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FILTERED PRODUCT SELECTION

System On Chip (SoC)

Use the filters and product table below to compare System On Chip (SoC) components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.

If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.

Parametric Selection Filter options by technical parameters
Stock & Datasheets Review availability and technical references
RFQ & BOM Support Send your target MPN, quantity or BOM
Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
AGIC035R39A2E3V Intel

AGIC035R39A2E3V

IC FPGA AGILEX-I 3948FBGA

Intel

1,908 -
Datasheet Agilex I 3948-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 3.54M Logic Elements 0°C ~ 100°C (TJ) - - 3948-BGA (56x56)
AGIB022R29A1E1VB Intel

AGIB022R29A1E1VB

IC FPGA AGILEX-I 2957BGA

Intel

4,903 -
Datasheet Agilex I 2957-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements 0°C ~ 100°C (TJ) - - 2957-BGA (56x45)
AGIB022R29A1E1V Intel

AGIB022R29A1E1V

AGIB022R29A1E1V

Intel

1,793 -
Datasheet Agilex I 2957-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements 0°C ~ 100°C (TJ) - - 2957-BGA (56x45)
AGIB041R31B2E2VB Intel

AGIB041R31B2E2VB

AGIB041R31B2E2VB

Intel

1,253 -
Datasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 4M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIB041R31B2E2VR0 Intel

AGIB041R31B2E2VR0

AGIB041R31B2E2VR0

Intel

3,888 -
Datasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 4M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIB023R31B1I1V Intel

AGIB023R31B1I1V

IC FPGA AGILEX-I 3184FBGA

Intel

2,683 -
Datasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIB023R31B1I1VB Intel

AGIB023R31B1I1VB

IC FPGA AGILEX-I 3184BGA

Intel

4,752 -
Datasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIA040R39A2E3V Intel

AGIA040R39A2E3V

IC FPGA AGILEX-I 3948FBGA

Intel

2,711 -
Datasheet Agilex I 3948-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 4.047M Logic Elements 0°C ~ 100°C (TJ) - - 3948-BGA (56x56)
AGIB027R31A1E2VB Intel

AGIB027R31A1E2VB

IC FPGA AGILEX-I 3184FBGA

Intel

2,299 -
Datasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIB027R31A2E1VB Intel

AGIB027R31A2E1VB

IC FPGA AGILEX-I 3184FBGA

Intel

2,363 -
Datasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
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WINSUN SOURCING SUPPORT

Need Help Sourcing System On Chip (SoC)?

Send the target part number, manufacturer, specifications and quantity. Winsun (HK) Electronics can assist with availability checks, quotation support, shortage sourcing and alternative-part options when appropriate.

Availability and lead-time support BOM, shortage and alternative sourcing
FREQUENTLY ASKED QUESTIONS

System On Chip (SoC) FAQ

Common questions about filtering, comparing and sourcing System On Chip (SoC) components.

How can I narrow the System On Chip (SoC) selection?

Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.

Should I confirm the datasheet before selecting a part?

Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.

Can Winsun (HK) Electronics help source a specific System On Chip (SoC) part number?

Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.

Do you support BOM, shortage or alternative-part requirements?

Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.