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System On Chip (SoC)

Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
AGFB027R25A1E1V Intel

AGFB027R25A1E1V

IC FPGA AGILEX-F 2581FBGA

Intel

2,062 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGID019R31B2I3V Intel

AGID019R31B2I3V

IC FPGA AGILEX-I 3184FBGA

Intel

1,550 -
Datasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIB019R18A2I1V Intel

AGIB019R18A2I1V

IC FPGA AGILEX-I 1805FBGA

Intel

4,564 -
Datasheet Agilex I 1805-BBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - 1805-BGA (42.5x42.5)
AGIB019R18A1I2V Intel

AGIB019R18A1I2V

IC FPGA AGILEX-I 1805FBGA

Intel

1,172 -
Datasheet Agilex I 1805-BBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - 1805-BGA (42.5x42.5)
AGIB022R31B2I3V Intel

AGIB022R31B2I3V

IC FPGA AGILEX-I 3184FBGA

Intel

3,167 -
Datasheet Agilex I - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFA019R31C2I1V Intel

AGFA019R31C2I1V

IC FPGA AGILEX-F 3184FBGA

Intel

3,320 -
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFA019R31C2I1VB Intel

AGFA019R31C2I1VB

IC FPGA AGILEX-F 3184BGA

Intel

2,101 -
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFB019R31C2I1V Intel

AGFB019R31C2I1V

IC FPGA AGILEX-F 3184FBGA

Intel

3,545 -
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFB019R31C2I1VB Intel

AGFB019R31C2I1VB

IC FPGA AGILEX-F 3184BGA

Intel

2,420 -
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
XCZU47DR-2FFVG1517I AMD

XCZU47DR-2FFVG1517I

IC ZUP RFSOC A53 FPGA 1517BGA

AMD

4,469 -
Datasheet Zynq® UltraScale+™ RFSoC 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCZU43DR-2FFVG1517I AMD

XCZU43DR-2FFVG1517I

IC ZUP RFSOC A53 FPGA 1517BGA

AMD

2,084 -
Datasheet Zynq® UltraScale+™ RFSoC 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCZU43DR-2FSVG1517I AMD

XCZU43DR-2FSVG1517I

IC ZUP RFSOC A53 FPGA 1517BGA

AMD

4,012 -
Datasheet Zynq® UltraScale+™ RFSoC 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCZU47DR-2FSVG1517I AMD

XCZU47DR-2FSVG1517I

IC ZUP RFSOC A53 FPGA 1517BGA

AMD

4,809 -
Datasheet Zynq® UltraScale+™ RFSoC 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
AGFA023R31C2I3E Intel

AGFA023R31C2I3E

IC FPGA AGILEX-F 3184FBGA

Intel

3,008 -
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFA023R31C2I2V Intel

AGFA023R31C2I2V

IC FPGA AGILEX-F 3184FBGA

Intel

3,615 -
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFA023R31C2I2VB Intel

AGFA023R31C2I2VB

IC FPGA AGILEX-F 3184BGA

Intel

4,051 -
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFB023R31C2I3E Intel

AGFB023R31C2I3E

IC FPGA AGILEX-F 3184FBGA

Intel

4,410 -
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFB023R31C2I2V Intel

AGFB023R31C2I2V

IC FPGA AGILEX-F 3184FBGA

Intel

4,897 -
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFB023R31C2I2VB Intel

AGFB023R31C2I2VB

IC FPGA AGILEX-F 3184BGA

Intel

2,256 -
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFC023R31C3E4X Intel

AGFC023R31C3E4X

IC FPGA AGILEX-F 3184FBGA

Intel

3,588 -
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
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FREQUENTLY ASKED QUESTIONS

System On Chip (SoC) FAQ

Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.

What should I check when selecting System On Chip (SoC) components?

Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

Can Winsun help source specific System On Chip (SoC) part numbers?

Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

Do you support shortage, obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

How do I request a quote for System On Chip (SoC) components?

Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.