System On Chip (SoC)
Use the filters and product table below to compare System On Chip (SoC) components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.
If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
A2F060M3E-FGG256MIC SOC CORTEX-M3 80MHZ 256FBGA |
1,843 | - |
|
Datasheet | SmartFusion® | 256-LBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 16KB | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | 80MHz | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | -55°C ~ 125°C (TJ) | - | - | 256-FPBGA (17x17) |
|
A2F060M3E-1FG256MIC SOC CORTEX-M3 100MHZ 256FBGA |
4,850 | - |
|
Datasheet | SmartFusion® | 256-LBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 16KB | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | 100MHz | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | -55°C ~ 125°C (TJ) | - | - | 256-FPBGA (17x17) |
|
A2F060M3E-1FGG256MIC SOC CORTEX-M3 100MHZ 256FBGA |
3,013 | - |
|
Datasheet | SmartFusion® | 256-LBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 16KB | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | 100MHz | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | -55°C ~ 125°C (TJ) | - | - | 256-FPBGA (17x17) |
|
M2S090S-1FG484IIC SOC CORTEX-M3 166MHZ 484FBGA |
4,775 | - |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FPBGA (23x23) |
|
M2S090S-1FGG484IIC SOC CORTEX-M3 166MHZ 484FBGA |
1,088 | - |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FPBGA (23x23) |
|
|
M2S090S-1FG676IIC SOC CORTEX-M3 166MHZ 676FBGA |
2,310 | - |
|
Datasheet | SmartFusion®2 | 676-BGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
|
|
M2S090S-1FGG676IIC SOC CORTEX-M3 166MHZ 676FBGA |
4,208 | - |
|
Datasheet | SmartFusion®2 | 676-BGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
|
M2S100-FC1152IC SOC CORTEX-M3 166MHZ 1152BGA |
3,763 | - |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 100K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
M2S100-FCG1152IC SOC CORTEX-M3 166MHZ 1152BGA |
4,804 | - |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 100K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
M2S100T-FC1152IC SOC CORTEX-M3 166MHZ 1152BGA |
1,969 | - |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 100K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 1152-FCBGA (35x35) |
System On Chip (SoC) FAQ
Common questions about filtering, comparing and sourcing System On Chip (SoC) components.
How can I narrow the System On Chip (SoC) selection?
Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.
Should I confirm the datasheet before selecting a part?
Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.
Can Winsun (HK) Electronics help source a specific System On Chip (SoC) part number?
Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.
Do you support BOM, shortage or alternative-part requirements?
Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.