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Microcontrollers, Microprocessor, FPGA Modules

Browse available Microcontrollers, Microprocessor, FPGA Modules part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0728-03-1Q Trenz Electronic GmbH

TE0728-03-1Q

IC MODULE CORTEX-A9 512MB

Trenz Electronic GmbH

2,830 -
Datasheet TE0728 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7020) - 16MB 512MB Samtec SEM 2.360" L x 2.360" W (60.00mm x 60.00mm) -
TE0803-04-3BE11-A Trenz Electronic GmbH

TE0803-04-3BE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

4,352 -
Datasheet TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E - - 128MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0803-01-03CG-1EA Trenz Electronic GmbH

TE0803-01-03CG-1EA

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

4,269 -
Datasheet TE0803 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU3CG-1SFVC784E - - 128MB 2GB B2B 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0741-05-A2I-1-A Trenz Electronic GmbH

TE0741-05-A2I-1-A

MODULE FPGA KINTEX

Trenz Electronic GmbH

3,290 -
Datasheet Kintex™-7 Bulk Active FPGA Xilinx Kintex-7 FPGA XC7K70T-2FBG676I - - 32MB - Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0600-03-83I21-A Trenz Electronic GmbH

TE0600-03-83I21-A

IC MODULE GIGABEE

Trenz Electronic GmbH

2,643 -
Datasheet - Bulk Not For New Designs FPGA Core Spartan-6 LX-150 - 125MHz 16MB 1GB Samtec LSHM 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0820-05-4AE81MA Trenz Electronic GmbH

TE0820-05-4AE81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,345 -
Datasheet - Bulk Active - - - - - - - - -
TE0600-03-83I11-A Trenz Electronic GmbH

TE0600-03-83I11-A

IC MODULE GIGABEE

Trenz Electronic GmbH

2,799 -
Datasheet - Bulk Not For New Designs FPGA Core Spartan-6 LX-150 - 125MHz 16MB 256MB Samtec LSHM 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
5CSX-H6-4YA-RC Critical Link LLC

5CSX-H6-4YA-RC

IC MOD CORTEX-A9 800MHZ 1GB 32MB

Critical Link LLC

1,960 -
Datasheet MitySOM Bulk Active MPU, FPGA Core ARM® Cortex®-A9, Cyclone V SX/SE NEON™ SIMD 800MHz 32MB 1GB Edge Connector 3.200" L x 1.500" W (82.00mm x 39.00mm) 0°C ~ 70°C
TE0813-01-4AE11-A Trenz Electronic GmbH

TE0813-01-4AE11-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

4,404 -
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU4CG-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0813-02-4AE81-A Trenz Electronic GmbH

TE0813-02-4AE81-A

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

3,142 -
Datasheet Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
SOMOMAP3530-21-1780AGIR Beacon EmbeddedWorks

SOMOMAP3530-21-1780AGIR

IC MOD CORTEX-A8 600MHZ 256MB

Beacon EmbeddedWorks

1,497 -
Datasheet OMAP35x Bulk Active MPU Core ARM® Cortex®-A8, OMAP3530 - 600MHz 512MB 256MB Board-to-Board (BTB) Socket - 200 0.590" L x 1.060" W (15.00mm x 27.00mm) -40°C ~ 85°C
ME-XU5-2EG-1I-D11E-R1.2 Enclustra FPGA Solutions

ME-XU5-2EG-1I-D11E-R1.2

SOM ZYNQ US+ ZU2EG 2GB+0.5GB PL

Enclustra FPGA Solutions

1,058 -
Datasheet - Box Obsolete MPU, FPGA Core ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU - 600MHz, 1.5GHz 16GB 512MB, 2GB 168 Pin 2.200" L x 2.130" W (56.00mm x 54.00mm) -40°C ~ 85°C
TE0813-01-3BE11-A Trenz Electronic GmbH

TE0813-01-3BE11-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

3,799 -
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0813-02-3BE81-A Trenz Electronic GmbH

TE0813-02-3BE81-A

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

2,821 -
Datasheet Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0821-01-3BE21ML Trenz Electronic GmbH

TE0821-01-3BE21ML

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

1,709 -
Datasheet TE0823 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E ARM® Cortex®-A53, ARM® Cortex®-R5 - 128MB 2GB 2 x 100 Pin 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 85°C
DBRF5110C Dave Embedded Systems

DBRF5110C

IC MOD CORTEX-A9 800MHZ 1GB

Dave Embedded Systems

3,083 -
Datasheet BORA Box Active MPU, FPGA Core ARM® Cortex®-A9, XC7Z020-3 Artix-7 800MHz 1GB (NAND), 32MB (NOR) 1GB 3 x 140 Pins 0.6mm Pitch - 0°C ~ 70°C
TE0820-05-3BE81MA Trenz Electronic GmbH

TE0820-05-3BE81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

1,289 -
Datasheet - Bulk Active - - - - - - - - -
TE0821-01-3BE21MA Trenz Electronic GmbH

TE0821-01-3BE21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

4,195 -
Datasheet TE0823 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E ARM® Cortex®-A53, ARM® Cortex®-R5 - 128MB 2GB 2 x 100 Pin 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 85°C
C10G-6T-4XA-RI Critical Link LLC

C10G-6T-4XA-RI

CYCLONE 10 GX MODULE, 220KLE, 1G

Critical Link LLC

4,107 -
Datasheet MitySOM Bulk Active FPGA Core - - 100MHz 32MB 1GB Board to Board (BTB) Socket, Card Edge 2.750" L x 2.400" W (69.85mm x 60.96mm) -40°C ~ 85°C
AM0010-02-4AE21MA Trenz Electronic GmbH

AM0010-02-4AE21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,954 -
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU4CG-1E - - 128MB 4GB Board-to-Board (BTB) Socket 2.205" L x 1.575" W (56.00mm x 40.00mm) 0°C ~ 85°C
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WINSUN SOURCING SUPPORT

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Send the manufacturer, part number, quantity and target delivery requirement. Winsun (HK) Electronics can assist with availability checks, quotation support, shortage sourcing and hard-to-find or obsolete components.

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FREQUENTLY ASKED QUESTIONS

Microcontrollers, Microprocessor, FPGA Modules FAQ

Common questions about selecting, comparing and sourcing Microcontrollers, Microprocessor, FPGA Modules components through Winsun (HK) Electronics.

What should I check when selecting Microcontrollers, Microprocessor, FPGA Modules components?

Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

Can Winsun help source specific Microcontrollers, Microprocessor, FPGA Modules part numbers?

Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

Do you support shortage, obsolete or hard-to-find Microcontrollers, Microprocessor, FPGA Modules parts?

Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

How do I request a quote for Microcontrollers, Microprocessor, FPGA Modules components?

Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.