System On Chip (SoC)
Use the filters and product table below to compare System On Chip (SoC) components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.
If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XCVP1502-1MSEVSVA3340IC VERSAL PREM ACAP FPGA 3340BGA |
3,167 | - |
|
Datasheet | Versal® Premium | 3340-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ Premium FPGA, 3.7M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 3340-FCBGA (55x55) |
|
XCZU48DR-1FFVE1156IIC ZUP RFSOC A53 FPGA 1156BGA |
2,335 | - |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
|
XCZU48DR-1FSVE1156IIC ZUP RFSOC A53 FPGA 1156BGA |
1,797 | - |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
|
XCVE2602-2HSINSVH1369XCVE2602-2HSINSVH1369 |
2,501 | - |
|
Datasheet | - | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
XCVC1702-2LSENSVG1369IC VERSAL AI-CORE FPGA 1369BGA |
1,037 | - |
|
Datasheet | Versal™ AI Core | 1369-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 450MHz, 1.08GHz | Versal™ AI Core FPGA, 1M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1369-FCBGA (35x35) |
|
|
XCVC1702-1LSINSVG1369IC VERSAL AI-CORE FPGA 1369BGA |
1,139 | - |
|
Datasheet | Versal™ AI Core | 1369-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ AI Core FPGA, 1M Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1369-FCBGA (35x35) |
|
|
XCVC1702-1MLINSVG1369IC VERSAL AI-CORE FPGA 1369BGA |
1,583 | - |
|
Datasheet | Versal™ AI Core | 1369-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ AI Core FPGA, 1M Logic Cells | -40°C ~ 110°C (TJ) | - | - | 1369-FCBGA (35x35) |
|
|
XCVC1702-2MLENSVG1369IC VERSAL AI-CORE FPGA 1369BGA |
3,501 | - |
|
Datasheet | Versal™ AI Core | 1369-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ AI Core FPGA, 1M Logic Cells | 0°C ~ 110°C (TJ) | - | - | 1369-FCBGA (35x35) |
|
|
XCZU43DR-2FSVE1156IIC ZUP RFSOC A53 FPGA 1156BGA |
2,575 | - |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
|
|
XCZU47DR-2FFVE1156IIC ZUP RFSOC A53 FPGA 1156BGA |
3,202 | - |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
System On Chip (SoC) FAQ
Common questions about filtering, comparing and sourcing System On Chip (SoC) components.
How can I narrow the System On Chip (SoC) selection?
Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.
Should I confirm the datasheet before selecting a part?
Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.
Can Winsun (HK) Electronics help source a specific System On Chip (SoC) part number?
Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.
Do you support BOM, shortage or alternative-part requirements?
Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.
