Microcontrollers, Microprocessor, FPGA Modules
Browse available Microcontrollers, Microprocessor, FPGA Modules part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.
For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Module/Board Type | Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0726-03-07S-1CIC MOD CORTEX-A9 766MHZ 512MB |
1,625 | - |
|
Datasheet | TE0726 | Bulk | Obsolete | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7007S) | 766MHz | 16MB | 512MB | CSI, DSI | 1.570" L x 1.180" W (40.00mm x 30.00mm) | 0°C ~ 70°C |
|
CENPXA270-HLR01-0708R-ACARD ENGINE 64MB SDRAM |
4,917 | - |
|
Datasheet | * | Box | Obsolete | - | - | - | - | - | - | - | - | - |
|
3352-HX-XX7-RCIC MODULE CORTEX-A8 800MHZ 256MB |
2,709 | - |
|
Datasheet | MitySOM | Bulk | Active | MPU Core | ARM® Cortex®-A8, AM3352 | NEON™ SIMD | 800MHz | - | 256MB | SO-DIMM-204 | 2.660" L x 1.500" W (67.60mm x 38.10mm) | 0°C ~ 70°C |
|
3359-GX-226-RLIC MOD CORTEX-A8 720MHZ 64KB |
1,797 | - |
|
Datasheet | MitySOM | Bulk | Obsolete | MPU Core | ARM® Cortex®-A8, AM3359 | NEON™ SIMD | 720MHz | 256MB (NAND), 8MB (NOR) | 64KB (Internal), 256MB (External) | SO-DIMM-204 | 2.660" L x 1.500" W (67.60mm x 38.10mm) | -40°C ~ 70°C |
|
L138-FX-236-RCIC MOD ARM926EJ-S 456MHZ 8KB |
3,857 | - |
|
Datasheet | MityDSP-L138F | Bulk | Obsolete | MPU, DSP, FPGA Core | ARM926EJ-S, OMAP-L138 | TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) | 456MHz | 512MB (NAND), 8MB (NOR) | 8KB (Internal MPU), 256KB (Internal DSP), 256MB (External) | SO-DIMM-200 | 2.660" L x 2.000" W (67.60mm x 50.80mm) | 0°C ~ 70°C |
|
XP3002000-01RIC MOD DSTNI-EX 120MHZ 1.25MB |
4,895 | - |
|
Datasheet | XPort® AR™ | Tray | Obsolete | MPU Core | DSTni-EX | XPort AR | 120MHz | 4MB | 1.25MB | RJ45 | 0.650" L x 1.800" W (16.50mm x 45.70mm) | -40°C ~ 85°C |
|
|
CC-MX-PF47-AEIC MOD ARM926EJ-S 454MHZ 128MB |
3,903 | - |
|
Datasheet | ConnectCard™ | Bulk | Obsolete | MPU Core | ARM926EJ-S i.mx287 | - | 454MHz | 128MB | 128MB | Edge Connector - 52 | 2.000" L x 1.380" W (51.00mm x 35.00mm) | -40°C ~ 85°C |
|
|
DC-ME4-01T-CC-1IC MODULE ARM7TDMI 55MHZ 8MB |
3,832 | - |
|
Datasheet | Digi Connect ME® | Bulk | Obsolete | MPU Core | ARM7TDMI, NS7520 | - | 55MHz | 4MB | 8MB | RJ45 | 1.450" L x 0.750" W (36.70mm x 19.10mm) | -40°C ~ 85°C |
|
|
SOMDM3730-11-2783IFCR-ASYSTEM ON MODULE LV DM3730 |
2,450 | - |
|
Datasheet | DM37x | Bulk | Active | MPU, DSP Core | ARM® Cortex®-A8, DM3730 | TMS320C64x (DSP) | 1GHz | 512MB | 256MB | Board-to-Board (BTB) Socket - 200 | 1.230" L x 3.010" W (31.20mm x 76.50mm) | 0°C ~ 70°C |
|
SOMDM3730-11-1783IFXRIC MOD DM3730 800MHZ 256MB |
3,757 | - |
|
Datasheet | DM37x | Bulk | Obsolete | MPU Core | DM3730 | - | 800MHz | 512MB (NAND), 16MB (NOR) | 256MB | - | 3.000" L x 1.220" W (76.20mm x 31.00mm) | -20°C ~ 70°C |
|
|
SOMDM3730-11-2783IFCRIC MOD DM3730 1GHZ 256MB |
2,435 | - |
|
Datasheet | DM37x | Bulk | Obsolete | MPU Core | DM3730 | - | 1GHz | 512MB (NAND), 16MB (NOR) | 256MB | - | 3.000" L x 1.220" W (76.20mm x 31.00mm) | 0°C ~ 70°C |
|
TE0808-04-09EG-2IEIC MODULE ZYNQ USCALE 4GB 128MB |
3,903 | - |
|
Datasheet | TE0808 | Box | Obsolete | MPU Core | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | - | 128MB | 4GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
TE0745-02-30-1IAIC MODULE CORTEX-A9 1GB 32MB |
3,209 | - |
|
Datasheet | TE0745 | Bulk | Obsolete | MCU, FPGA | ARM® Cortex®-A9 | Zynq-7000 (Z-7030) | - | 32MB | 1GB | Samtec UFPS | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
TE0745-02-35-1CAIC MODULE CORTEX-A9 1GB 32MB |
3,339 | - |
|
Datasheet | TE0745 | Bulk | Obsolete | MCU, FPGA | ARM® Cortex®-A9 | Zynq-7000 (Z-7035) | - | 32MB | 1GB | Samtec UFPS | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 70°C |
|
TE0745-02-45-2IAIC MODULE CORTEX-A9 1GB 32MB |
2,066 | - |
|
Datasheet | TE0745 | Bulk | Obsolete | MCU, FPGA | ARM® Cortex®-A9 | Zynq-7000 (Z-7045) | - | 32MB | 1GB | Samtec UFPS | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
|
TE0745-02-30-2IAIC MODULE CORTEX-A9 1GB 64MB |
3,314 | - |
|
Datasheet | TE0745 | Bulk | Obsolete | MCU, FPGA | ARM® Cortex®-A9 | Zynq-7000 (Z-7030) | - | 64MB | 1GB | - | 2.990" L x 2.050" W (76.00mm x 52.00mm) | -40°C ~ 85°C |
|
|
TE0745-02-30-2IIC MODULE CORTEX-A9 1GB 64MB |
1,373 | - |
|
Datasheet | TE0745 | Bulk | Obsolete | MCU, FPGA | ARM® Cortex®-A9 | Zynq-7000 (Z-7030) | - | 64MB | 1GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
TE0808-04-09EG-1EEIC MODULE ZYNQ USCALE 4GB 128MB |
3,924 | - |
|
Datasheet | TE0808 | Bulk | Obsolete | MPU Core | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | - | 128MB | 4GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 85°C |
|
TE0808-04-15EG-1EEIC MODULE ZYNQ USCALE 2GB 128MB |
2,502 | - |
|
Datasheet | TE0808 | Bulk | Obsolete | MPU Core | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | - | 128MB | 2GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 85°C |
|
TE0820-02-02CG-1EAIC MODULE ZYNQ USCALE 1GB 128MB |
3,740 | - |
|
Datasheet | TE0820 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | - | 128MB | 1GB | B2B | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |
Microcontrollers, Microprocessor, FPGA Modules FAQ
Common questions about selecting, comparing and sourcing Microcontrollers, Microprocessor, FPGA Modules components through Winsun (HK) Electronics.
What should I check when selecting Microcontrollers, Microprocessor, FPGA Modules components?
Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.
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Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.
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