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Die Package Parts

Use this page to review components associated with the Die package or case.

Compare manufacturer and stock references below, then open a product or add it directly to your sourcing request.

MATCHING PARTS 4269 Results
PART NUMBER RESULTS

Matching Die Components

Compare sourcing references and open a part for full technical information.

PART NUMBER TGA2963 6-18 GHZ, 20 W GAN PA
Manufacturer Qorvo
Package / Case Die
Stock Reference 3,528
View Part
PART NUMBER TGA2590 6-12 GHZ, 30 W GAN PA
Manufacturer Qorvo
Package / Case Die
Stock Reference 3,319
View Part
PART NUMBER QPA0708T 60W PA, SATCOM
Manufacturer Qorvo
Package / Case Die
Stock Reference 4,117
View Part
PART NUMBER TGA2307 5.0-6.0 GHZ 50W GAN PA
Manufacturer Qorvo
Package / Case Die
Stock Reference 1,649
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PART NUMBER QPA1314D 13.75-14.5GHZ, 55W PA DIE
Manufacturer Qorvo
Package / Case Die
Stock Reference 2,169
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PART NUMBER TGA2239 TGA2239, 13-15.5 GHZ 50W PA
Manufacturer Qorvo
Package / Case Die
Stock Reference 3,711
View Part
PART NUMBER TGA2623 10-11 GHZ, 35 W GAN PA
Manufacturer Qorvo
Package / Case Die
Stock Reference 2,153
View Part
COMMON QUESTIONS

Die Package FAQ

Quick guidance for selection and sourcing.

What does the Die package describe?

Die is a package or case designation used by compatible electronic components. Mechanical dimensions, pin count and pin configuration should be confirmed against the manufacturer datasheet.

Does the same Die package mean two parts are interchangeable?

No. Matching package dimensions do not guarantee electrical or functional compatibility. Always verify the complete part number and technical specifications before substitution.

How can I source components in the Die package?

Select a matching part below or send your BOM and required quantities to Winsun (HK) Electronics for availability and quotation support.

GLOBAL COMPONENT SOURCING

Need a Different Option for Die?

Send the exact part number, manufacturer and quantity. Winsun (HK) Electronics can review availability, lead time, shortage requirements and possible alternatives.