System On Chip (SoC)

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Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Package/Case	Packaging	Product Status	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Grade	Qualification	Supplier Device Package
5CSEBA4U23C8N IC SOC CORTEX-A9 600MHZ 672UBGA Intel	2,413	-	RFQ	Datasheet	Cyclone® V SE	672-FBGA	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz	FPGA - 40K Logic Elements	0°C ~ 85°C (TJ)	-	-	672-UBGA (23x23)
M2S060-FG676 IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	1,821	-	RFQ	Datasheet	SmartFusion®2	676-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	0°C ~ 85°C (TJ)	-	-	676-FBGA (27x27)
M2S060-FGG676 IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	4,867	-	RFQ	Datasheet	SmartFusion®2	676-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	0°C ~ 85°C (TJ)	-	-	676-FBGA (27x27)
M2S050-1FCS325I IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	1,871	-	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 50K Logic Modules	-40°C ~ 100°C (TJ)	-	-	325-FCBGA (11x11)
M2S050-1FCSG325I IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	1,755	-	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 50K Logic Modules	-40°C ~ 100°C (TJ)	-	-	325-FCBGA (11x11)
M2S060-1FCS325I IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	2,164	-	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	-40°C ~ 100°C (TJ)	-	-	325-FCBGA (11x11)
R8A779M0JXXXBA#GD R-CAR H3E Renesas Electronics Corporation	4,556	-	RFQ	Datasheet	-	-	Tray	Active	-	-	-	-	-	-	-	-	-	-	-	-
R8A779M1JXXXBA#GD R-CAR H3E-2G Renesas Electronics Corporation	3,290	-	RFQ	Datasheet	-	-	Tray	Active	-	-	-	-	-	-	-	-	-	-	-	-
M2S025TS-1FG484I IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	1,780	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	-	-	484-FPBGA (23x23)
M2S025TS-1FGG484I IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	2,032	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	-	-	484-FPBGA (23x23)
5CSEMA2U23C7N IC SOC CORTEX-A9 800MHZ 672UBGA Intel	3,818	-	RFQ	Datasheet	Cyclone® V SE	672-FBGA	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 25K Logic Elements	0°C ~ 85°C (TJ)	-	-	672-UBGA (23x23)
5CSEBA4U19C7N IC SOC CORTEX-A9 800MHZ 484UBGA Intel	3,997	-	RFQ	Datasheet	Cyclone® V SE	484-FBGA	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 40K Logic Elements	0°C ~ 85°C (TJ)	-	-	484-UBGA (19x19)
M2S050T-VF400 IC SOC CORTEX-M3 166MHZ 400VFBGA Microchip Technology	3,529	-	RFQ	Datasheet	SmartFusion®2	400-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 50K Logic Modules	0°C ~ 85°C (TJ)	-	-	400-VFBGA (17x17)
M2S050T-VFG400 IC SOC CORTEX-M3 166MHZ 400VFBGA Microchip Technology	4,657	-	RFQ	Datasheet	SmartFusion®2	400-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 50K Logic Modules	0°C ~ 85°C (TJ)	-	-	400-VFBGA (17x17)
5CSEBA4U23C7SN IC SOC CORTEX-A9 800MHZ 672UBGA Intel	3,698	-	RFQ	Datasheet	Cyclone® V SE	672-FBGA	Tray	Active	MCU, FPGA	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 40K Logic Elements	0°C ~ 85°C (TJ)	-	-	672-UBGA (23x23)
5CSEMA4U23C8N IC SOC CORTEX-A9 600MHZ 672UBGA Intel	3,520	-	RFQ	Datasheet	Cyclone® V SE	672-FBGA	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz	FPGA - 40K Logic Elements	0°C ~ 85°C (TJ)	-	-	672-UBGA (23x23)
M2S010T-1FG484M IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	1,505	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 10K Logic Modules	-55°C ~ 125°C (TJ)	-	-	484-FPBGA (23x23)
M2S010T-1FGG484M IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	3,965	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 10K Logic Modules	-55°C ~ 125°C (TJ)	-	-	484-FPBGA (23x23)
5CSEBA5U19C8SN IC SOC CORTEX-A9 600MHZ 484UBGA Intel	2,313	-	RFQ	Datasheet	Cyclone® V SE	484-FBGA	Tray	Active	MCU, FPGA	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz	FPGA - 85K Logic Elements	0°C ~ 85°C (TJ)	-	-	484-UBGA (19x19)
5CSEBA2U19I7LN 484-PIN UBGA Intel	2,669	-	RFQ	Datasheet	Cyclone® V SE	484-FBGA	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	925MHz	FPGA - 25K Logic Elements	-40°C ~ 100°C (TJ)	-	-	484-UBGA (19x19)

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System On Chip (SoC) FAQ

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Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

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Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

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