System On Chip (SoC)
Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.
For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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AGFB019R24C3I3EIC FPGA AGILEX-F 2340BGA |
3,590 | - |
|
Datasheet | Agilex F | 2340-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2340-BGA (45x42) |
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XCVE1752-1MSEVSVA1596IC VERSAL AI-CORE FPGA 1596BGA |
1,195 | - |
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Datasheet | Versal™ AI Core | 1596-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ AI Edge FPGA, 1M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1596-FCBGA (37.5x37.5) |
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AGFA012R24C2I3VIC FPGA AGILEX-F 2340FBGA |
2,208 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.2M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
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AGFB012R24C2I3VIC FPGA AGILEX-F 2340FBGA |
2,454 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.2M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
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AGFB014R24D1I3VIC FPGA AGILEX-F 2340FBGA |
4,645 | - |
|
Datasheet | Agilex F | 2340-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.4M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2340-BGA (45x42) |
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XCZU47DR-1FSVE1156EIC ZUP RFSOC A53 FPGA 1156BGA |
2,866 | - |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
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XCZU43DR-1FSVE1156EIC ZUP RFSOC A53 FPGA 1156BGA |
3,396 | - |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
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XCZU43DR-1FFVE1156EIC ZUP RFSOC A53 FPGA 1156BGA |
3,383 | - |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
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XCZU47DR-1FFVE1156EIC ZUP RFSOC A53 FPGA 1156BGA |
1,728 | - |
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Datasheet | Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
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XCVM1802-2LLEVSVD1760IC VERSAL AICORE FPGA 1760BGA |
1,491 | - |
|
Datasheet | Versal™ Prime | 1760-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 450MHz, 1.08GHz | Versal™ Prime FPGA, 1.9M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1760-FCBGA (40x40) |
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XCVM1802-1LLIVSVD1760IC VERSAL AICORE FPGA 1760BGA |
1,271 | - |
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Datasheet | Versal™ Prime | 1760-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ Prime FPGA, 1.9M Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1760-FCBGA (40x40) |
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AGFA019R25A2I3VIC FPGA AGILEX-F 2581FBGA |
4,881 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
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1SX165HN1F43I2VGIC FPGA STRATIX 10 1760FBGA |
3,592 | - |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 1650K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
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AGFB019R25A2I3VIC FPGA AGILEX-F 2581FBGA |
2,319 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
|
XCVM1802-2MLIVFVC1760IC VERSAL AICORE FPGA 1760BGA |
3,817 | - |
|
Datasheet | Versal™ Prime | 1760-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ Prime FPGA, 1.9M Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1760-FCBGA (40x40) |
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XCVM1802-2HSIVFVC1760IC VERSALPRIME ACAP FPGA 1760BGA |
3,132 | - |
|
Datasheet | Versal™ Prime | 1760-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz, 1.65GHz | Versal™ Prime FPGA, 1.9M Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1760-FCBGA (40x40) |
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1SX250HH3F55E2LGIC FPGA STRATIX 10 2912FBGA |
3,208 | - |
|
Datasheet | Stratix® 10 SX | 2912-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2912-FBGA, FC (55x55) |
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AGFA027R25A3E3EIC FPGA AGILEX-F 2581FBGA |
1,644 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
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AGFB027R25A3E3EIC FPGA AGILEX-F 2581FBGA |
1,596 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
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1SX250LN3F43E2LGIC SOC CORTEX-A53 1.5GHZ 1760BGA |
2,048 | - |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 1760-FBGA, FC (42.5x42.5) |
System On Chip (SoC) FAQ
Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.
What should I check when selecting System On Chip (SoC) components?
Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.
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Do you support shortage, obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.
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Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.
