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Microcontrollers, Microprocessor, FPGA Modules

Browse available Microcontrollers, Microprocessor, FPGA Modules part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0818-01-9GI21-AK Trenz Electronic GmbH

TE0818-01-9GI21-AK

ULTRASOM+ MPSOC-MODUL WITH ZYNQ

Trenz Electronic GmbH

4,082 -
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU9EG-2FFVC900I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0818-02-9GI81-AK Trenz Electronic GmbH

TE0818-02-9GI81-AK

ULTRASOM+ MPSOC-MODULE WITH AMD

Trenz Electronic GmbH

1,242 -
Datasheet - Bulk Active FPGA Zynq UltraScale+ XCZU9EG-2FFVC900I - - 128MB 4GB Board-to-Board (BTB) 4 x 240 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0745-03-92I31-AK Trenz Electronic GmbH

TE0745-03-92I31-AK

SOM WITH AMD ZYNQ 7045-2I AND HE

Trenz Electronic GmbH

4,967 -
Datasheet Zynq Bulk Active MPU Core ARM Cortex-A9 Xilinx Zynq 7045 SoC XC7Z045-2FBG676I - 64MB 1GB Samtec ST5 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0808-05-9GI21-AK Trenz Electronic GmbH

TE0808-05-9GI21-AK

ULTRASOM+ MPSOC-MODULE WITH ZYNQ

Trenz Electronic GmbH

4,108 -
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU9EG-2FFVC900I - - 128MB 4GB 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0808-05-9GI81-AK Trenz Electronic GmbH

TE0808-05-9GI81-AK

ULTRASOM+ MPSOC-MODULE WITH ZYNQ

Trenz Electronic GmbH

4,640 -
Datasheet - Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-BBE21-AK Trenz Electronic GmbH

TE0808-05-BBE21-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,878 -
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU15EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-BBE81-AK Trenz Electronic GmbH

TE0808-05-BBE81-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

2,470 -
Datasheet - Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-9GI21-EK Trenz Electronic GmbH

TE0808-05-9GI21-EK

ULTRASOM+ MPSOC-MODULE WITH AMD

Trenz Electronic GmbH

1,715 -
Datasheet - Bulk Obsolete - - - - - - - - -
EC-VA-H265-10B-60-1080-MD00C-SX660 System-On-Chip (SOC) Technologies Inc.

EC-VA-H265-10B-60-1080-MD00C-SX660

MOD H265 ENC 60FPS 1080 SODIMM

System-On-Chip (SOC) Technologies Inc.

4,167 -
Datasheet H.265-HD Encoder Box Active FPGA Core Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 1.5GHz 128KB 512MB - - -
EC-VA-H264-10B-60-4K-MD00C-SX660 System-On-Chip (SOC) Technologies Inc.

EC-VA-H264-10B-60-4K-MD00C-SX660

MOD H264 EN 60FPS 4K SX660 SODIM

System-On-Chip (SOC) Technologies Inc.

2,691 -
Datasheet H.264-HD Encoder Box Active FPGA Core Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 1.5GHz 128KB 512MB - - -
DC-VA-H264-10B-60-4K-MD00C-SX660 System-On-Chip (SOC) Technologies Inc.

DC-VA-H264-10B-60-4K-MD00C-SX660

MOD H264 DE 60FPS 4K SX660 SODIM

System-On-Chip (SOC) Technologies Inc.

3,952 -
Datasheet H.264-HD Encoder Box Active FPGA Core Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 1.5GHz 128KB 512MB - - -
TE0841-02-41I21-L Trenz Electronic GmbH

TE0841-02-41I21-L

IC MODULE

Trenz Electronic GmbH

2,688 -
Datasheet TE0841 Bulk Discontinued at Digi-Key FPGA Core Kintex UltraScale KU040 - - 64MB 2GB B2B 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0808-04-BBE21-A Trenz Electronic GmbH

TE0808-04-BBE21-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

4,584 -
Datasheet TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU15EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0808-04-BBE21-AK Trenz Electronic GmbH

TE0808-04-BBE21-AK

IC MOD SOM MPSOC 4GB ZU15G

Trenz Electronic GmbH

1,858 -
Datasheet TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU15EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0841-02-41C21-A Trenz Electronic GmbH

TE0841-02-41C21-A

IC MODULE USCALE 2GB

Trenz Electronic GmbH

2,536 -
Datasheet TE0841 Bulk Discontinued at Digi-Key MCU, FPGA Kintex UltraScale KU40 - - 64MB 2GB B2B 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 70°C
TE0808-05-9GI21-A Trenz Electronic GmbH

TE0808-05-9GI21-A

USOM+ MPSOC ZYNQ USCALE FPGA

Trenz Electronic GmbH

2,110 -
Datasheet TE0808 Box Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU9EG-2FFVC900I - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
2DC-VA-H264-10B-30-4K-MD00C-SX660 System-On-Chip (SOC) Technologies Inc.

2DC-VA-H264-10B-30-4K-MD00C-SX660

MOD H264 DE 30FPS 4K SX660 SODIM

System-On-Chip (SOC) Technologies Inc.

1,939 -
Datasheet H.264-HD Encoder Box Active FPGA Core Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 1.5GHz 128KB 512MB - - -
2EC-VA-H264-10B-30-4K-MD00C-SX660 System-On-Chip (SOC) Technologies Inc.

2EC-VA-H264-10B-30-4K-MD00C-SX660

MOD H264 EN 30FPS 4K SX660 SODIM

System-On-Chip (SOC) Technologies Inc.

2,368 -
Datasheet H.264-HD Encoder Box Active FPGA Core Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 1.5GHz 128KB 512MB - - -
EC-VA-H265-10B-60-4K-MD00C-SX660 System-On-Chip (SOC) Technologies Inc.

EC-VA-H265-10B-60-4K-MD00C-SX660

MOD H265 EN 60FPS 4K SX660 SODIM

System-On-Chip (SOC) Technologies Inc.

1,024 -
Datasheet H.265-HD Encoder Box Active FPGA Core Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 1.5GHz 128KB 512MB - - -
TE0807-03-7DE21-AZ Trenz Electronic GmbH

TE0807-03-7DE21-AZ

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

1,017 -
Datasheet Zynq UltraScale+ Bulk Obsolete MPU Core Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
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WINSUN SOURCING SUPPORT

Need Microcontrollers, Microprocessor, FPGA Modules Sourcing Support?

Send the manufacturer, part number, quantity and target delivery requirement. Winsun (HK) Electronics can assist with availability checks, quotation support, shortage sourcing and hard-to-find or obsolete components.

Global component sourcing support BOM, shortage and EOL support
FREQUENTLY ASKED QUESTIONS

Microcontrollers, Microprocessor, FPGA Modules FAQ

Common questions about selecting, comparing and sourcing Microcontrollers, Microprocessor, FPGA Modules components through Winsun (HK) Electronics.

What should I check when selecting Microcontrollers, Microprocessor, FPGA Modules components?

Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

Can Winsun help source specific Microcontrollers, Microprocessor, FPGA Modules part numbers?

Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

Do you support shortage, obsolete or hard-to-find Microcontrollers, Microprocessor, FPGA Modules parts?

Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

How do I request a quote for Microcontrollers, Microprocessor, FPGA Modules components?

Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.