Microcontrollers, Microprocessor, FPGA Modules

Browse available Microcontrollers, Microprocessor, FPGA Modules part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

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Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Module/Board Type	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0741-03-B3E-1-AF MODULE FPGA KINTEX Trenz Electronic GmbH	3,144	-	RFQ	Datasheet	*	Box	Obsolete	-	-	-	-	-	-	-	-	-
TE0741-03-410-2IF MODULE FPGA KINTEX Trenz Electronic GmbH	1,319	-	RFQ	Datasheet	-	Box	Obsolete	FPGA Core	Xilinx Kintex-7 FPGA XC7K410T-2FBG676I	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0741-04-D2C-1-A MODULE FPGA KINTEX Trenz Electronic GmbH	4,162	-	RFQ	Datasheet	-	Box	Obsolete	FPGA Core	Xilinx Kintex-7 FPGA XC7K325T-2FBG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0741-04-A2C-1-A MODULE FPGA KINTEX Trenz Electronic GmbH	3,854	-	RFQ	Datasheet	-	Box	Obsolete	FPGA Core	Xilinx Kintex-7 FPGA XC7K70T-2FBG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0741-04-B2C-1-AF MODULE FPGA KINTEX Trenz Electronic GmbH	1,785	-	RFQ	Datasheet	-	Box	Obsolete	FPGA Core	Xilinx Kintex-7 FPGA XC7K160T-2FFG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0741-04-D2I-1-A MODULE FPGA KINTEX Trenz Electronic GmbH	4,363	-	RFQ	Datasheet	-	Box	Obsolete	FPGA Core	Xilinx Kintex-7 FPGA XC7K325T-2FBG676I	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
L138-DI-336-RI MITYDSP-L138F SOM W/ OMAP-L138 Critical Link LLC	3,460	-	RFQ	Datasheet	-	Bulk	Obsolete	-	-	-	-	-	-	-	-	-
M100PFS-250BAAB PolarFire SoC FPGA M100PFS-250 ARIES Embedded	3,214	-	RFQ	Datasheet	PolarFire™	Box	Active	FPGA	MPFS250T-FCVG484	-	600MHz	4GB eMMC, 128MB QSPI	2GB	360 Pin	2.910" L x 1.650" W (74.00mm x 42.00mm)	0°C ~ 70°C
TE0820-05-2BI21MA MOD MPSOC 2GB DDR4 Trenz Electronic GmbH	4,690	-	RFQ	Datasheet	TE0820	Bulk	Discontinued at Digi-Key	MPU Core	ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0820-05-5DR21MA MOD MPSOC 2GB DDR4 Trenz Electronic GmbH	4,806	-	RFQ	Datasheet	TE0820	Bulk	Discontinued at Digi-Key	MPU Core	-	-	-	128MB	2GB	-	-	-
TE0820-05-2AE21MA MOD MPSOC ZU2CG-1E 2GB DDR4 IND Trenz Electronic GmbH	4,962	-	RFQ	Datasheet	TE0820	Bulk	Discontinued at Digi-Key	MPU Core	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0820-05-4AE21MA MOD MPSOC 2GB DDR4 Trenz Electronic GmbH	1,392	-	RFQ	Datasheet	TE0820	Bulk	Discontinued at Digi-Key	MPU Core	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0820-05-3BE21MA MOD MPSOC 2GB DDR4 Trenz Electronic GmbH	3,073	-	RFQ	Datasheet	TE0820	Bulk	Discontinued at Digi-Key	MPU Core	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0820-05-4DE21MA MOD MPSOC ZU4EV-1E 2GB DDR4 IND Trenz Electronic GmbH	2,192	-	RFQ	Datasheet	TE0820	Bulk	Discontinued at Digi-Key	MPU Core	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0820-05-2BE21MA MOD MPSOC 2GB DDR4 Trenz Electronic GmbH	4,742	-	RFQ	Datasheet	TE0820	Bulk	Discontinued at Digi-Key	MPU Core	ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0820-05-3AE21MA MOD MPSOC 2GB DDR4 Trenz Electronic GmbH	4,134	-	RFQ	Datasheet	TE0820	Bulk	Discontinued at Digi-Key	MPU Core	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0820-05-3BE21ML MOD MPSOC 2GB DDR4 Trenz Electronic GmbH	1,442	-	RFQ	Datasheet	TE0820	Bulk	Discontinued at Digi-Key	MPU Core	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0820-05-S002C1 MOD MPSOC 2GB DDR4 Trenz Electronic GmbH	1,811	-	RFQ	Datasheet	-	Bulk	Active	-	-	-	-	-	-	-	-	-
TE0820-05-2BE21MAJ MOD MPSOC 2GB DDR4 Trenz Electronic GmbH	3,728	-	RFQ	Datasheet	TE0820	Bulk	Discontinued at Digi-Key	MPU Core	ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0820-05-2BE21ML MOD MPSOC 2GB DDR4 Trenz Electronic GmbH	4,207	-	RFQ	Datasheet	TE0820	Bulk	Discontinued at Digi-Key	MPU Core	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C

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Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

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Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

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Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.