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System On Chip (SoC)

Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
M2S150-1FCG1152 Microchip Technology

M2S150-1FCG1152

IC SOC CORTEX-M3 166MHZ 1152BGA

Microchip Technology

1,368 -
Datasheet SmartFusion®2 1152-BBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 1152-FCBGA (35x35)
M2S150-FC1152I Microchip Technology

M2S150-FC1152I

IC SOC CORTEX-M3 166MHZ 1152BGA

Microchip Technology

3,168 -
Datasheet SmartFusion®2 1152-BBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules -40°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
M2S150-FCG1152I Microchip Technology

M2S150-FCG1152I

IC SOC CORTEX-M3 166MHZ 1152BGA

Microchip Technology

2,736 -
Datasheet SmartFusion®2 1152-BBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules -40°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
XAZU1EG-L1SFVA625I AMD

XAZU1EG-L1SFVA625I

ZUP MPSOC A53 FPGA Q LP 625BGA

AMD

3,178 -
Datasheet Zynq® UltraScale+™ MPSoC EG 625-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 82K Logic Cells -40°C ~ 100°C (TJ) - - 625-FCBGA (21x21)
XCZU3CG-1SBVA484E AMD

XCZU3CG-1SBVA484E

IC SOC CORTEX-A53 484FCBGA

AMD

2,682 -
Datasheet Zynq® UltraScale+™ MPSoC CG 484-BFBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 0°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
XCZU2EG-2UBVA530E AMD

XCZU2EG-2UBVA530E

IC ZUP MPSOC A53 FPGA 530BGA

AMD

2,876 -
Datasheet Zynq® UltraScale+™ MPSoC EG 530-WFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 103K+ Logic Cells 0°C ~ 100°C (TJ) - - 530-FCBGA (16x9.5)
XCZU2EG-L1UBVA530I AMD

XCZU2EG-L1UBVA530I

IC ZUP MPSOC A53 FPGA LP 530BGA

AMD

1,334 -
Datasheet Zynq® UltraScale+™ MPSoC EG 530-WFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 103K+ Logic Cells -40°C ~ 100°C (TJ) - - 530-FCBGA (16x9.5)
XCZU2EG-3SBVA484E AMD

XCZU2EG-3SBVA484E

IC SOC CORTEX-A53 484FCBGA

AMD

1,044 -
Datasheet Zynq® UltraScale+™ MPSoC EG 484-BFBGA, FCBGA Tray Obsolete MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 667MHz, 1.5GHz Zynq®UltraScale+™ FPGA, 103K+ Logic Cells 0°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
M2S150-1FCS536 Microchip Technology

M2S150-1FCS536

IC SOC CORTEX-M3 166MHZ 536BGA

Microchip Technology

4,219 -
Datasheet SmartFusion®2 536-LFBGA, CSPBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 536-CSPBGA (16x16)
M2S150-1FCSG536 Microchip Technology

M2S150-1FCSG536

IC SOC CORTEX-M3 166MHZ 536BGA

Microchip Technology

4,964 -
Datasheet SmartFusion®2 536-LFBGA, CSPBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 536-CSPBGA (16x16)
M2S150-FCS536I Microchip Technology

M2S150-FCS536I

IC SOC CORTEX-M3 166MHZ 536BGA

Microchip Technology

3,164 -
Datasheet SmartFusion®2 536-LFBGA, CSPBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules -40°C ~ 100°C (TJ) - - 536-CSPBGA (16x16)
M2S150-FCSG536I Microchip Technology

M2S150-FCSG536I

IC SOC CORTEX-M3 166MHZ 536BGA

Microchip Technology

3,928 -
Datasheet SmartFusion®2 536-LFBGA, CSPBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules -40°C ~ 100°C (TJ) - - 536-CSPBGA (16x16)
XC7Z030-1SB485I AMD

XC7Z030-1SB485I

IC SOC CORTEX-A9 667MHZ 485FCBGA

AMD

1,150 -
Datasheet Zynq®-7000 484-FBGA, FCBGA Bulk Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Kintex™-7 FPGA, 125K Logic Cells -40°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
XCZU1EG-2SFVC784E AMD

XCZU1EG-2SFVC784E

IC ZUP MPSOC A53 FPGA 784BGA

AMD

4,964 -
Datasheet Zynq® UltraScale+™ 784-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT - 533MHz, 600MHz, 1.333GHz - 0°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XCZU1EG-L1SFVC784I AMD

XCZU1EG-L1SFVC784I

IC ZUP MPSOC LP A53 FPGA 784BGA

AMD

4,372 -
Datasheet Zynq® UltraScale+™ 784-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT - 500MHz, 600MHz, 1.2GHz - -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
M2S100T-FC1152 Microsemi Corporation

M2S100T-FC1152

IC SOC CORTEX-M3 166MHZ 1152BGA

Microsemi Corporation

1,969 -
Datasheet SmartFusion®2 1152-BBGA, FCBGA Tray Obsolete MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 100K Logic Modules 0°C ~ 85°C (TJ) - - 1152-FCBGA (35x35)
M2S100T-FCG1152 Microsemi Corporation

M2S100T-FCG1152

IC SOC CORTEX-M3 166MHZ 1152BGA

Microsemi Corporation

3,727 -
Datasheet SmartFusion®2 1152-BBGA, FCBGA Tray Obsolete MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 100K Logic Modules 0°C ~ 85°C (TJ) - - 1152-FCBGA (35x35)
XC7Z030-3FBG484E AMD

XC7Z030-3FBG484E

IC SOC CORTEX-A9 1GHZ 484FCBGA

AMD

3,730 -
Datasheet Zynq®-7000 484-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1GHz Kintex™-7 FPGA, 125K Logic Cells 0°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
XC7Z030-L2FBG484I AMD

XC7Z030-L2FBG484I

IC SOC CORTEX-A9 800MHZ 484FCBGA

AMD

2,471 -
Datasheet Zynq®-7000 484-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz Kintex™-7 FPGA, 125K Logic Cells -40°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
M2S150-1FCV484I Microchip Technology

M2S150-1FCV484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

4,165 -
Datasheet SmartFusion®2 484-BFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules -40°C ~ 100°C (TJ) - - 484-FBGA (19x19)
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FREQUENTLY ASKED QUESTIONS

System On Chip (SoC) FAQ

Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.

What should I check when selecting System On Chip (SoC) components?

Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

Can Winsun help source specific System On Chip (SoC) part numbers?

Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

Do you support shortage, obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

How do I request a quote for System On Chip (SoC) components?

Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.