System On Chip (SoC)
Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.
For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XCZU2EG-L2SFVC784EIC SOC CORTEX-A53 784FCBGA |
4,186 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
SOM-2532CCBX-S3A1SBC 1.3GHZ 2 CORE 0GB/8GB RAM |
2,235 | - |
|
Datasheet | SMARC | Module | Bulk | Active | MPU | Intel® Atom® x6211E | 32GB | 8GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 1.3GHz | - | -40°C ~ 85°C | - | - | - |
|
|
XCZU3CG-1SFVA625IIC SOC CORTEX-A53 625FCBGA |
1,620 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 625-BFBGA, FCBGA | Bulk | Active | MCU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
|
10AS016C4U19E3SGIC SOC CORTEX-A9 1.5GHZ 484UBGA |
4,393 | - |
|
Datasheet | Arria 10 SX | 484-BFBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 160K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 484-UBGA (19x19) |
|
|
XCZU3CG-2UBVA530EIC ZUP MPSOC A53 FPGA 530BGA |
4,107 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
|
|
XCZU3CG-L1UBVA530IIC ZUP MPSOC A53 FPGA LP 530BGA |
2,354 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
|
M2S150TS-1FCG1152IIC SOC CORTEX-M3 166MHZ 1152BGA |
2,453 | - |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
XCZU3CG-1SFVC784IIC SOC CORTEX-A53 784FCBGA |
4,202 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 784-BFBGA, FCBGA | Bulk | Active | MCU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
M2S100S-1FC1152IIC SOC CORTEX-M3 166MHZ 1152BGA |
4,653 | - |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 100K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
M2S100S-1FCG1152IIC SOC CORTEX-M3 166MHZ 1152BGA |
1,659 | - |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 100K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
M2S150TS-1FCS536IIC SOC CORTEX-M3 166MHZ 536BGA |
1,336 | - |
|
Datasheet | SmartFusion®2 | 536-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 536-CSPBGA (16x16) |
|
M2S150TS-1FCSG536IIC SOC CORTEX-M3 166MHZ 536BGA |
4,704 | - |
|
Datasheet | SmartFusion®2 | 536-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 536-CSPBGA (16x16) |
|
XCZU3CG-L1SBVA484IIC SOC CORTEX-A53 484FCBGA |
2,514 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 484-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
|
M2S090T-1FG484MIC SOC CORTEX-M3 166MHZ 484FBGA |
1,455 | - |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -55°C ~ 125°C (TJ) | - | - | 484-FPBGA (23x23) |
|
M2S090T-1FGG484MIC SOC CORTEX-M3 166MHZ 484FBGA |
2,737 | - |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -55°C ~ 125°C (TJ) | - | - | 484-FPBGA (23x23) |
|
BCM53570B0IFSBG24X10G L2 TSN SWITCH |
4,317 | - |
|
Datasheet | - | - | Tray | Active | MPU | ARM® Cortex®-A9, ARM® Cortex®-R5 | - | - | SERDES | ACL, MAC, QSGMII | 1.25GHz | - | - | - | - | - |
|
XC7Z030-L2FFG676IIC SOC CORTEX-A9 800MHZ 676FCBGA |
4,376 | - |
|
Datasheet | Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
|
PLCHIP-P13-51220X10P13 PLC ON A CHIP 10 PACK, LQFP- |
3,949 | - |
|
Datasheet | - | 208-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 208-LQFP (28x28) |
|
M2S100TS-1FC1152IIC SOC CORTEX-M3 166MHZ 1152BGA |
3,931 | - |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 100K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
M2S100TS-1FCG1152IIC SOC CORTEX-M3 166MHZ 1152BGA |
1,526 | - |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 100K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 1152-FCBGA (35x35) |
System On Chip (SoC) FAQ
Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.
What should I check when selecting System On Chip (SoC) components?
Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.
Can Winsun help source specific System On Chip (SoC) part numbers?
Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.
Do you support shortage, obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.
How do I request a quote for System On Chip (SoC) components?
Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.