System On Chip (SoC)
Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.
For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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AGIB041R31B1E2VR0AGIB041R31B1E2VR0 |
1,571 | - |
|
Datasheet | Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 4M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
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AGIB041R31B1E2VBAGIB041R31B1E2VB |
2,903 | - |
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Datasheet | Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 4M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
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AGID023R18A1I1VIC FPGA AGILEX-I 1805FBGA |
4,803 | - |
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Datasheet | Agilex I | 1805-BBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1805-BGA (42.5x42.5) |
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AGID023R18A1I1VBIC FPGA AGILEX-I 1805BGA |
2,307 | - |
|
Datasheet | Agilex I | 1805-BBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1805-BGA (42.5x42.5) |
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XCVP1802-1MSELSVC4072IC VERSAL AI-CORE FPGA 4072BGA |
4,126 | - |
|
Datasheet | Versal® Premium | 4072-BBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | Versal™ Premium FPGA, 7.3M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 4072-FCBGA (65x65) |
|
XCVP1502-3HSEVSVA3340IC VERSAL PREM ACAP FPGA 3340BGA |
4,708 | - |
|
Datasheet | Versal® Premium | 3340-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz, 1.7GHz | Versal™ Premium FPGA, 3.7M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 3340-FCBGA (55x55) |
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AGIA035R39A2I2VAGIA035R39A2I2V |
2,164 | - |
|
Datasheet | Agilex I | 3948-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 3.54M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 3948-BGA (56x56) |
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AGIC035R39A2E2VBIC FPGA AGILEX-I 3948FBGA |
3,697 | - |
|
Datasheet | Agilex I | 3948-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 3.54M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3948-BGA (56x56) |
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AGIC035R39A2E3EIC FPGA AGILEX-I 3948FBGA |
2,993 | - |
|
Datasheet | Agilex I | 3948-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 3.54M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3948-BGA (56x56) |
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AGIB027R29A1E1VBIC FPGA AGILEX-I 2957BGA |
2,875 | - |
|
Datasheet | Agilex I | 2957-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2957-BGA (56x45) |
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AGIB027R29A1E1VAGIB027R29A1E1V |
4,397 | - |
|
Datasheet | Agilex I | 2957-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2957-BGA (56x45) |
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AGIB027R29B1E1VR3IC FPGA AGILEX-I 2957BGA |
4,358 | - |
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Datasheet | Agilex I | 2957-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2957-BGA (56x45) |
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AGIB022R31A1I1VBIC FPGA AGILEX-I 3184FBGA |
3,600 | - |
|
Datasheet | Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
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AGID041R29D2E3VIC FPGA AGILEX-I 2957FBGA |
3,929 | - |
|
Datasheet | Agilex I | 2957-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 4M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2957-BGA (56x45) |
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AGIA040R39A2E2VR0IC FPGA AGILEX-I 3948FBGA |
3,844 | - |
|
Datasheet | Agilex I | 3948-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 4.047M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3948-BGA (56x56) |
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AGIA040R39A2E3EIC FPGA AGILEX-I 3948FBGA |
2,435 | - |
|
Datasheet | Agilex I | 3948-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 4.047M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3948-BGA (56x56) |
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AGIA040R39A2E2VBIC FPGA AGILEX-I 3948FBGA |
3,642 | - |
|
Datasheet | Agilex I | 3948-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 4.047M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3948-BGA (56x56) |
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AGIC040R39A2E2VAGIC040R39A2E2V |
1,906 | - |
|
Datasheet | Agilex I | 3948-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 4.047M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3948-BGA (56x56) |
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XCVC2802-2HSINSVH1369XCVC2802-2HSINSVH1369 |
1,604 | - |
|
Datasheet | - | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
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XCVC1802-2LLIVSVA2197IC VERSAL AICORE FPGA 2197BGA |
1,305 | - |
|
Datasheet | Versal™ AI Core | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 450MHz, 1.08GHz | Versal™ AI Core FPGA, 1.5M Logic Cells | -40°C ~ 100°C (TJ) | - | - | 2197-FCBGA (45x45) |
System On Chip (SoC) FAQ
Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.
What should I check when selecting System On Chip (SoC) components?
Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.
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Do you support shortage, obsolete or hard-to-find System On Chip (SoC) parts?
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