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Microcontrollers, Microprocessor, FPGA Modules

Browse available Microcontrollers, Microprocessor, FPGA Modules part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.

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Datasheets & Specifications Access technical references quickly
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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0783-02-92I33MA Trenz Electronic GmbH

TE0783-02-92I33MA

HIGH-PERFORMANCE SOM WITH XILINX

Trenz Electronic GmbH

3,537 -
Datasheet TE0782 Bulk Active MPU Core Zynq™ 7000 XC7Z045-2FFG900I ARM Cortex-A9 - 32MB 1GB Board-to-Board (BTB) Socket 3.350" L x 3.350" W (85.00mm x 85.00mm) -40°C ~ 85°C
TE0782-02-92I33MA Trenz Electronic GmbH

TE0782-02-92I33MA

IC MODULE CORTEX

Trenz Electronic GmbH

3,900 -
Datasheet TE0782 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 32MB 1GB Board-to-Board (BTB) Socket 3.350" L x 3.350" W (85.00mm x 85.00mm) -40°C ~ 85°C
TE0807-03-7AI21-A Trenz Electronic GmbH

TE0807-03-7AI21-A

MPSOC ZYNQ USCALE 4GB DDR4

Trenz Electronic GmbH

3,887 -
Datasheet TE0807 Box Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU7CG-1FBVB900I - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0817-01-7DI21-A Trenz Electronic GmbH

TE0817-01-7DI21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,736 -
Datasheet Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq UltraScale+ XCZU7EV-1FBVB900I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0807-03-7DI21-AZ Trenz Electronic GmbH

TE0807-03-7DI21-AZ

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

1,021 -
Datasheet Zynq UltraScale+ Bulk Obsolete MPU Core Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900I - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 160 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
DC-VA-H264-10B-60-4K-OPVIC-0000 System-On-Chip (SOC) Technologies Inc.

DC-VA-H264-10B-60-4K-OPVIC-0000

DECODER H264 4K VID/AUD 10BIT

System-On-Chip (SOC) Technologies Inc.

3,898 -
Datasheet * Box Active - - - - - - - - -
EC-VA-H265-10B-60-1080-OPVIC-0000 System-On-Chip (SOC) Technologies Inc.

EC-VA-H265-10B-60-1080-OPVIC-0000

ENCODER H265 HD VID/AUD 10BIT

System-On-Chip (SOC) Technologies Inc.

3,428 -
Datasheet - Box Active - - - - - - - - -
EC-VA-H264-10B-60-4K-OPVIC-0000 System-On-Chip (SOC) Technologies Inc.

EC-VA-H264-10B-60-4K-OPVIC-0000

ENCODER H264 4K VID/AUD 10BIT

System-On-Chip (SOC) Technologies Inc.

4,446 -
Datasheet - Box Active - - - - - - - - -
A5EB-B9-C7F-RC-SBC Critical Link LLC

A5EB-B9-C7F-RC-SBC

AGILEX 5E SINGLE BOARD COMPUTER,

Critical Link LLC

2,945 -
Datasheet - Bulk Active MPU Core ARM® Cortex®-A55, ARM® Cortex®-A76 - 1.8GHz 64GB eMMC, 32MB QSPI 8GB RJ45 8.500" L x 6.000" W (215.90mm x 152.40mm) 0°C ~ 70°C
A5EB-B9-C7F-RC-SBC-X Critical Link LLC

A5EB-B9-C7F-RC-SBC-X

AGILEX 5E SINGLE BOARD COMPUTER

Critical Link LLC

4,387 -
Datasheet - Bulk Active MPU Core ARM® Cortex®-A55, ARM® Cortex®-A76 - 1.8GHz 64GB eMMC, 32MB QSPI 8GB RJ45 8.500" L x 6.000" W (215.90mm x 152.40mm) 0°C ~ 70°C
EC-VA-H265-10B-60-4K-OPVIC-0000 System-On-Chip (SOC) Technologies Inc.

EC-VA-H265-10B-60-4K-OPVIC-0000

ENCODER H265 4K VID/AUD 10BIT

System-On-Chip (SOC) Technologies Inc.

