Microcontrollers, Microprocessor, FPGA Modules
Use the filters and product table below to compare Microcontrollers, Microprocessor, FPGA Modules components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.
If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Module/Board Type | Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
FORLINX-FET3568-C+202GSE16GCA10Rockchip RK3568SOM, 2GB DDR4, 16 |
1,199 | - |
|
Datasheet | - | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55 | - | 2.0GHz | 16GB eMMC | 2GB | Board-to-Board (BTB) | 1.770" L x 2.756" W (45.00mm x 70.00mm) | 0°C ~ 80°C |
|
FORLINX-FETT507-C+152GSE8GIA10Allwinner T507SOM, 2GB DDR3L, 8G |
4,092 | - |
|
Datasheet | - | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53 | - | 1.5GHz | 8GB eMMC | 2GB | Board-to-Board (BTB) Socket - 240 | 2.760" L x 1.570" W (70.00mm x 40.00mm) | -40°C ~ 85°C |
|
FORLINX-FET1012A-C+10512MOE01IA11NXP LS1012ASOM,512MB DDR3L 8GB e |
3,862 | - |
|
Datasheet | - | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53 | - | 1.0GHz | 8GB eMMC, 16Mb QSPI | 512MB | Board-to-Board (BTB) Socket - 160 | 1.770" L x 1.570" W (45.00mm x 40.00mm) | -40°C ~ 80°C |
|
FORLINX-FET6254-C+142GSE8GIB11TI AM6254SOM,2GB DDR4, 8GB eMMC |
2,036 | - |
|
Datasheet | - | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53, ARM® Cortex®-M4F | - | 1.4GHz | 8GB eMMC | 2GB | Board-to-Board (BTB) 4 x 80 Pin | 1.496" L x 2.360" W (38.00mm x 60.00mm) | -40°C ~ 85°C |
|
FORLINX-FETMX8MM-C+182GSE8GCA10NXP i.MX8M MiniSOM,2G DDR4,8GB e |
1,596 | - |
|
Datasheet | - | Tape & Box (TB) | Active | MPU | ARM Cortex-A53, ARM® Cortex®-M4F | - | 1.8GHz | 8GB eMMC | 2GB | Board-to-Board (BTB) Socket - 240 | 2.200" L x 1.417" W (56.00mm x 36.00mm) | 0°C ~ 70°C |
|
FORLINX-FET7110-C+154GSE32GCF11StarFive JH7110, SOM, 4GB LPDDR4 |
4,870 | - |
|
Datasheet | StarFive JH7110 | Tape & Box (TB) | Active | MPU | JH7110 Quad +RISC-V | - | 1.5GHz | 32GB eMMC | 4GB | Board-to-Board (BTB) 3 x 80 Pin | 2.360" L x 1.496" W (60.00mm x 38.00mm) | 0°C ~ 80°C |
|
FORLINX-FET-G2LD-C+122GOE16M16GIB11Renesas RZ/G2L (R9A07G044Lxx)SOM |
2,565 | - |
|
Datasheet | - | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55, ARM® Cortex®-M33 | - | 1.2GHz | 16GB eMMC,16MB (NOR) | 2GB | Board-to-Board (BTB) Socket - 240 | 1.496" L x 2.360" W (38.00mm x 60.00mm) | -40°C ~ 85°C |
|
FORLINX-FET527N-C+182GSE16GIA11Allwinner T527N, SOM, 2GB LPDDR4 |
1,216 | - |
|
Datasheet | Allwinner T527N | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55 8-Core | - | 1.8GHz | 16GB eMMC | 2GB | Board-to-Board (BTB) Socket - 4 x 80 | 2.756" L x 1.811" W (70.00mm x 46.00mm) | -40°C ~ 85°C |
|
FORLINX-FET3568J-C+182GSE16GIB10Rockchip RK3568SOM, 2GB DDR4, 16 |
1,382 | - |
|
Datasheet | - | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55 | - | 1.8GHz | 16GB eMMC | 2GB | Board-to-Board (BTB) 4 x 80 Pin | 1.770" L x 2.756" W (45.00mm x 70.00mm) | -40°C ~ 85°C |
|
FORLINX-FET3576-C+232GSE32GCA11Rockchip 35676, SOM, 2GB LPDDDR4 |
2,266 | - |
|
Datasheet | RK3576 | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53 Quad, ARM® Cortex®-A72 | - | 2.3GHz | 32GB eMMC | 2GB | Board-to-Board (BTB) Socket - 4 x 100 | 2.677" L x 1.969" W (68.00mm x 50.00mm) | 0°C ~ 80°C |
Microcontrollers, Microprocessor, FPGA Modules FAQ
Common questions about filtering, comparing and sourcing Microcontrollers, Microprocessor, FPGA Modules components.
How can I narrow the Microcontrollers, Microprocessor, FPGA Modules selection?
Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.
Should I confirm the datasheet before selecting a part?
Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.
Can Winsun (HK) Electronics help source a specific Microcontrollers, Microprocessor, FPGA Modules part number?
Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.
Do you support BOM, shortage or alternative-part requirements?
Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.
