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Intel System On Chip (SoC)

1SX280HU3F50E2VGS3

IC FPGA STRATIX 10 2397FBGA

Manufacturer Intel

Package / Case 2397-BBGA, FCBGA

Stock Reference 4,130

Category System On Chip (SoC)

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Since 2004Electronic component distribution and sourcing experience

QC SupportInspection options for authenticity and quality review

Shortage & EOLWider sourcing for constrained and obsolete requirements

BOM ProcurementMulti-line sourcing, pricing and delivery coordination

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SOURCING REQUEST

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Stock Reference 4,130

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PART IDENTIFICATION

1SX280HU3F50E2VGS3 Product Reference

Confirm the core identity of 1SX280HU3F50E2VGS3, then use the technical data, datasheet and sourcing sections below for engineering and procurement review.

Part Number: 1SX280HU3F50E2VGS3

Manufacturer: Intel

Package / Case: 2397-BBGA, FCBGA

Category: System On Chip (SoC)

Stock Reference: 4,130

Datasheet: View 1SX280HU3F50E2VGS3 Datasheet

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COMMERCIAL REFERENCE

1SX280HU3F50E2VGS3 Quantity Pricing

Price breaks shown on this page are reference data. Final price, source, stock and delivery terms are reconfirmed against your requested quantity.

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ENGINEERING REFERENCE

1SX280HU3F50E2VGS3 Specifications

Use the available attributes as a quick reference. Critical electrical, mechanical and qualification parameters should be verified against the manufacturer datasheet before design-in or substitution.

Product Attribute: Attribute Value

Part Number: 1SX280HU3F50E2VGS3

Manufacturer: Intel

Package: 2397-BBGA, FCBGA

Series: Stratix® 10 SX

Package/Case: 2397-BBGA, FCBGA

Packaging: Tray

Product Status: Discontinued at Digi-Key

Architecture: MCU, FPGA

Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

Flash Size: -

RAM Size: 256KB

Peripherals: DMA, WDT

Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed: 1.5GHz

Primary Attributes: FPGA - 2800K Logic Elements

Operating Temperature: 0°C ~ 100°C (TJ)

Grade: -

Qualification: -

Supplier Device Package: 2397-FBGA, FC (50x50)

PRODUCT INTELLIGENCE

1SX280HU3F50E2VGS3 Technical & Sourcing Context

This section combines technical reference, sourcing context and quality-control guidance for engineering and procurement review. When dedicated product content is available, it is displayed here automatically.

1SX280HU3F50E2VGS3 Product Overview

1SX280HU3F50E2VGS3 is listed as a System On Chip (SoC) component from Intel. The package / case currently recorded for this product is 2397-BBGA, FCBGA. Use the specifications and manufacturer datasheet on this page as the primary technical references before design-in, replacement or production approval.

Part Number	1SX280HU3F50E2VGS3
Manufacturer	Intel
Package / Case	2397-BBGA, FCBGA
Product Category	System On Chip (SoC)
Stock Reference	4,130

Supply Chain & Source Review

Established in 2004, Winsun (HK) Electronics has developed experience in electronic-component distribution, procurement coordination and quality control. For sourcing work, our supply routes may include established market suppliers, distributor relationships and OEM excess-inventory channels, depending on the part and current market conditions.

Supplier review can consider operating history, market reputation, known quality records, peer feedback and commercial competitiveness before a source is presented for customer evaluation.

Shortage and Obsolescence Support

When standard inventory is unavailable, a wider sourcing review can be used for shortage, allocated, obsolete or hard-to-find requirements. Send the exact MPN, quantity, target delivery date and any approved-source restrictions so the search can be narrowed more efficiently.

Excess Inventory and OEM Channels

OEM excess inventory can create additional sourcing opportunities for selected parts. Winsun (HK) Electronics also supports excess-list review, helping customers identify possible routes for unwanted or surplus electronic-component inventory.

Quality Control & Authenticity Review

For parts that require additional quality verification, the inspection path may be selected according to product risk, source and customer requirements. Available review methods can include:

Appearance inspection: review body markings, labels, packaging and visible condition against available reference information.
Electrical testing: evaluate electrical performance when an appropriate test method and equipment are available.
X-ray inspection: compare internal structure and construction features when X-ray review is required.
Decapsulation: inspect internal die information, manufacturer marks and related authenticity indicators when necessary.
Third-party testing: parts can be submitted to an independent laboratory when additional verification is requested or internal review is not sufficient.

Technical Support & Procurement Notes

Winsun (HK) Electronics combines sourcing work with accumulated QC and inspection experience to support customers before and after the sale. Before placing an order, confirm the exact part number, package, required quantity, date-code preference, packaging condition, delivery schedule and any documentation requirements.

Important: stock and pricing displayed online are sourcing references and may change. Final availability, source, lead time, commercial terms and requested quality documentation should be confirmed in the formal quotation.

SOURCING & QUALITY CONTROL

How We Support a 1SX280HU3F50E2VGS3 Requirement

Use the part number as the starting point, then define quantity, schedule, source restrictions and quality requirements so procurement can be reviewed more precisely.

Shortage & Obsolescence

For constrained or obsolete parts, sourcing can be expanded across qualified market channels and available OEM excess routes.

Supplier Screening

Source review can consider supplier history, reputation, quality records, market feedback and commercial competitiveness.

QC & Authenticity

Appearance, electrical, X-ray, decapsulation or third-party testing can be arranged according to the requirement and product risk.

Cost & Time Control

Procurement, logistics and after-sales coordination help align price breaks, delivery timing and order execution with your project.

Prototype / Low VolumeRequest the exact quantity needed for engineering or maintenance work.

Production SupplyReview price breaks, stock, packaging and delivery schedule.

Shortage / EOLOpen a wider search for constrained, obsolete or hard-to-find parts.

BOM ProcurementCombine this part with multiple lines for one coordinated sourcing request.

PRODUCT & SOURCING FAQ

1SX280HU3F50E2VGS3 Frequently Asked Questions

Practical answers for price, availability, quality review, shortage sourcing and BOM procurement.

Send the required quantity, delivery target and any date-code or packaging requirements. Stock, source and commercial terms are reconfirmed during quotation review.

Yes. Wider sourcing can include established market suppliers, distributor relationships and OEM excess channels when suitable sources are available.

Depending on the requirement and source, quality review may include appearance and packaging checks, electrical testing, X-ray inspection, decapsulation or qualified third-party testing.

Yes. This part can be submitted with other BOM lines so quantity, availability, lead time and sourcing options can be reviewed together.

Use online stock and pricing as sourcing references. Final quantity, source, price, lead time and documentation are confirmed in the formal quotation.

Yes. Add those requirements to the RFQ so available packaging details, date code and supporting documents can be checked before the order is finalized.

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FROM PART NUMBER TO SUPPLY ROUTE

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