System On Chip (SoC)

Use the filters and product table below to compare System On Chip (SoC) components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.

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Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Package/Case	Packaging	Product Status	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Grade	Qualification	Supplier Device Package
XCVM1502-2MSINFVB1369 IC VERSALPRIME ACAP FPGA 1369BGA AMD	2,182	-	RFQ	Datasheet	Versal™ Prime	1369-BFBGA, FCBGA	Tray	Active	MPU, FPGA	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.4GHz	Versal™ Prime FPGA, 1M Logic Cells	-40°C ~ 110°C (TJ)	-	-	1369-FCBGA (35x35)
XCZU19EG-2FFVD1760E IC SOC CORTEX-A53 1760FCBGA AMD	1,448	-	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EG	1760-BBGA, FCBGA	Tray	Active	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 600MHz, 1.3GHz	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	0°C ~ 100°C (TJ)	-	-	1760-FCBGA (42.5x42.5)
XCZU11EG-3FFVC1760E IC SOC CORTEX-A53 1760FCBGA AMD	1,084	-	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EG	1760-BBGA, FCBGA	Tray	Active	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 667MHz, 1.5GHz	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	0°C ~ 100°C (TJ)	-	-	1760-FCBGA (42.5x42.5)
XCVM1402-2LLEVFVC1596 IC VERSALPRIME ACAP FPGA 1596BGA AMD	3,406	-	RFQ	Datasheet	Versal™ Prime	1596-BFBGA	Tray	Active	MPU, FPGA	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	450MHz, 1.08GHz	Versal™ Prime FPGA, 1.2M Logic Cells	0°C ~ 100°C (TJ)	-	-	1596-BGA (37.5x37.5)
XCVM1402-1LLIVFVC1596 IC VERSALPRIME ACAP FPGA 1596BGA AMD	4,779	-	RFQ	Datasheet	Versal™ Prime	1596-BFBGA	Tray	Active	MPU, FPGA	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	400MHz, 1GHz	Versal™ Prime FPGA, 1.2M Logic Cells	-40°C ~ 100°C (TJ)	-	-	1596-BGA (37.5x37.5)
XCVM1802-1LSEVFVC1760 IC VERSAL AICORE FPGA 1760BGA AMD	1,775	-	RFQ	Datasheet	Versal™ Prime	1760-BFBGA, FCBGA	Tray	Active	MPU, FPGA	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	400MHz, 1GHz	Versal™ Prime FPGA, 1.9M Logic Cells	0°C ~ 100°C (TJ)	-	-	1760-FCBGA (40x40)
XCZU19EG-2FFVC1760I IC SOC CORTEX-A53 1760FCBGA AMD	2,068	-	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EG	1760-BBGA, FCBGA	Tray	Active	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 600MHz, 1.3GHz	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	-40°C ~ 100°C (TJ)	-	-	1760-FCBGA (42.5x42.5)
XCZU19EG-2FFVE1924I IC SOC CORTEX-A53 1924FCBGA AMD	4,296	-	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EG	1924-BBGA, FCBGA	Tray	Active	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 600MHz, 1.3GHz	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	-40°C ~ 100°C (TJ)	-	-	1924-FCBGA (45x45)
XCZU19EG-L2FFVC1760E IC SOC CORTEX-A53 1760FCBGA AMD	2,280	-	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EG	1760-BBGA, FCBGA	Tray	Active	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 600MHz, 1.3GHz	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	0°C ~ 100°C (TJ)	-	-	1760-FCBGA (42.5x42.5)
XCVM1402-2HSINSVF1369 IC VERSALPRIME ACAP FPGA 1369BGA AMD	1,511	-	RFQ	Datasheet	Versal™ Prime	1369-BFBGA	Tray	Active	MPU, FPGA	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz, 1.65GHz	Versal™ Prime FPGA, 1.2M Logic Cells	-40°C ~ 100°C (TJ)	-	-	1369-BGA (35x35)

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FREQUENTLY ASKED QUESTIONS

System On Chip (SoC) FAQ

Common questions about filtering, comparing and sourcing System On Chip (SoC) components.

How can I narrow the System On Chip (SoC) selection?

Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.

Should I confirm the datasheet before selecting a part?

Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.

Can Winsun (HK) Electronics help source a specific System On Chip (SoC) part number?

Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.

Do you support BOM, shortage or alternative-part requirements?

Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.