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Memory

Browse available Memory part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Programmable Memory Type Memory Format Technology Memory Size Memory Organization Memory Interface Clock Frequency Write Cycle Time - Word, Page Access Time Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
CY15B104QI-20LPXC Infineon Technologies

CY15B104QI-20LPXC

IC FRAM 4MBIT SPI 20MHZ 8GQFN

Infineon Technologies

143 -
Datasheet Excelon™-LP,F-RAM™ 8-UQFN Tray Active Not Verified Non-Volatile FRAM FRAM (Ferroelectric RAM) 4Mbit 512K x 8 SPI 20 MHz - - 1.8V ~ 3.6V 0°C ~ 70°C (TA) - - Surface Mount 8-GQFN (3.23x3.28)
EM64VSUKN-BA000-2 Delkin Devices, Inc.

EM64VSUKN-BA000-2

IC FLASH 512GBIT EMMC 153FBGA

Delkin Devices, Inc.

375 -
Datasheet - 153-VFBGA Tray Active Not Verified Non-Volatile FLASH FLASH - NAND 512Gbit 64G x 8 eMMC 200 MHz - - 3.3V -40°C ~ 85°C - - Surface Mount 153-FBGA (11.5x13)
DS1220AD-150+ Analog Devices Inc./Maxim Integrated

DS1220AD-150+

IC NVSRAM 16KBIT PARALLEL 24EDIP

Analog Devices Inc./Maxim Integrated

2,428 -
Datasheet - 24-DIP Module (0.600", 15.24mm) Tube Active Not Verified Non-Volatile NVSRAM NVSRAM (Non-Volatile SRAM) 16Kbit 2K x 8 Parallel - 150ns 150 ns 4.5V ~ 5.5V 0°C ~ 70°C (TA) - - Through Hole 24-EDIP
CY62167G30-45ZXI Infineon Technologies

CY62167G30-45ZXI

IC SRAM 16MBIT PARALLEL 48TSOP I

Infineon Technologies

588 -
Datasheet MOBL™ 48-TFSOP (0.724", 18.40mm Width) Tray Active Not Verified Volatile SRAM SRAM - Asynchronous 16Mbit 2M x 8, 1M x 16 Parallel - 45ns 45 ns 2.2V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 48-TSOP I
MT40A1G16KH-062E:E Alliance Memory, Inc.

MT40A1G16KH-062E:E

IC DRAM 16GBIT PAR 96FBGA

Alliance Memory, Inc.

919 -
Datasheet - 96-TFBGA Tray Active - Volatile DRAM SDRAM - DDR4 16Gbit 1G x 16 Parallel 1.6 GHz 15ns 19 ns 1.14V ~ 1.26V 0°C ~ 95°C (TC) - - Surface Mount 96-FBGA (9x13)
CY14B101NA-ZS25XI Infineon Technologies

CY14B101NA-ZS25XI

IC NVSRAM 1MBIT PAR 44TSOP II

Infineon Technologies

475 -
Datasheet - 44-TSOP (0.400", 10.16mm Width) Tray Active Not Verified Non-Volatile NVSRAM NVSRAM (Non-Volatile SRAM) 1Mbit 64K x 16 Parallel - 25ns 25 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 44-TSOP II
S70GL02GS11FHI010 Infineon Technologies

S70GL02GS11FHI010

IC FLASH 2GBIT PARALLEL 64FBGA

Infineon Technologies

1,942 -
Datasheet GL-S 64-LBGA Tray Active Verified Non-Volatile FLASH FLASH - NOR 2Gbit 128M x 16 Parallel - - 110 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 64-FBGA (13x11)
MT29F16G08ABCCBH1-AAT:C Micron Technology Inc.

MT29F16G08ABCCBH1-AAT:C

IC FLASH 16GB PARALLEL 100VBGA

Micron Technology Inc.

739 -
Datasheet - 100-VBGA Bulk Active Not Verified Non-Volatile FLASH FLASH - NAND (SLC) 16Gbit 2G x 8 ONFI - 20ns 20 ns 2.7V ~ 3.6V -40°C ~ 105°C (TA) - - Surface Mount 100-VBGA (12x18)
MR25H40VDF Everspin Technologies Inc.

MR25H40VDF

IC RAM 4MBIT SPI 40MHZ 8DFN

Everspin Technologies Inc.

977 -
Datasheet - 8-VDFN Exposed Pad Tray Active Not Verified Non-Volatile RAM MRAM (Magnetoresistive RAM) 4Mbit 512K x 8 SPI 40 MHz - 9 ns 3V ~ 3.6V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount 8-DFN-EP, Small Flag (5x6)
IS21TF16G-JCLI ISSI, Integrated Silicon Solution Inc

IS21TF16G-JCLI

IC FLASH 128GBIT EMMC 153VFBGA

ISSI, Integrated Silicon Solution Inc

159 -
Datasheet - 153-VFBGA Tray Active Not Verified Non-Volatile FLASH FLASH - NAND (TLC) 128Gbit 16G x 8 eMMC_5.1 200 MHz - - 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 153-VFBGA (11.5x13)
S70GL02GT11FHI010 Infineon Technologies

S70GL02GT11FHI010

IC FLASH 2GBIT PARALLEL 64FBGA

Infineon Technologies

1,060 -
Datasheet GL-T 64-LBGA Tray Active Not Verified Non-Volatile FLASH FLASH - NOR 2Gbit 256M x 8, 128M x 16 Parallel - - 110 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 64-FBGA (11x13)
DS1225AB-70+ Analog Devices Inc./Maxim Integrated

