System On Chip (SoC)
Use the filters and product table below to compare System On Chip (SoC) components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.
If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AGFB022R24C2I2VIC FPGA AGILEX-F 2340FBGA |
3,390 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
|
|
AGFB022R24C2I2VBIC FPGA AGILEX-F 2340BGA |
1,498 | - |
|
Datasheet | Agilex F | 2340-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2340-BGA (45x42) |
|
|
AGID023R31B2E3VIC FPGA AGILEX-I 3184FBGA |
4,323 | - |
|
Datasheet | Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
|
AGFA023R25A1I1VIC FPGA AGILEX-F 2581FBGA |
4,120 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
|
1SX280HU1F50E1VGIC FPGA STRATIX 10 2397FBGA |
2,632 | - |
|
Datasheet | Stratix® 10 SX | 2397-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2397-FBGA, FC (50x50) |
|
|
AGFB023R25A1I1VIC FPGA AGILEX-F 2581FBGA |
3,800 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
|
1SX250LH2F55E2LGIC SOC CORTEX-A53 1.5GHZ 2912BGA |
2,104 | - |
|
Datasheet | Stratix® 10 SX | 2912-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2912-FBGA, FC (55x55) |
|
|
1SX250LH3F55I2LGIC SOC CORTEX-A53 1.5GHZ 2912BGA |
2,122 | - |
|
Datasheet | Stratix® 10 SX | 2912-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2912-FBGA, FC (55x55) |
|
|
AGIB019R31B2I3EIC FPGA AGILEX-I 3184FBGA |
3,297 | - |
|
Datasheet | Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
|
AGIB019R31B2I2VIC FPGA AGILEX-I 3184FBGA |
1,120 | - |
|
Datasheet | Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
System On Chip (SoC) FAQ
Common questions about filtering, comparing and sourcing System On Chip (SoC) components.
How can I narrow the System On Chip (SoC) selection?
Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.
Should I confirm the datasheet before selecting a part?
Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.
Can Winsun (HK) Electronics help source a specific System On Chip (SoC) part number?
Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.
Do you support BOM, shortage or alternative-part requirements?
Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.
