System On Chip (SoC)
Use the filters and product table below to compare System On Chip (SoC) components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.
If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XCVM1402-2LSEVFVC1596IC VERSALPRIME ACAP FPGA 1596BGA |
4,115 | - |
|
Datasheet | Versal™ Prime | 1596-BFBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ Prime FPGA, 1.2M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1596-BGA (37.5x37.5) |
|
XCVM1402-2MLIVSVD1760IC VERSALPRIME ACAP FPGA 1760BGA |
2,139 | - |
|
Datasheet | Versal™ Prime | 1760-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ Prime FPGA, 1.2M Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1760-FCBGA (40x40) |
|
XC7Z012S-1CLG485IIC SOC CORTEX-A9 667MHZ 485CSBGA |
1,227 | - |
|
Datasheet | Zynq®-7000 | 485-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix™-7 FPGA, 55K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 485-CSPBGA (19x19) |
|
XC7Z014S-2CLG400IIC SOC CORTEX-A9 766MHZ 400BGA |
4,521 | - |
|
Datasheet | Zynq®-7000 | 400-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 766MHz | Artix™-7 FPGA, 65K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 400-CSPBGA (17x17) |
|
|
XC7Z020-L1CLG484IIC SOC CORTEX-A9 667MHZ 484BGA |
1,349 | - |
|
Datasheet | Zynq®-7000 | 484-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix™-7 FPGA, 85K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 484-CSPBGA (19x19) |
|
XCZU3EG-1SFVC784EIC SOC CORTEX-A53 784FCBGA |
3,573 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
XC7Z030-3FFG676EIC SOC CORTEX-A9 1GHZ 676FCBGA |
2,205 | - |
|
Datasheet | Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1GHz | Kintex™-7 FPGA, 125K Logic Cells | 0°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
|
XC7Z045-1FFG900IIC SOC CORTEX-A9 667MHZ 900FCBGA |
1,700 | - |
|
Datasheet | Zynq®-7000 | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 350K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
|
XCZU17EG-2FFVC1760EIC SOC CORTEX-A53 1760FCBGA |
3,141 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1760-FCBGA (42.5x42.5) |
|
XAZU2EG-1SFVA625IIC SOC CORTEX-A53 625FCBGA |
1,367 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 625-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 1.2MB | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
System On Chip (SoC) FAQ
Common questions about filtering, comparing and sourcing System On Chip (SoC) components.
How can I narrow the System On Chip (SoC) selection?
Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.
Should I confirm the datasheet before selecting a part?
Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.
Can Winsun (HK) Electronics help source a specific System On Chip (SoC) part number?
Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.
Do you support BOM, shortage or alternative-part requirements?
Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.