4,102 -
Datasheet * Box Active - - - - - - - - -
TEC0850-03-BBEX1-A Trenz Electronic GmbH

TEC0850-03-BBEX1-A

IC MODULE

Trenz Electronic GmbH

2,351 -
Datasheet * Bulk Active - - - - - - - - -
TE0865-02-ABI21MA Trenz Electronic GmbH

TE0865-02-ABI21MA

MPSOC MODULE WITH ZYNQ ULTRASCAL

Trenz Electronic GmbH

2,447 -
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I - - 256MB 4GB Board-to-Board (BTB) Socket 3.937" L x 2.953" W (100.00mm x 75.00mm) 0°C ~ 85°C
CC-9C-V223-RJ-25 Digi

CC-9C-V223-RJ-25

IC MODULE ARM926EJ-S 155MHZ

Digi

4,185 -
Datasheet ConnectCore® Bulk Obsolete MPU Core ARM926EJ-S, NS9360 - 155MHz - - SO-DIMM-144 2.060" L x 3.590" W (52.20mm x 91.20mm) -40°C ~ 85°C
TE0865-02-FBE23MA Trenz Electronic GmbH

TE0865-02-FBE23MA

MPSOC MODULE WITH ZYNQ ULTRASCAL

Trenz Electronic GmbH

4,582 -
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E - - 256MB 4GB Board-to-Board (BTB) Socket 3.937" L x 2.953" W (100.00mm x 75.00mm) 0°C ~ 85°C
ME-XU7-15EG-2I-D12E-R5.0 Enclustra FPGA Solutions

ME-XU7-15EG-2I-D12E-R5.0

SOM ZYNQ XU7 US+ ZU15EG

Enclustra FPGA Solutions

1,355 -
Datasheet Mercury+ XU7 Bulk Active MPU Core ARM® Cortex®-A53, ARM® Cortex®-R5 Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I - 16GB 2GB 168 Pin 2.910" L x 2.130" W (74.00mm x 54.00mm) -40°C ~ 85°C
TE0865-02-DGE23MA Trenz Electronic GmbH

TE0865-02-DGE23MA

MPSOC MODULE WITH ZYNQ ULTRASCAL

Trenz Electronic GmbH

4,028 -
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E - - 256MB 4GB Board-to-Board (BTB) Socket 3.937" L x 2.953" W (100.00mm x 75.00mm) 0°C ~ 85°C
TE0835-02-MXE21-A Trenz Electronic GmbH

TE0835-02-MXE21-A

RFSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

3,079 -
Datasheet Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E ARM® Cortex®-A53, ARM® Cortex®-R5 1.3GHz 128MB 4GB Board-to-Board (BTB) Socket 3.543" L x 2.559" W (90.00mm x 65.00mm) 0°C ~ 85°C
IW-G35M-19EG-4E004G-E008G-BEF iWave Global

IW-G35M-19EG-4E004G-E008G-BEF

ZU19EG (-3 SPEED) MPSOC SOM

iWave Global

2,727 -
Datasheet - Bulk Active - - - - - - - - -
TE0835-02-TXE21-A Trenz Electronic GmbH

TE0835-02-TXE21-A

RFSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,310 -
Datasheet Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E ARM® Cortex®-A53 1.3GHz 512MB 4GB Board-to-Board (BTB) Socket 3.543" L x 2.559" W (90.00mm x 65.00mm) 0°C ~ 85°C
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WINSUN SOURCING SUPPORT

Need Microcontrollers, Microprocessor, FPGA Modules Sourcing Support?

Send the manufacturer, part number, quantity and target delivery requirement. Winsun (HK) Electronics can assist with availability checks, quotation support, shortage sourcing and hard-to-find or obsolete components.

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FREQUENTLY ASKED QUESTIONS

Microcontrollers, Microprocessor, FPGA Modules FAQ

Common questions about selecting, comparing and sourcing Microcontrollers, Microprocessor, FPGA Modules components through Winsun (HK) Electronics.

What should I check when selecting Microcontrollers, Microprocessor, FPGA Modules components?

Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

Can Winsun help source specific Microcontrollers, Microprocessor, FPGA Modules part numbers?

Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

Do you support shortage, obsolete or hard-to-find Microcontrollers, Microprocessor, FPGA Modules parts?

Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

How do I request a quote for Microcontrollers, Microprocessor, FPGA Modules components?

Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.