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System On Chip (SoC)

Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
AGFB008R24D1I3V Intel

AGFB008R24D1I3V

IC FPGA AGILEX-F 2340FBGA

Intel

3,847 -
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 764K Logic Elements -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB008R24D2I2V Intel

AGFB008R24D2I2V

IC FPGA AGILEX-F 2340FBGA

Intel

3,702 -
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 764K Logic Elements -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
1SX085HN2F43I1VG Intel

1SX085HN2F43I1VG

IC FPGA STRATIX 10 1760FBGA

Intel

1,968 -
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 850K Logic Elements -40°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX085HN1F43I2VG Intel

1SX085HN1F43I2VG

IC FPGA STRATIX 10 1760FBGA

Intel

1,736 -
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 850K Logic Elements -40°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
XCVM1802-1LSEVFVC1760 AMD

XCVM1802-1LSEVFVC1760

IC VERSAL AICORE FPGA 1760BGA

AMD

1,775 -
Datasheet Versal™ Prime 1760-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ Prime FPGA, 1.9M Logic Cells 0°C ~ 100°C (TJ) - - 1760-FCBGA (40x40)
1SX110HN2F43I2VG Intel

1SX110HN2F43I2VG

IC FPGA STRATIX 10 1760FBGA

Intel

2,668 -
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 1100K Logic Elements -40°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX110HN2F43I2VGAS Intel

1SX110HN2F43I2VGAS

IC FPGA STRATIX 10 1760FBGA

Intel

3,014 -
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 1100K Logic Elements -40°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
XCZU19EG-2FFVC1760I AMD

XCZU19EG-2FFVC1760I

IC SOC CORTEX-A53 1760FCBGA

AMD

2,068 -
Datasheet Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCZU19EG-2FFVE1924I AMD

XCZU19EG-2FFVE1924I

IC SOC CORTEX-A53 1924FCBGA

AMD

4,296 -
Datasheet Zynq® UltraScale+™ MPSoC EG 1924-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells -40°C ~ 100°C (TJ) - - 1924-FCBGA (45x45)
XCZU19EG-L2FFVC1760E AMD

XCZU19EG-L2FFVC1760E

IC SOC CORTEX-A53 1760FCBGA

AMD

2,280 -
Datasheet Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 0°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCVM1402-2HSINSVF1369 AMD

XCVM1402-2HSINSVF1369

IC VERSALPRIME ACAP FPGA 1369BGA

AMD

1,511 -
Datasheet Versal™ Prime 1369-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz, 1.65GHz Versal™ Prime FPGA, 1.2M Logic Cells -40°C ~ 100°C (TJ) - - 1369-BGA (35x35)
XCVM1402-2MLINSVF1369 AMD

XCVM1402-2MLINSVF1369

IC VERSALPRIME ACAP FPGA 1369BGA

AMD

3,715 -
Datasheet Versal™ Prime 1369-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ Prime FPGA, 1.2M Logic Cells -40°C ~ 100°C (TJ) - - 1369-BGA (35x35)
AGFA008R16A2I3V Intel

AGFA008R16A2I3V

IC FPGA AGILEX-F 1546FBGA

Intel

1,042 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 764K Logic Elements -40°C ~ 100°C (TJ) - - -
AGFB008R16A2I3V Intel

AGFB008R16A2I3V

IC FPGA AGILEX-F 1546FBGA

Intel

1,066 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 764K Logic Elements -40°C ~ 100°C (TJ) - - -
XCVM1502-2MSIVFVC1760 AMD

XCVM1502-2MSIVFVC1760

IC VERSALPRIME ACAP FPGA 1760BGA

AMD

1,205 -
Datasheet Versal™ Prime 1760-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ Prime FPGA, 1M Logic Cells -40°C ~ 110°C (TJ) - - 1760-FCBGA (40x40)
XCZU17EG-2FFVD1760I AMD

XCZU17EG-2FFVD1760I

IC SOC CORTEX-A53 1760FCBGA

AMD

1,827 -
Datasheet Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 926K+ Logic Cells -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
AGFA014R24B2E3V Intel

AGFA014R24B2E3V

IC FPGA AGILEX-F 2486FBGA

Intel

4,519 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.4M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA014R24B2E4F Intel

AGFA014R24B2E4F

IC FPGA AGILEX-F 2486FBGA

Intel

4,115 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.4M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA014R24B3I3E Intel

AGFA014R24B3I3E

IC FPGA AGILEX-F 2486FBGA

Intel

2,020 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.4M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFA006R24C2E1V Intel

AGFA006R24C2E1V

IC FPGA AGILEX-F 2340FBGA

Intel

4,755 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 573K Logic Elements 0°C ~ 100°C (TJ) - - -
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FREQUENTLY ASKED QUESTIONS

System On Chip (SoC) FAQ

Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.

What should I check when selecting System On Chip (SoC) components?

Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

Can Winsun help source specific System On Chip (SoC) part numbers?

Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

Do you support shortage, obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

How do I request a quote for System On Chip (SoC) components?

Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.