System On Chip (SoC)
Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.
For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1SX165HU1F50I2VGIC FPGA STRATIX 10 2397FBGA |
3,266 | - |
|
Datasheet | Stratix® 10 SX | 2397-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 1650K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2397-FBGA, FC (50x50) |
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AGFC023R25A2I3VIC FPGA AGILEX-F 2581FBGA |
1,475 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
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AGIB027R31A3E3VIC FPGA AGILEX-I 3184BGA |
4,576 | - |
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Datasheet | Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
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AGFC023R24C3I3EIC FPGA AGILEX-F 2340BGA |
1,454 | - |
|
Datasheet | Agilex F | 2340-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2340-BGA (45x42) |
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AGFC023R24C2E3VIC FPGA AGILEX-F 2340BGA |
4,545 | - |
|
Datasheet | Agilex F | 2340-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2340-BGA (45x42) |
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AGFD023R25A2I3VIC FPGA AGILEX-F 2581FBGA |
1,364 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
|
1SX280HH2F55I2VGIC FPGA STRATIX 10 2912FBGA |
4,184 | - |
|
Datasheet | Stratix® 10 SX | 2912-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2912-FBGA, FC (55x55) |
|
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1SX250HH3F55I3XGIC FPGA STRATIX 10 2912FBGA |
3,827 | - |
|
Datasheet | Stratix® 10 SX | 2912-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2912-FBGA, FC (55x55) |
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XCVE1752-1LSEVSVA2197IC VERSAL AI-EDGE FPGA 2197BGA |
1,585 | - |
|
Datasheet | Versal™ AI Core | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ AI Core FPGA, 1M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 2197-FCBGA (45x45) |
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AGFD023R24C2E3VIC FPGA AGILEX-F 2340BGA |
3,444 | - |
|
Datasheet | Agilex F | 2340-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2340-BGA (45x42) |
|
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AGFD023R24C3I3EIC FPGA AGILEX-F 2340BGA |
3,465 | - |
|
Datasheet | Agilex F | 2340-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2340-BGA (45x42) |
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XCZU67DR-L1FSVE1156IIC ZUP RFSOC A53 FPGA LP 1156BGA |
1,993 | - |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | - | - | 500MHz, 1.2GHz | Zynq® UltraScale+™ RFSoC | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
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XCZU67DR-L1FFVE1156IIC ZUP RFSOC A53 FPGA LP 1156BGA |
2,570 | - |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | - | - | 500MHz, 1.2GHz | Zynq® UltraScale+™ RFSoC | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
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1SX280LH3F55E2VGIC SOC CORTEX-A53 1.5GHZ 2912BGA |
1,874 | - |
|
Datasheet | Stratix® 10 SX | 2912-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2912-FBGA, FC (55x55) |
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1SX280LH3F55I3VGIC SOC CORTEX-A53 1.5GHZ 2912BGA |
4,661 | - |
|
Datasheet | Stratix® 10 SX | 2912-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2912-FBGA, FC (55x55) |
|
XCVC1802-1MSEVSVD1760IC VERSAL AICORE FPGA 1760BGA |
4,681 | - |
|
Datasheet | Versal™ AI Core | 1760-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ AI Core FPGA, 1.5M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1760-FCBGA (40x40) |
|
1SX280LN2F43I2VGIC SOC CORTEX-A53 1.5GHZ 1760BGA |
4,422 | - |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1760-FBGA, FC (42.5x42.5) |
|
1SX280HN2F43I2VGIC FPGA STRATIX 10 1760FBGA |
3,068 | - |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
|
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1SX280LN2F43I2VGASIC FPGA STRATIX 10 1760FBGA |
1,073 | - |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
|
|
1SX280HN2F43I2VGASIC FPGA STRATIX 10 1760FBGA |
3,164 | - |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
System On Chip (SoC) FAQ
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Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.
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Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.
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Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.
