System On Chip (SoC)

Use the filters and product table below to compare System On Chip (SoC) components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.

If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.

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Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Package/Case	Packaging	Product Status	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Grade	Qualification	Supplier Device Package
AGIC041R29D2E2VR0 IC FPGA AGILEX-I 2957BGA Intel	3,138	-	RFQ	Datasheet	Agilex I	2957-BFBGA Exposed Pad	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 4M Logic Elements	0°C ~ 100°C (TJ)	-	-	2957-BGA (56x45)
AGID041R29D2E2VR1 AGID041R29D2E2VR1 Intel	4,213	-	RFQ	Datasheet	Agilex I	2957-BFBGA Exposed Pad	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 4M Logic Elements	0°C ~ 100°C (TJ)	-	-	2957-BGA (56x45)
AGIB041R31B1I2VB AGIB041R31B1I2VB Intel	2,653	-	RFQ	Datasheet	Agilex I	3184-BFBGA Exposed Pad	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 4M Logic Elements	-40°C ~ 100°C (TJ)	-	-	3184-BGA (56x45)
AGIB041R31B1I2VR0 AGIB041R31B1I2VR0 Intel	3,628	-	RFQ	Datasheet	Agilex I	3184-BFBGA Exposed Pad	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 4M Logic Elements	-40°C ~ 100°C (TJ)	-	-	3184-BGA (56x45)
AGIA040R39A1E1V AGIA040R39A1E1V Intel	1,180	-	RFQ	Datasheet	Agilex I	3948-BFBGA Exposed Pad	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 4.047M Logic Elements	0°C ~ 100°C (TJ)	-	-	3948-BGA (56x56)
AGIC041R31B1E2VB AGIC041R31B1E2VB Intel	2,015	-	RFQ	Datasheet	Agilex I	3184-BFBGA Exposed Pad	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 4M Logic Elements	0°C ~ 100°C (TJ)	-	-	3184-BGA (56x45)
AGID041R31B1E2VB AGID041R31B1E2VB Intel	1,537	-	RFQ	Datasheet	Agilex I	3184-BFBGA Exposed Pad	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 4M Logic Elements	0°C ~ 100°C (TJ)	-	-	3184-BGA (56x45)
AGIC035R39A2I3E IC FPGA AGILEX-I 3948FBGA Intel	4,640	-	RFQ	Datasheet	Agilex I	3948-BFBGA Exposed Pad	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 3.54M Logic Elements	-40°C ~ 100°C (TJ)	-	-	3948-BGA (56x56)
AGIC035R39A2I2VB IC FPGA AGILEX-I 3948FBGA Intel	1,591	-	RFQ	Datasheet	Agilex I	3948-BFBGA Exposed Pad	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 3.54M Logic Elements	-40°C ~ 100°C (TJ)	-	-	3948-BGA (56x56)
AGIB027R29A1I1VB IC FPGA AGILEX-I 2957BGA Intel	3,398	-	RFQ	Datasheet	Agilex I	2957-BFBGA Exposed Pad	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.7M Logic Elements	-40°C ~ 100°C (TJ)	-	-	2957-BGA (56x45)

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FREQUENTLY ASKED QUESTIONS

System On Chip (SoC) FAQ

Common questions about filtering, comparing and sourcing System On Chip (SoC) components.

How can I narrow the System On Chip (SoC) selection?

Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.

Should I confirm the datasheet before selecting a part?

Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.

Can Winsun (HK) Electronics help source a specific System On Chip (SoC) part number?

Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.

Do you support BOM, shortage or alternative-part requirements?

Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.