System On Chip (SoC)

Use the filters and product table below to compare System On Chip (SoC) components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.

If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.

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Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Package/Case	Packaging	Product Status	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Grade	Qualification	Supplier Device Package
M2S060TS-1FGG676 IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	2,375	-	RFQ	Datasheet	SmartFusion®2	676-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	0°C ~ 85°C (TJ)	-	-	676-FBGA (27x27)
M2S060TS-FG676I IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	3,097	-	RFQ	Datasheet	SmartFusion®2	676-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	-40°C ~ 100°C (TJ)	-	-	676-FBGA (27x27)
M2S060TS-FGG676I IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	3,363	-	RFQ	Datasheet	SmartFusion®2	676-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	-40°C ~ 100°C (TJ)	-	-	676-FBGA (27x27)
M2S090T-1FCSG325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	2,522	-	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x13.5)
M2S090T-FCSG325I IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	1,524	-	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-40°C ~ 100°C (TJ)	-	-	325-FCBGA (11x13.5)
M2S090TS-FCSG325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	3,054	-	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x13.5)
M2S090T-1FCS325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	1,696	-	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x13.5)
M2S090TS-FCS325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	2,320	-	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x13.5)
M2S050-1FG896I IC SOC CORTEX-M3 166MHZ 896FBGA Microchip Technology	2,898	-	RFQ	Datasheet	SmartFusion®2	896-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 50K Logic Modules	-40°C ~ 100°C (TJ)	-	-	896-FBGA (31x31)
M2S050-1FGG896I IC SOC CORTEX-M3 166MHZ 896FBGA Microchip Technology	2,575	-	RFQ	Datasheet	SmartFusion®2	896-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 50K Logic Modules	-40°C ~ 100°C (TJ)	-	-	896-FBGA (31x31)

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Send the target part number, manufacturer, specifications and quantity. Winsun (HK) Electronics can assist with availability checks, quotation support, shortage sourcing and alternative-part options when appropriate.

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FREQUENTLY ASKED QUESTIONS

System On Chip (SoC) FAQ

Common questions about filtering, comparing and sourcing System On Chip (SoC) components.

How can I narrow the System On Chip (SoC) selection?

Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.

Should I confirm the datasheet before selecting a part?

Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.

Can Winsun (HK) Electronics help source a specific System On Chip (SoC) part number?

Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.

Do you support BOM, shortage or alternative-part requirements?

Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.