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FILTERED PRODUCT SELECTION

System On Chip (SoC)

Use the filters and product table below to compare System On Chip (SoC) components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.

If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.

Parametric Selection Filter options by technical parameters
Stock & Datasheets Review availability and technical references
RFQ & BOM Support Send your target MPN, quantity or BOM
Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
XCVC1702-2HSIVSVA1596 AMD

XCVC1702-2HSIVSVA1596

XCVC1702-2HSIVSVA1596

AMD

4,533 -
Datasheet Virtex® UltraScale+™ 1596-BFBGA, FCBGA Bulk Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz, 1.65GHz Versal™ AI Core FPGA, 1M Logic Cells -40°C ~ 110°C (TJ) - - 1596-FCBGA (37.5x37.5)
XCZU47DR-L2FFVG1517I AMD

XCZU47DR-L2FFVG1517I

IC ZUP RFSOC A53 FPGA LP 1517BGA

AMD

1,325 -
Datasheet Zynq® UltraScale+™ RFSoC 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCZU47DR-L2FSVG1517I AMD

XCZU47DR-L2FSVG1517I

IC ZUP RFSOC A53 FPGA LP 1517BGA

AMD

2,683 -
Datasheet Zynq® UltraScale+™ RFSoC 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCZU43DR-L2FSVG1517I AMD

XCZU43DR-L2FSVG1517I

IC ZUP RFSOC A53 FPGA LP 1517BGA

AMD

4,438 -
Datasheet Zynq® UltraScale+™ RFSoC 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCZU43DR-L2FFVG1517I AMD

XCZU43DR-L2FFVG1517I

IC ZUP RFSOC A53 FPGA LP 1517BGA

AMD

1,142 -
Datasheet Zynq® UltraScale+™ RFSoC 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCZU46DR-2FSVH1760I AMD

XCZU46DR-2FSVH1760I

IC ZUP RFSOC A53 FPGA 1760BGA

AMD

2,742 -
Datasheet Zynq® UltraScale+™ RFSoC 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCZU46DR-2FFVH1760I AMD

XCZU46DR-2FFVH1760I

IC ZUP RFSOC A53 FPGA 1760BGA

AMD

2,513 -
Datasheet Zynq® UltraScale+™ RFSoC 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCVP1402-2LLEVSVA3340 AMD

XCVP1402-2LLEVSVA3340

IC VERSAL PREM ACAP FPGA 3340BGA

AMD

4,519 -
Datasheet Versal® Premium 3340-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 450MHz, 1.08GHz Versal™ Premium FPGA, 2.2M Logic Cells 0°C ~ 110°C (TJ) - - 3340-FCBGA (55x55)
XCVP1402-1LLIVSVA3340 AMD

XCVP1402-1LLIVSVA3340

IC VERSAL PREM ACAP FPGA 3340BGA

AMD

3,936 -
Datasheet Versal® Premium 3340-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ Premium FPGA, 2.2M Logic Cells -40°C ~ 110°C (TJ) - - 3340-FCBGA (55x55)
XCVC1902-1LSIVSVA2197 AMD

XCVC1902-1LSIVSVA2197

IC VERSAL AICORE FPGA 2197BGA

AMD

4,812 -
Datasheet Versal™ AI Core 2197-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ AI Core FPGA, 1.9M Logic Cells -40°C ~ 100°C (TJ) - - 2197-FCBGA (45x45)
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WINSUN SOURCING SUPPORT

Need Help Sourcing System On Chip (SoC)?

Send the target part number, manufacturer, specifications and quantity. Winsun (HK) Electronics can assist with availability checks, quotation support, shortage sourcing and alternative-part options when appropriate.

Availability and lead-time support BOM, shortage and alternative sourcing
FREQUENTLY ASKED QUESTIONS

System On Chip (SoC) FAQ

Common questions about filtering, comparing and sourcing System On Chip (SoC) components.

How can I narrow the System On Chip (SoC) selection?

Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.

Should I confirm the datasheet before selecting a part?

Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.

Can Winsun (HK) Electronics help source a specific System On Chip (SoC) part number?

Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.

Do you support BOM, shortage or alternative-part requirements?

Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.