System On Chip (SoC)
Use the filters and product table below to compare System On Chip (SoC) components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.
If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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TDA4VL21HGAALZRQ1AUTOMOTIVE SYSTEM-ON-A-CHIP WITH |
238 | - |
|
Datasheet | - | 770-BFBGA, FCBGA | Tape & Reel (TR) | Active | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1GHz | - | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 770-FCBGA (23x23) |
|
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TDA4AL88TGAALZRQ1AUTOMOTIVE SYSTEM-ON-A-CHIP FOR |
210 | - |
|
Datasheet | - | 770-BFBGA, FCBGA | Tape & Reel (TR) | Active | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1GHz | - | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 770-FCBGA (23x23) |
|
DRA829JMTGBALFRDUAL ARM CORTEX-A72, QUAD CORTEX |
250 | - |
|
Datasheet | - | 827-BFBGA, FCBGA | Tape & Reel (TR) | Last Time Buy | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 105°C (TJ) | - | - | 827-FCBGA (24x24) |
|
|
TDA4VE88TGAALZRQ1AUTOMOTIVE SYSTEM-ON-A-CHIP FOR |
175 | - |
|
Datasheet | - | 770-BFBGA, FCBGA | Tape & Reel (TR) | Active | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 2MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1GHz | - | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 770-FCBGA (23x23) |
|
|
TDA4VM88TGBALFRNEXT GENERATION SOC FAMILY FOR L |
494 | - |
|
Datasheet | - | 827-BFBGA, FCBGA | Tape & Reel (TR) | Last Time Buy | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 105°C (TJ) | Automotive | AEC-Q100 | 827-FCBGA (24x24) |
|
|
TDA4VM88TGBALFRQ1NEXT GENERATION SOC FAMILY FOR L |
218 | - |
|
Datasheet | - | 827-BFBGA, FCBGA | Tape & Reel (TR) | Last Time Buy | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 827-FCBGA (24x24) |
|
WDC6202GJL250XWIRELESS 27MM 6202 WITH XBUS |
4,631 | - |
|
Datasheet | * | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
DRA821U2CGBALMRDUAL ARM CORTEX-A72 QUAD CORTEX |
2,457 | - |
|
Datasheet | Jacinto™ | 433-BFBGA, FCBGA | Tape & Reel (TR) | Active | MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F | - | 1.5MB | DMA, PWM, WDT | Ethernet, I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB | 750MHz, 500MHz | - | -40°C ~ 105°C (TJ) | - | - | 433-FCBGA (17.2x17.2) |
|
|
DRA821U2CGBALMDUAL ARM CORTEX-A72 QUAD CORTEX |
3,192 | - |
|
Datasheet | Jacinto™ | 433-BFBGA, FCBGA | Bulk | Active | MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F | - | 1.5MB | DMA, PWM, WDT | Ethernet, I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB | 750MHz, 500MHz | - | -40°C ~ 105°C (TJ) | - | - | 433-FCBGA (17.2x17.2) |
|
TDA3MVRBFABFRQ1IC SOC PROCESSOR |
4,803 | - |
|
Datasheet | - | 367-BFBGA, FCBGA | Tape & Reel (TR) | Active | DSP, MPU | ARM® Cortex®-M4, C66x | - | 512kB | DMA, PWM, WDT | CAN, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB | 212.8MHz, 745MHz | - | -40°C ~ 125°C (TJ) | - | - | 367-FCBGA (15x15) |
System On Chip (SoC) FAQ
Common questions about filtering, comparing and sourcing System On Chip (SoC) components.
How can I narrow the System On Chip (SoC) selection?
Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.
Should I confirm the datasheet before selecting a part?
Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.
Can Winsun (HK) Electronics help source a specific System On Chip (SoC) part number?
Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.
Do you support BOM, shortage or alternative-part requirements?
Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.
