System On Chip (SoC)
Use the filters and product table below to compare System On Chip (SoC) components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.
If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XCZU5CG-L2FBVB900EIC SOC CORTEX-A53 900FCBGA |
1,073 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
|
XCZU6CG-1FFVB1156IIC SOC CORTEX-A53 1156FCBGA |
4,477 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 1156-BBGA, FCBGA | Bulk | Active | MCU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
|
XCZU7EV-1FFVF1517EIC SOC CORTEX-A53 1517FCBGA |
2,734 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EV | 1517-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1517-FCBGA (40x40) |
|
XCVM1302-1MSENSVF1369IC VERSALPRIME ACAP FPGA 1369BGA |
1,956 | - |
|
Datasheet | Versal™ Prime | 1369-BFBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ Prime FPGA, 70k Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1369-BGA (35x35) |
|
|
XC7Z045-3FFG900EIC SOC CORTEX-A9 1GHZ 900FCBGA |
2,022 | - |
|
Datasheet | Zynq®-7000 | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1GHz | Kintex™-7 FPGA, 350K Logic Cells | 0°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
|
|
XC7Z045-L2FFG900IIC SOC CORTEX-A9 800MHZ 900FCBGA |
4,840 | - |
|
Datasheet | Zynq®-7000 | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 350K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
|
XCVM1302-1MSEVFVC1596IC VERSALPRIME ACAP FPGA 1596BGA |
1,133 | - |
|
Datasheet | Versal™ Prime | 1596-BFBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ Prime FPGA, 70k Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1596-BGA (37.5x37.5) |
|
XCZU7EG-1FBVB900IIC SOC CORTEX-A53 900FCBGA |
2,146 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
|
|
XCZU5EV-2FBVB900EIC SOC CORTEX-A53 900FCBGA |
2,332 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EV | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
|
|
XCZU5EV-L1FBVB900IIC SOC CORTEX-A53 900FCBGA |
4,221 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EV | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
System On Chip (SoC) FAQ
Common questions about filtering, comparing and sourcing System On Chip (SoC) components.
How can I narrow the System On Chip (SoC) selection?
Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.
Should I confirm the datasheet before selecting a part?
Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.
Can Winsun (HK) Electronics help source a specific System On Chip (SoC) part number?
Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.
Do you support BOM, shortage or alternative-part requirements?
Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.
