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12-SSIP Exposed Pad, Formed Leads Package Parts

Use this page to review components associated with the 12-SSIP Exposed Pad, Formed Leads package or case.

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MATCHING PARTS 6 Results
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Matching 12-SSIP Exposed Pad, Formed Leads Components

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PART NUMBER FAM65CR51XZ2 MOSFET 2N-CH 650V 64A APMCD-B16
Manufacturer onsemi
Package / Case 12-SSIP Exposed Pad, Formed Leads
Stock Reference 4,920
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PART NUMBER FAM65CR51ADZ1 MOSFET 2N-CH 650V 41A APMCD-B16
Manufacturer onsemi
Package / Case 12-SSIP Exposed Pad, Formed Leads
Stock Reference 3,999
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PART NUMBER FAM65CR51DZ1 MOSFET 2N-CH 650V 33A APMCD-B16
Manufacturer onsemi
Package / Case 12-SSIP Exposed Pad, Formed Leads
Stock Reference 67
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PART NUMBER FAM65CR51XZ1 MOSFET 2N-CH 650V 64A APMCA-A16
Manufacturer onsemi
Package / Case 12-SSIP Exposed Pad, Formed Leads
Stock Reference 8,574
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PART NUMBER FAM65CR51DZ2 POWER MODULE
Manufacturer onsemi
Package / Case 12-SSIP Exposed Pad, Formed Leads
Stock Reference 5,629
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PART NUMBER FAM65CR51ADZ2 POWER INTEGRATED MODULE (PIM) BO
Manufacturer onsemi
Package / Case 12-SSIP Exposed Pad, Formed Leads
Stock Reference 72
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COMMON QUESTIONS

12-SSIP Exposed Pad, Formed Leads Package FAQ

Quick guidance for selection and sourcing.

What does the 12-SSIP Exposed Pad, Formed Leads package describe?

12-SSIP Exposed Pad, Formed Leads is a package or case designation used by compatible electronic components. Mechanical dimensions, pin count and pin configuration should be confirmed against the manufacturer datasheet.

Does the same 12-SSIP Exposed Pad, Formed Leads package mean two parts are interchangeable?

No. Matching package dimensions do not guarantee electrical or functional compatibility. Always verify the complete part number and technical specifications before substitution.

How can I source components in the 12-SSIP Exposed Pad, Formed Leads package?

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