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860-BGA Exposed Pad Package Parts

Use this page to review components associated with the 860-BGA Exposed Pad package or case.

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MATCHING PARTS 5 Results
PART NUMBER RESULTS

Matching 860-BGA Exposed Pad Components

Compare sourcing references and open a part for full technical information.

PART NUMBER XCV2000E-7FG860C IC FPGA 660 I/O 860FBGA
Manufacturer AMD
Package / Case 860-BGA Exposed Pad
Stock Reference 4,359
View Part
PART NUMBER XCV2000E-6FG860I IC FPGA 660 I/O 860FBGA
Manufacturer AMD
Package / Case 860-BGA Exposed Pad
Stock Reference 1,644
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PART NUMBER XCV1600E-7FG860C IC FPGA 660 I/O 860FBGA
Manufacturer AMD
Package / Case 860-BGA Exposed Pad
Stock Reference 1,974
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PART NUMBER XCV1000E-7FG860C IC FPGA 660 I/O 860FBGA
Manufacturer AMD
Package / Case 860-BGA Exposed Pad
Stock Reference 3,880
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PART NUMBER XCV2000E-6FG860I XCV2000 - VIRTEX-E, 1.8 V, FPGA,
Manufacturer AMD
Package / Case 860-BGA Exposed Pad
Stock Reference 1,126
View Part
COMMON QUESTIONS

860-BGA Exposed Pad Package FAQ

Quick guidance for selection and sourcing.

What does the 860-BGA Exposed Pad package describe?

860-BGA Exposed Pad is a package or case designation used by compatible electronic components. Mechanical dimensions, pin count and pin configuration should be confirmed against the manufacturer datasheet.

Does the same 860-BGA Exposed Pad package mean two parts are interchangeable?

No. Matching package dimensions do not guarantee electrical or functional compatibility. Always verify the complete part number and technical specifications before substitution.

How can I source components in the 860-BGA Exposed Pad package?

Select a matching part below or send your BOM and required quantities to Winsun (HK) Electronics for availability and quotation support.

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