB) Socket	2.205" L x 1.575" W (56.00mm x 40.00mm)	0°C ~ 85°C
TE0820-05-3BI21ML MOD MPSOC 2GB DDR4 Trenz Electronic GmbH	1,446	-	RFQ	Datasheet	TE0820	Bulk	Last Time Buy	MPU Core	-	-	-	8GB eMMC, 128MB QSPI	2GB	-	-	-
TE0821-01-3AE31PA MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	2,492	-	RFQ	Datasheet	TE0823	Bulk	Discontinued at Digi-Key	MPU Core	Zynq UltraScale+ XCZU3CG-1SFVC784E	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	4GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C

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FREQUENTLY ASKED QUESTIONS

Microcontrollers, Microprocessor, FPGA Modules FAQ

Common questions about filtering, comparing and sourcing Microcontrollers, Microprocessor, FPGA Modules components.

How can I narrow the Microcontrollers, Microprocessor, FPGA Modules selection?

Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.

Should I confirm the datasheet before selecting a part?

Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.

Can Winsun (HK) Electronics help source a specific Microcontrollers, Microprocessor, FPGA Modules part number?

Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.

Do you support BOM, shortage or alternative-part requirements?

Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.