System On Chip (SoC)
Use the filters and product table below to compare System On Chip (SoC) components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.
If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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A2F200M3F-1FGG256IIC SOC CORTEX-M3 100MHZ 256FBGA |
4,679 | - |
|
Datasheet | SmartFusion® | 256-LBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 100MHz | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | -40°C ~ 100°C (TJ) | - | - | 256-FPBGA (17x17) |
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A2F500M3G-FGG256IIC SOC CORTEX-M3 80MHZ 256FBGA |
4,031 | - |
|
Datasheet | SmartFusion® | 256-LBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 80MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | -40°C ~ 100°C (TJ) | - | - | 256-FPBGA (17x17) |
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A2F500M3G-FG256IIC SOC CORTEX-M3 80MHZ 256FBGA |
1,120 | - |
|
Datasheet | SmartFusion® | 256-LBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 80MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | -40°C ~ 100°C (TJ) | - | - | 256-FPBGA (17x17) |
|
|
A2F500M3G-1FG256IIC SOC CORTEX-M3 100MHZ 256FBGA |
4,505 | - |
|
Datasheet | SmartFusion® | 256-LBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 100MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | -40°C ~ 100°C (TJ) | - | - | 256-FPBGA (17x17) |
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A2F200M3F-1FG256IIC SOC CORTEX-M3 100MHZ 256FBGA |
2,165 | - |
|
Datasheet | SmartFusion® | 256-LBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 100MHz | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | -40°C ~ 100°C (TJ) | - | - | 256-FPBGA (17x17) |
|
A2F500M3G-1CS288IIC SOC CORTEX-M3 100MHZ 288CSP |
4,311 | - |
|
Datasheet | SmartFusion® | 288-TFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 100MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | -40°C ~ 100°C (TJ) | - | - | 288-CSP (11x11) |
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A2F500M3G-CSG288IIC SOC CORTEX-M3 80MHZ 288CSP |
2,062 | - |
|
Datasheet | SmartFusion® | 288-TFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 80MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | -40°C ~ 100°C (TJ) | - | - | 288-CSP (11x11) |
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A2F200M3F-CSG288IC SOC CORTEX-M3 80MHZ 288CSP |
4,377 | - |
|
Datasheet | SmartFusion® | 288-TFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 80MHz | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 0°C ~ 85°C (TJ) | - | - | 288-CSP (11x11) |
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A2F200M3F-CS288IC SOC CORTEX-M3 80MHZ 288CSP |
2,700 | - |
|
Datasheet | SmartFusion® | 288-TFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 80MHz | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 0°C ~ 85°C (TJ) | - | - | 288-CSP (11x11) |
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A2F200M3F-1CSG288IIC SOC CORTEX-M3 100MHZ 288CSP |
3,370 | - |
|
Datasheet | SmartFusion® | 288-TFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 100MHz | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | -40°C ~ 100°C (TJ) | - | - | 288-CSP (11x11) |
System On Chip (SoC) FAQ
Common questions about filtering, comparing and sourcing System On Chip (SoC) components.
How can I narrow the System On Chip (SoC) selection?
Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.
Should I confirm the datasheet before selecting a part?
Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.
Can Winsun (HK) Electronics help source a specific System On Chip (SoC) part number?
Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.
Do you support BOM, shortage or alternative-part requirements?
Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.
