Microcontrollers, Microprocessor, FPGA Modules

Use the filters and product table below to compare Microcontrollers, Microprocessor, FPGA Modules components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.

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Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Module/Board Type	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0728-04-1Q IC MODULE CORTEX-A9 512MB Trenz Electronic GmbH	2,135	-	RFQ	Datasheet	TE0728	Bulk	Active	MCU, FPGA	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	16MB	512MB	Samtec SEM	2.360" L x 2.360" W (60.00mm x 60.00mm)	-
TE0803-04-4BE11-A IC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH	2,140	-	RFQ	Datasheet	TE0803	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU4EG-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0745-03-71I31-A MOD SOM DDR3L 1GB Trenz Electronic GmbH	3,174	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	FPGA	ARM® Cortex®-A9	Zynq-7000 (Z-7030)	-	64MB	1GB	Board-to-Board (BTB) Socket	2.047" L x 2.992" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0813-02-4BE81-A MODULE MPSOC 4GB DDR4 Trenz Electronic GmbH	1,629	-	RFQ	Datasheet	Zynq® UltraScale+™	Box	Active	FPGA	Xilinx Zynq UltraScale+ ZU4EG	-	-	128MB	2GB	BGA	2.047" L x 2.992" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0803-04-4DE21-L IC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH	2,200	-	RFQ	Datasheet	TE0803	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0803-04-4GE21-L MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	1,114	-	RFQ	Datasheet	TE0803	Bulk	Active	MPU Core	Zynq™ UltraScale+™ XCZU4EG-2SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0745-03-81C31-A MOD SOM DDR3L 1GB Trenz Electronic GmbH	4,480	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	FPGA	ARM® Cortex®-A9	Xilinx Zynq 7035 SoC XC7Z035-1FBG676C	-	64MB	1GB	Board-to-Board (BTB) Socket	2.047" L x 2.992" W (52.00mm x 76.00mm)	0°C ~ 70°C
TE0741-05-D2I-1-A IC MOD KINTEX-7 325T 200MHZ 32MB Trenz Electronic GmbH	2,381	-	RFQ	Datasheet	Kintex®-7	Bulk	Active	FPGA	Xilinx Kintex-7 FPGA XC7K325T-2FBG676I	-	25MHz	32MB	-	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0745-03-91C31-A SOM WITH AMD ZYNQ 7045-1C, 1 GBY Trenz Electronic GmbH	2,918	-	RFQ	Datasheet	Zynq	Bulk	Active	MPU Core	ARM Cortex-A9	Xilinx Zynq 7045 SoC XC7Z045-1FBG676C	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 70°C
TE0745-03-82I31-A SOM WITH AMD ZYNQ 7035-2I, 1 GBY Trenz Electronic GmbH	3,188	-	RFQ	Datasheet	Zynq	Bulk	Active	MPU Core	ARM Cortex-A9	Xilinx Zynq 7035 SoC XC7Z035-2FBG676I	-	64MB	1GB	Board-to-Board (BTB) Socket - 250	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C

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FREQUENTLY ASKED QUESTIONS

Microcontrollers, Microprocessor, FPGA Modules FAQ

Common questions about filtering, comparing and sourcing Microcontrollers, Microprocessor, FPGA Modules components.

How can I narrow the Microcontrollers, Microprocessor, FPGA Modules selection?

Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.

Should I confirm the datasheet before selecting a part?

Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.

Can Winsun (HK) Electronics help source a specific Microcontrollers, Microprocessor, FPGA Modules part number?

Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.

Do you support BOM, shortage or alternative-part requirements?

Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.