System On Chip (SoC)
Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.
For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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M2S150-1FCG1152IC SOC CORTEX-M3 166MHZ 1152BGA |
1,368 | - |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 1152-FCBGA (35x35) |
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M2S150-FC1152IIC SOC CORTEX-M3 166MHZ 1152BGA |
3,168 | - |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
M2S150-FCG1152IIC SOC CORTEX-M3 166MHZ 1152BGA |
2,736 | - |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
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XAZU1EG-L1SFVA625IZUP MPSOC A53 FPGA Q LP 625BGA |
3,178 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 625-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 82K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
|
XCZU3CG-1SBVA484EIC SOC CORTEX-A53 484FCBGA |
2,682 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 484-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
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XCZU2EG-2UBVA530EIC ZUP MPSOC A53 FPGA 530BGA |
2,876 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
|
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XCZU2EG-L1UBVA530IIC ZUP MPSOC A53 FPGA LP 530BGA |
1,334 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
|
XCZU2EG-3SBVA484EIC SOC CORTEX-A53 484FCBGA |
1,044 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 484-BFBGA, FCBGA | Tray | Obsolete | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 667MHz, 1.5GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
|
M2S150-1FCS536IC SOC CORTEX-M3 166MHZ 536BGA |
4,219 | - |
|
Datasheet | SmartFusion®2 | 536-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 536-CSPBGA (16x16) |
|
M2S150-1FCSG536IC SOC CORTEX-M3 166MHZ 536BGA |
4,964 | - |
|
Datasheet | SmartFusion®2 | 536-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 536-CSPBGA (16x16) |
|
M2S150-FCS536IIC SOC CORTEX-M3 166MHZ 536BGA |
3,164 | - |
|
Datasheet | SmartFusion®2 | 536-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 536-CSPBGA (16x16) |
|
M2S150-FCSG536IIC SOC CORTEX-M3 166MHZ 536BGA |
3,928 | - |
|
Datasheet | SmartFusion®2 | 536-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 536-CSPBGA (16x16) |
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XC7Z030-1SB485IIC SOC CORTEX-A9 667MHZ 485FCBGA |
1,150 | - |
|
Datasheet | Zynq®-7000 | 484-FBGA, FCBGA | Bulk | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
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XCZU1EG-2SFVC784EIC ZUP MPSOC A53 FPGA 784BGA |
4,964 | - |
|
Datasheet | Zynq® UltraScale+™ | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | - | 533MHz, 600MHz, 1.333GHz | - | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
XCZU1EG-L1SFVC784IIC ZUP MPSOC LP A53 FPGA 784BGA |
4,372 | - |
|
Datasheet | Zynq® UltraScale+™ | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | - | 500MHz, 600MHz, 1.2GHz | - | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
M2S100T-FC1152IC SOC CORTEX-M3 166MHZ 1152BGA |
1,969 | - |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 100K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
M2S100T-FCG1152IC SOC CORTEX-M3 166MHZ 1152BGA |
3,727 | - |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 100K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
XC7Z030-3FBG484EIC SOC CORTEX-A9 1GHZ 484FCBGA |
3,730 | - |
|
Datasheet | Zynq®-7000 | 484-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1GHz | Kintex™-7 FPGA, 125K Logic Cells | 0°C ~ 100°C (TJ) | - | - | 484-FCBGA (23x23) |
|
XC7Z030-L2FBG484IIC SOC CORTEX-A9 800MHZ 484FCBGA |
2,471 | - |
|
Datasheet | Zynq®-7000 | 484-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (23x23) |
|
M2S150-1FCV484IIC SOC CORTEX-M3 166MHZ 484FBGA |
4,165 | - |
|
Datasheet | SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FBGA (19x19) |
System On Chip (SoC) FAQ
Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.
What should I check when selecting System On Chip (SoC) components?
Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.
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Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.
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