Microcontrollers, Microprocessor, FPGA Modules
Browse available Microcontrollers, Microprocessor, FPGA Modules part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.
For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Module/Board Type | Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0728-03-1QIC MODULE CORTEX-A9 512MB |
2,830 | - |
|
Datasheet | TE0728 | Bulk | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7020) | - | 16MB | 512MB | Samtec SEM | 2.360" L x 2.360" W (60.00mm x 60.00mm) | - |
|
TE0803-04-3BE11-AIC MODULE ZYNQ USCALE 2GB 128MB |
4,352 | - |
|
Datasheet | TE0803 | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 85°C |
|
TE0803-01-03CG-1EAIC MODULE ZYNQ USCALE 2GB 128MB |
4,269 | - |
|
Datasheet | TE0803 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0741-05-A2I-1-AMODULE FPGA KINTEX |
3,290 | - |
|
Datasheet | Kintex™-7 | Bulk | Active | FPGA | Xilinx Kintex-7 FPGA XC7K70T-2FBG676I | - | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
|
|
TE0600-03-83I21-AIC MODULE GIGABEE |
2,643 | - |
|
Datasheet | - | Bulk | Not For New Designs | FPGA Core | Spartan-6 LX-150 | - | 125MHz | 16MB | 1GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
|
TE0820-05-4AE81MAMPSOC MODULE WITH XILINX ZYNQ UL |
2,345 | - |
|
Datasheet | - | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
|
TE0600-03-83I11-AIC MODULE GIGABEE |
2,799 | - |
|
Datasheet | - | Bulk | Not For New Designs | FPGA Core | Spartan-6 LX-150 | - | 125MHz | 16MB | 256MB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
|
5CSX-H6-4YA-RCIC MOD CORTEX-A9 800MHZ 1GB 32MB |
1,960 | - |
|
Datasheet | MitySOM | Bulk | Active | MPU, FPGA Core | ARM® Cortex®-A9, Cyclone V SX/SE | NEON™ SIMD | 800MHz | 32MB | 1GB | Edge Connector | 3.200" L x 1.500" W (82.00mm x 39.00mm) | 0°C ~ 70°C |
|
TE0813-01-4AE11-AMPSOC MODULE WITH XILINX ZYNQ UL |
4,404 | - |
|
Datasheet | Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0813-02-4AE81-AMPSOC MODULE WITH AMD ZYNQ ULTRA |
3,142 | - |
|
Datasheet | Zynq UltraScale+ | Bulk | Active | MPU Core | Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
|
SOMOMAP3530-21-1780AGIRIC MOD CORTEX-A8 600MHZ 256MB |
1,497 | - |
|
Datasheet | OMAP35x | Bulk | Active | MPU Core | ARM® Cortex®-A8, OMAP3530 | - | 600MHz | 512MB | 256MB | Board-to-Board (BTB) Socket - 200 | 0.590" L x 1.060" W (15.00mm x 27.00mm) | -40°C ~ 85°C |
|
ME-XU5-2EG-1I-D11E-R1.2SOM ZYNQ US+ ZU2EG 2GB+0.5GB PL |
1,058 | - |
|
Datasheet | - | Box | Obsolete | MPU, FPGA Core | ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU | - | 600MHz, 1.5GHz | 16GB | 512MB, 2GB | 168 Pin | 2.200" L x 2.130" W (56.00mm x 54.00mm) | -40°C ~ 85°C |
|
TE0813-01-3BE11-AMPSOC MODULE WITH XILINX ZYNQ UL |
3,799 | - |
|
Datasheet | Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0813-02-3BE81-AMPSOC MODULE WITH AMD ZYNQ ULTRA |
2,821 | - |
|
Datasheet | Zynq UltraScale+ | Bulk | Active | MPU Core | Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0821-01-3BE21MLMPSOC MODULE WITH XILINX ZYNQ UL |
1,709 | - |
|
Datasheet | TE0823 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 128MB | 2GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |
|
DBRF5110CIC MOD CORTEX-A9 800MHZ 1GB |
3,083 | - |
|
Datasheet | BORA | Box | Active | MPU, FPGA Core | ARM® Cortex®-A9, XC7Z020-3 | Artix-7 | 800MHz | 1GB (NAND), 32MB (NOR) | 1GB | 3 x 140 Pins 0.6mm Pitch | - | 0°C ~ 70°C |
|
TE0820-05-3BE81MAMPSOC MODULE WITH XILINX ZYNQ UL |
1,289 | - |
|
Datasheet | - | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
TE0821-01-3BE21MAMPSOC MODULE WITH XILINX ZYNQ UL |
4,195 | - |
|
Datasheet | TE0823 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 128MB | 2GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |
|
C10G-6T-4XA-RICYCLONE 10 GX MODULE, 220KLE, 1G |
4,107 | - |
|
Datasheet | MitySOM | Bulk | Active | FPGA Core | - | - | 100MHz | 32MB | 1GB | Board to Board (BTB) Socket, Card Edge | 2.750" L x 2.400" W (69.85mm x 60.96mm) | -40°C ~ 85°C |
|
AM0010-02-4AE21MAMPSOC MODULE WITH XILINX ZYNQ UL |
2,954 | - |
|
Datasheet | Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq™ UltraScale+™ ZU4CG-1E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket | 2.205" L x 1.575" W (56.00mm x 40.00mm) | 0°C ~ 85°C |
Microcontrollers, Microprocessor, FPGA Modules FAQ
Common questions about selecting, comparing and sourcing Microcontrollers, Microprocessor, FPGA Modules components through Winsun (HK) Electronics.
What should I check when selecting Microcontrollers, Microprocessor, FPGA Modules components?
Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.
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Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.
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