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Microcontrollers, Microprocessor, FPGA Modules

Browse available Microcontrollers, Microprocessor, FPGA Modules part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0745-02-91C31-A Trenz Electronic GmbH

TE0745-02-91C31-A

MOD SOM DDR3L 1GB

Trenz Electronic GmbH

1,730 -
Datasheet TE0745 Bulk Obsolete MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0817-01-4BE21-A Trenz Electronic GmbH

TE0817-01-4BE21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

4,324 -
Datasheet Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
IW-G30M-C4CG-4E002G-E008G-BIA iWave Global

IW-G30M-C4CG-4E002G-E008G-BIA

ZU4CG (-1 Speed) MPSoC SOM

iWave Global

1,676 -
Datasheet Zynq® UltraScale+™ Bulk Active MPU, FPG ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) ARM® Mali 400 MP2 1.5GHz, 600MHz 8GB eMMC 4GB, 1GB 2 x 240 Pin 4.330" L x 2.950" W (110.00mm x 75.00mm) -40°C ~ 85°C
TE0820-05-4DI81MA Trenz Electronic GmbH

TE0820-05-4DI81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

3,430 -
Datasheet - Bulk Active - - - - - - - - -
TE0807-03-4BE21-A Trenz Electronic GmbH

TE0807-03-4BE21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

3,177 -
Datasheet TE0807 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0807-03-4BE21-AK Trenz Electronic GmbH

TE0807-03-4BE21-AK

MPSOC MODULE TE0807 WITH ZYNQ UL

Trenz Electronic GmbH

4,598 -
Datasheet TE0807 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE21-L Trenz Electronic GmbH

TE0808-05-6BE21-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

4,459 -
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE81-L Trenz Electronic GmbH

TE0808-05-6BE81-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

3,500 -
Datasheet - Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE21-F Trenz Electronic GmbH

TE0808-05-6BE21-F

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

3,124 -
Datasheet - Bulk Active MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-01-6BE21-A Trenz Electronic GmbH

TE0818-01-6BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

4,121 -
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-02-6BE81-A Trenz Electronic GmbH

TE0818-02-6BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

2,233 -
Datasheet Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE21-A Trenz Electronic GmbH

TE0808-05-6BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,803 -
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE81-A Trenz Electronic GmbH

TE0808-05-6BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,315 -
Datasheet - Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE81-E Trenz Electronic GmbH

TE0808-05-6BE81-E

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

4,167 -
Datasheet - Bulk Active - - - - - - - - -
TE0808-04-6BE21-L Trenz Electronic GmbH

TE0808-04-6BE21-L

IC MOD SOM MPSOC 4GB XCZU6EG

Trenz Electronic GmbH

3,891 -
Datasheet TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0808-05-6BE81-AK Trenz Electronic GmbH

TE0808-05-6BE81-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,954 -
Datasheet - Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE21-AK Trenz Electronic GmbH

TE0808-05-6BE21-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,098 -
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-04-6BE21-AK Trenz Electronic GmbH

TE0808-04-6BE21-AK

IC MOD SOM MPSOC 4GB ZU6EG

Trenz Electronic GmbH

2,627 -
Datasheet TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0807-03-5AI21-A Trenz Electronic GmbH

TE0807-03-5AI21-A

MPSOC ZYNQ USCALE 4GB DDR4

Trenz Electronic GmbH

4,840 -
Datasheet - Box Active - - - - - - - - -
MOD5270BXX NXP USA Inc.

MOD5270BXX

IC MOD COLDFIRE 95MHZ 2.064MB

NXP USA Inc.

3,323 -
Datasheet - Bulk Obsolete MCU, Ethernet Core ColdFire 5270 - 95MHz 512KB 2.064MB RJ-45, 2x50 Header 2.600" L x 2.000" W (66.04mm x 50.80mm) 0°C ~ 70°C
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WINSUN SOURCING SUPPORT

Need Microcontrollers, Microprocessor, FPGA Modules Sourcing Support?

Send the manufacturer, part number, quantity and target delivery requirement. Winsun (HK) Electronics can assist with availability checks, quotation support, shortage sourcing and hard-to-find or obsolete components.

Global component sourcing support BOM, shortage and EOL support
FREQUENTLY ASKED QUESTIONS

Microcontrollers, Microprocessor, FPGA Modules FAQ

Common questions about selecting, comparing and sourcing Microcontrollers, Microprocessor, FPGA Modules components through Winsun (HK) Electronics.

What should I check when selecting Microcontrollers, Microprocessor, FPGA Modules components?

Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

Can Winsun help source specific Microcontrollers, Microprocessor, FPGA Modules part numbers?

Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

Do you support shortage, obsolete or hard-to-find Microcontrollers, Microprocessor, FPGA Modules parts?

Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

How do I request a quote for Microcontrollers, Microprocessor, FPGA Modules components?

Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.