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System On Chip (SoC)

Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
MPFS160TLS-FCSG536I Microchip Technology

MPFS160TLS-FCSG536I

IC SOC RISC-V 536LFBGA

Microchip Technology

2,577 -
Datasheet PolarFire® 536-LFBGA, CSPBGA Tray Active MPU, FPGA RISC-V 128kB 1.4125MB DMA, PCI, PWM CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG - FPGA - 161K Logic Modules -40°C ~ 100°C - - 536-LFBGA
XCZU3EG-1SFVC784E AMD

XCZU3EG-1SFVC784E

IC SOC CORTEX-A53 784FCBGA

AMD

3,573 -
Datasheet Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 0°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
M2S150TS-1FC1152I Microchip Technology

M2S150TS-1FC1152I

IC SOC CORTEX-M3 166MHZ 1152BGA

Microchip Technology

2,869 -
Datasheet SmartFusion®2 1152-BBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules -40°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
XC7Z030-3FFG676E AMD

XC7Z030-3FFG676E

IC SOC CORTEX-A9 1GHZ 676FCBGA

AMD

2,205 -
Datasheet Zynq®-7000 676-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1GHz Kintex™-7 FPGA, 125K Logic Cells 0°C ~ 100°C (TJ) - - 676-FCBGA (27x27)
A5ED065BB23AE5SR0 Intel

A5ED065BB23AE5SR0

IC MPU FPGA AGILEX5E ES 839BGA

Intel

4,952 -
Datasheet Agilex E 839-FBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ - 512kB DDR, DMA, PCIe, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz, 1.8GHz FPGA - 656K Logic Elements 0°C ~ 100°C (TJ) - - 839-VPBGA (23x23)
A5ED065BB32AE4SR0 Intel

A5ED065BB32AE4SR0

IC MPU FPGA AGILEX5E ES 1591BGA

Intel

4,141 -
Datasheet Agilex E 839-FBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ - 512kB DDR, DMA, PCIe, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz, 1.8GHz FPGA - 656K Logic Elements 0°C ~ 100°C (TJ) - - 1591-VPBGA (32x32)
XC7Z045-1FFG900I AMD

XC7Z045-1FFG900I

IC SOC CORTEX-A9 667MHZ 900FCBGA

AMD

1,700 -
Datasheet Zynq®-7000 900-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Kintex™-7 FPGA, 350K Logic Cells -40°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XCZU17EG-2FFVC1760E AMD

XCZU17EG-2FFVC1760E

IC SOC CORTEX-A53 1760FCBGA

AMD

3,141 -
Datasheet Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 926K+ Logic Cells 0°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
UPD72874AGC-YEB-A Renesas Electronics Corporation

UPD72874AGC-YEB-A

SOC / AV LINK

Renesas Electronics Corporation

4,490 -
Datasheet * - Bulk Active - - - - - - - - - - - -
KS8695 Micrel Inc.

KS8695

CENTAUR MULTI-PORT GATEWAY

Micrel Inc.

3,046 -
Datasheet - 208-BFQFP Bulk Active MPU ARM922T - - DMA, WDT Ethernet 166MHz - - - - 208-PQFP (28x28)
UPD72893BGD-LML-A Renesas Electronics Corporation

UPD72893BGD-LML-A

SOC / AV LINK

Renesas Electronics Corporation

3,134 -
Datasheet * - Bulk Active - - - - - - - - - - - -
PLCHIP-P10-51220X1 Divelbiss Corporation

PLCHIP-P10-51220X1

P10 PLC ON A CHIP SINGLE, LQFP-

Divelbiss Corporation

2,294 -
Datasheet - 144-LQFP Box Active MCU PLC 256KB 32KB LCD, PWM, WDT CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART 12MHz - -40°C ~ 85°C (TJ) - - 144-LQFP (20x20)
PLCHIP-P10-51220X5 Divelbiss Corporation

PLCHIP-P10-51220X5

P10 PLC ON A CHIP 5 PACK, LQFP-

Divelbiss Corporation

3,854 -
Datasheet - 144-LQFP Tray Active MCU PLC 256KB 32KB LCD, PWM, WDT CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART 12MHz - -40°C ~ 85°C (TJ) - - 144-LQFP (20x20)
PLCHIP-P13-51220X5 Divelbiss Corporation

PLCHIP-P13-51220X5

P13 PLC ON A CHIP 5 PACK, LQFP-2

Divelbiss Corporation

3,389 -
Datasheet - 208-LQFP Tray Active MCU PLC 256KB 32KB LCD, PWM, WDT CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART 12MHz - -40°C ~ 85°C (TJ) - - 208-LQFP (28x28)
XAZU2EG-1SFVA625I AMD

XAZU2EG-1SFVA625I

IC SOC CORTEX-A53 625FCBGA

AMD

1,367 -
Datasheet Zynq® UltraScale+™ MPSoC EG 625-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 1.2MB DMA, WDT CANbus, I2C, SPI, UART/USART, USB 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 103K+ Logic Cells -40°C ~ 100°C (TJ) - - 625-FCBGA (21x21)
PLCHIP-P10-51220X10 Divelbiss Corporation

PLCHIP-P10-51220X10

P10 PLC ON A CHIP 10 PACK, LQFP

Divelbiss Corporation

4,383 -
Datasheet - 144-LQFP Tray Active MCU PLC 256KB 32KB LCD, PWM, WDT CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART 12MHz - -40°C ~ 85°C (TJ) - - 144-LQFP (20x20)
XCZU5EG-L2SFVC784E AMD

XCZU5EG-L2SFVC784E

IC SOC CORTEX-A53 784FCBGA

AMD

2,751 -
Datasheet Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 0°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
10E00025005X0 NexCOBOT CO., LTD.

10E00025005X0

SMARC 2.1 Module

NexCOBOT CO., LTD.

2,249 -
Datasheet - Module Bulk Active MPU Intel® Atom® X5-E3940 32GB 4GB HDMI, LVDS, SATA Ethernet, I2C, MMC/SD/SDIO, PCIe, SPI, UART, USB - - -5°C ~ 60°C - - -
XC7Z014S-1CLG400C AMD

XC7Z014S-1CLG400C

IC SOC CORTEX-A9 667MHZ 400BGA

AMD

2,627 -
Datasheet Zynq®-7000 400-LFBGA, CSPBGA Tray Active MCU, FPGA Single ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Artix™-7 FPGA, 65K Logic Cells 0°C ~ 85°C (TJ) - - 400-CSPBGA (17x17)
XC7Z030-1SBG485C AMD

XC7Z030-1SBG485C

IC SOC CORTEX-A9 667MHZ 485FCBGA

AMD

1,787 -
Datasheet Zynq®-7000 484-FBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Kintex™-7 FPGA, 125K Logic Cells 0°C ~ 85°C (TJ) - - 484-FCBGA (19x19)
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FREQUENTLY ASKED QUESTIONS

System On Chip (SoC) FAQ

Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.

What should I check when selecting System On Chip (SoC) components?

Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

Can Winsun help source specific System On Chip (SoC) part numbers?

Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

Do you support shortage, obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

How do I request a quote for System On Chip (SoC) components?

Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.