System On Chip (SoC)
Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.
For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1SX280HN3F43E3VGIC FPGA STRATIX 10 1760FBGA |
2,529 | - |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
|
1SX280LN3F43E3VGS1IC SOC CORTEX-A53 1.5GHZ 1760BGA |
1,274 | - |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 1760-FBGA, FC (42.5x42.5) |
|
|
1SX280HN3F43E3VGS3IC FPGA STRATIX 10 1760FBGA |
1,780 | - |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
|
|
1SX280LN3F43E3VGS2IC FPGA STRATIX 10 1760FBGA |
4,080 | - |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
|
|
1SX085HN1F43I1VGIC FPGA STRATIX 10 1760FBGA |
2,061 | - |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 850K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
|
XCVM1502-2MLINFVB1369IC VERSALPRIME ACAP FPGA 1369BGA |
1,067 | - |
|
Datasheet | Versal™ Prime | 1369-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ Prime FPGA, 1M Logic Cells | -40°C ~ 110°C (TJ) | - | - | 1369-FCBGA (35x35) |
|
|
1SX110HN1F43I2VGASIC FPGA STRATIX 10 1760FBGA |
2,149 | - |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 1100K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
|
|
1SX110HN1F43I2VGIC FPGA STRATIX 10 1760FBGA |
2,548 | - |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 1100K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
|
|
1SX110HN2F43I1VGIC FPGA STRATIX 10 1760FBGA |
1,292 | - |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 1100K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
|
|
AGFA008R24C3E4XIC FPGA AGILEX-F 2340FBGA |
1,819 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
|
|
AGFB008R24C3E4XIC FPGA AGILEX-F 2340FBGA |
4,217 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
|
|
AGFA008R16A2I2VIC FPGA AGILEX-F 1546FBGA |
2,627 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
|
|
AGFA008R16A2I3EIC FPGA AGILEX-F 1546FBGA |
3,487 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
|
|
AGFA008R16A2I2VBIC FPGA AGILEX-F 1546BGA |
4,552 | - |
|
Datasheet | Agilex F | 1546-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1546-BGA (37.5x34) |
|
|
AGFB008R16A2I2VIC FPGA AGILEX-F 1546FBGA |
3,302 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
|
|
AGFB008R16A2I3EIC FPGA AGILEX-F 1546FBGA |
1,852 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
|
|
AGFB008R16A2I2VBIC FPGA AGILEX-F 1546BGA |
2,356 | - |
|
Datasheet | Agilex F | 1546-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1546-BGA (37.5x34) |
|
1SX210HU3F50E3VGIC FPGA STRATIX 10 2397FBGA |
1,225 | - |
|
Datasheet | Stratix® 10 SX | 2397-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2100K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2397-FBGA, FC (50x50) |
|
|
XCVM2202-2HSINSVH1369XCVM2202-2HSINSVH1369 |
2,056 | - |
|
Datasheet | - | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
AGFA019R31C3E3VIC FPGA AGILEX-F 3184FBGA |
1,608 | - |
|
Datasheet | Agilex F | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
System On Chip (SoC) FAQ
Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.
What should I check when selecting System On Chip (SoC) components?
Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.
Can Winsun help source specific System On Chip (SoC) part numbers?
Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.
Do you support shortage, obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.
How do I request a quote for System On Chip (SoC) components?
Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.
