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FILTERED PRODUCT SELECTION

RFI and EMI - Contacts, Fingerstock and Gaskets

Use the filters and product table below to compare RFI and EMI - Contacts, Fingerstock and Gaskets components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.

If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.

Parametric Selection Filter options by technical parameters
Stock & Datasheets Review availability and technical references
RFQ & BOM Support Send your target MPN, quantity or BOM
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
67SLH050050050PI00 Laird Technologies EMI

67SLH050050050PI00

RFI FILM OVER FOAM PU SOLDER

Laird Technologies EMI

14,639 -
Datasheet SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Hourglass 0.197" (5.00mm) 0.197" (5.00mm) 0.197" (5.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
67SLG050060050PI00 Laird Technologies EMI

67SLG050060050PI00

RFI FILM OVER FOAM PU SOLDER

Laird Technologies EMI

753 -
Datasheet SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Rectangle 0.197" (5.00mm) 0.197" (5.00mm) 0.236" (6.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
67SLH060100050PI00 Laird Technologies EMI

67SLH060100050PI00

RFI FILM OVER FOAM PU SOLDER

Laird Technologies EMI

7,783 -
Datasheet SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Hourglass 0.236" (6.00mm) 0.197" (5.00mm) 0.394" (10.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
67B6G2007503015R00 Laird Technologies EMI

67B6G2007503015R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

886 -
Datasheet B6G Tape & Reel (TR) Active Fingerstock - 0.079" (2.00mm) 0.295" (7.50mm) 0.118" (3.00mm) Beryllium Copper Gold - Solder -
BMI-C-004 Laird Technologies EMI

BMI-C-004

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

5,411 -
Datasheet BMI-C Tape & Reel (TR) Active Fingerstock - 0.170" (4.32mm) 0.235" (5.97mm) 0.204" (5.17mm) Beryllium Copper Gold - Solder -
67B3G2504810010R00 Laird Technologies EMI

67B3G2504810010R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

2,085 -
Datasheet B3G Tape & Reel (TR) Active Fingerstock - 0.098" (2.50mm) 0.189" (4.80mm) 0.394" (10.00mm) Beryllium Copper Gold - Solder -
0097072802 Laird Technologies EMI

0097072802

GASKET BECU 15.88X11.35MM

Laird Technologies EMI

1,840 -
Datasheet USB Connector Bulk Active - - 0.625" (15.88mm) 0.447" (11.35mm) - - - - - -
4223PA51H01800 Laird Technologies EMI

4223PA51H01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

448 -
Datasheet 51H Bulk Active Fabric Over Foam Rectangle 0.157" (4.00mm) 18.000" (457.20mm) 0.039" (1.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
4688PA51H01800 Laird Technologies EMI

4688PA51H01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

1,255 -
Datasheet 51H Bulk Active Fabric Over Foam Rectangle 0.118" (3.00mm) 18.000" (457.20mm) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
4220PA51H01800 Laird Technologies EMI

4220PA51H01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

979 -
Datasheet 51H Bulk Active Fabric Over Foam Rectangle 0.201" (5.10mm) 18.000" (457.20mm) 0.039" (1.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
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WINSUN SOURCING SUPPORT

Need Help Sourcing RFI and EMI - Contacts, Fingerstock and Gaskets?

Send the target part number, manufacturer, specifications and quantity. Winsun (HK) Electronics can assist with availability checks, quotation support, shortage sourcing and alternative-part options when appropriate.

Availability and lead-time support BOM, shortage and alternative sourcing
FREQUENTLY ASKED QUESTIONS

RFI and EMI - Contacts, Fingerstock and Gaskets FAQ

Common questions about filtering, comparing and sourcing RFI and EMI - Contacts, Fingerstock and Gaskets components.

How can I narrow the RFI and EMI - Contacts, Fingerstock and Gaskets selection?

Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.

Should I confirm the datasheet before selecting a part?

Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.

Can Winsun (HK) Electronics help source a specific RFI and EMI - Contacts, Fingerstock and Gaskets part number?

Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.

Do you support BOM, shortage or alternative-part requirements?

Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.