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160-BQFP Exposed Pad Package Parts

Use this page to review components associated with the 160-BQFP Exposed Pad package or case.

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MATCHING PARTS 12 Results
PART NUMBER RESULTS

Matching 160-BQFP Exposed Pad Components

Compare sourcing references and open a part for full technical information.

PART NUMBER XC4028XL-3HQ160C IC FPGA 129 I/O 160QFP
Manufacturer AMD
Package / Case 160-BQFP Exposed Pad
Stock Reference 2,359
View Part
PART NUMBER XC4036XL-2HQ160C IC FPGA 129 I/O 160QFP
Manufacturer AMD
Package / Case 160-BQFP Exposed Pad
Stock Reference 2,147
View Part
PART NUMBER XC4028XL-2HQ160C IC FPGA 129 I/O 160QFP
Manufacturer AMD
Package / Case 160-BQFP Exposed Pad
Stock Reference 1,125
View Part
COMMON QUESTIONS

160-BQFP Exposed Pad Package FAQ

Quick guidance for selection and sourcing.

What does the 160-BQFP Exposed Pad package describe?

160-BQFP Exposed Pad is a package or case designation used by compatible electronic components. Mechanical dimensions, pin count and pin configuration should be confirmed against the manufacturer datasheet.

Does the same 160-BQFP Exposed Pad package mean two parts are interchangeable?

No. Matching package dimensions do not guarantee electrical or functional compatibility. Always verify the complete part number and technical specifications before substitution.

How can I source components in the 160-BQFP Exposed Pad package?

Select a matching part below or send your BOM and required quantities to Winsun (HK) Electronics for availability and quotation support.

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