DS1225AB-70+

IC NVSRAM 64KBIT PARALLEL 28EDIP

Analog Devices Inc./Maxim Integrated

200 -
Datasheet - 28-DIP Module (0.600", 15.24mm) Tube Active Not Verified Non-Volatile NVSRAM NVSRAM (Non-Volatile SRAM) 64Kbit 8K x 8 Parallel - 70ns 70 ns 4.75V ~ 5.25V 0°C ~ 70°C (TA) - - Through Hole 28-EDIP
DS1225AD-70+ Analog Devices Inc./Maxim Integrated

DS1225AD-70+

IC NVSRAM 64KBIT PARALLEL 28EDIP

Analog Devices Inc./Maxim Integrated

3,951 -
Datasheet - 28-DIP Module (0.600", 15.24mm) Tube Active Not Verified Non-Volatile NVSRAM NVSRAM (Non-Volatile SRAM) 64Kbit 8K x 8 Parallel - 70ns 70 ns 4.5V ~ 5.5V 0°C ~ 70°C (TA) - - Through Hole 28-EDIP
AS4C256M32MD4-062BAN Alliance Memory, Inc.

AS4C256M32MD4-062BAN

IC DRAM 8GBIT LVSTL 200FBGA

Alliance Memory, Inc.

1,507 -
Datasheet - 200-TFBGA Tray Active Not Verified Volatile DRAM SDRAM - Mobile LPDDR4 8Gbit 256M x 32 LVSTL 1.6 GHz 18ns 3.5 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-FBGA (10x14.5)
CY15V104QSN-108SXI Infineon Technologies

CY15V104QSN-108SXI

IC FRAM 4MBIT SPI/QUAD 8SOIC

Infineon Technologies

190 -
Datasheet Excelon™-Ultra, F-RAM™ 8-SOIC (0.209", 5.30mm Width) Tube Active Not Verified Non-Volatile FRAM FRAM (Ferroelectric RAM) 4Mbit 512K x 8 SPI - Quad I/O 108 MHz - - 1.71V ~ 1.89V -40°C ~ 85°C (TA) - - Surface Mount 8-SOIC
DS1225AD-85+ Analog Devices Inc./Maxim Integrated

DS1225AD-85+

IC NVSRAM 64KBIT PARALLEL 28EDIP

Analog Devices Inc./Maxim Integrated

263 -
Datasheet - 28-DIP Module (0.600", 15.24mm) Tube Active Not Verified Non-Volatile NVSRAM NVSRAM (Non-Volatile SRAM) 64Kbit 8K x 8 Parallel - 85ns 85 ns 4.5V ~ 5.5V 0°C ~ 70°C (TA) - - Through Hole 28-EDIP
DS1225AD-150+ Analog Devices Inc./Maxim Integrated

DS1225AD-150+

IC NVSRAM 64KBIT PARALLEL 28EDIP

Analog Devices Inc./Maxim Integrated

1,075 -
Datasheet - 28-DIP Module (0.600", 15.24mm) Tube Active Not Verified Non-Volatile NVSRAM NVSRAM (Non-Volatile SRAM) 64Kbit 8K x 8 Parallel - 150ns 150 ns 4.5V ~ 5.5V 0°C ~ 70°C (TA) - - Through Hole 28-EDIP
MR2A08AYS35 Everspin Technologies Inc.

MR2A08AYS35

IC RAM 4MBIT PARALLEL 44TSOP2

Everspin Technologies Inc.

126 -
Datasheet - 44-TSOP (0.400", 10.16mm Width) Tray Active Not Verified Non-Volatile RAM MRAM (Magnetoresistive RAM) 4Mbit 512K x 8 Parallel - 35ns 35 ns 3V ~ 3.6V 0°C ~ 70°C (TA) - - Surface Mount 44-TSOP2
DS1225AD-200+ Analog Devices Inc./Maxim Integrated

DS1225AD-200+

IC NVSRAM 64KBIT PARALLEL 28EDIP

Analog Devices Inc./Maxim Integrated

508 -
Datasheet - 28-DIP Module (0.600", 15.24mm) Tube Active Not Verified Non-Volatile NVSRAM NVSRAM (Non-Volatile SRAM) 64Kbit 8K x 8 Parallel - 200ns 200 ns 4.5V ~ 5.5V 0°C ~ 70°C (TA) - - Through Hole 28-EDIP
AS6C6416-55TIN Alliance Memory, Inc.

AS6C6416-55TIN

IC SRAM 64MBIT PARALLEL 48TSOP I

Alliance Memory, Inc.

205 -
Datasheet - 48-TFSOP (0.724", 18.40mm Width) Tray Active Not Verified Volatile SRAM SRAM - Asynchronous 64Mbit 4M x 16 Parallel - 55ns 55 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 48-TSOP I
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FREQUENTLY ASKED QUESTIONS

Memory FAQ

Common questions about selecting, comparing and sourcing Memory components through Winsun (HK) Electronics.

What should I check when selecting Memory components?

Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

Can Winsun help source specific Memory part numbers?

Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

Do you support shortage, obsolete or hard-to-find Memory parts?

Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

How do I request a quote for Memory components?

Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.