Microcontrollers, Microprocessor, FPGA Modules

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Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Module/Board Type	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0817-01-7DE21-A MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	1,011	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Obsolete	MPU Core	Zynq UltraScale+ XCZU7EV-1FBVB900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0782-02-82I33MA IC MODULE CORTEX Trenz Electronic GmbH	1,003	-	RFQ	Datasheet	TE0782	Bulk	Active	MCU, FPGA	ARM Cortex-A9	Zynq-7000 (Z-7035)	-	32MB	1GB	Board-to-Board (BTB) Socket	3.350" L x 3.350" W (85.00mm x 85.00mm)	-40°C ~ 85°C
CC-9P-V502-ZA-C-B IC MOD ARM926EJ-S 150MHZ 8MB Digi	4,986	-	RFQ	Datasheet	ConnectCore®	Bulk	Obsolete	MPU Core	ARM926EJ-S, NS9215	-	150MHz	4MB	8MB	Board-to-Board (BTB) Socket - 160	1.970" L x 1.970" W (50.00mm x 50.00mm)	-40°C ~ 85°C
TE0807-03-7DE21-A MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	4,922	-	RFQ	Datasheet	TE0807	Bulk	Discontinued at Digi-Key	MPU Core	Zynq UltraScale+ XCZU7EV-1FBVB900E	-	-	128MB	4GB	4 x 160 Pin	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0745-02-92I31-F MOD SOM DDR3L 1GB Trenz Electronic GmbH	4,651	-	RFQ	Datasheet	TE0745	Bulk	Active	MCU, FPGA	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0807-03-7DE21-AK MPSOC MODULE TE0807 WITH ZYNQ UL Trenz Electronic GmbH	3,489	-	RFQ	Datasheet	TE0807	Bulk	Discontinued at Digi-Key	MPU Core	Zynq UltraScale+ XCZU7EV-1FBVB900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
EC-VA-H264-10B-60-1080-OPVXC-0000 ENCODER H264 HD VID/AUD 10BIT System-On-Chip (SOC) Technologies Inc.	2,494	-	RFQ	Datasheet	-	Box	Active	-	-	-	-	-	-	-	-	-
EC-VA-MPEG2-8B-60-1080-OPVXC-0000 ENCODER MEPG2 HD VID/AUD 8BIT System-On-Chip (SOC) Technologies Inc.	1,001	-	RFQ	Datasheet	-	Box	Active	-	-	-	-	-	-	-	-	-
2EC-VA-H265-10B-30-4K-MD00C-SX660 MOD H265 EN 30FPS 4K SX660 SODIM System-On-Chip (SOC) Technologies Inc.	4,525	-	RFQ	Datasheet	H.264-HD Encoder	Box	Active	FPGA Core	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	1.5GHz	128KB	512MB	-	-	-
DC-VA-MEPG2-8B-60-1080-OPVXC-0000 DECODER MEPG2 HD VID/AUD 8BIT System-On-Chip (SOC) Technologies Inc.	2,621	-	RFQ	Datasheet	*	Box	Active	-	-	-	-	-	-	-	-	-
4EC-VA-H265-10B-60-1080-MD00C-SX660 MOD H265 ENC 60FPS 1080 SODIMM System-On-Chip (SOC) Technologies Inc.	2,530	-	RFQ	Datasheet	H.265-HD Encoder	Box	Active	FPGA Core	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	1.5GHz	128KB	512MB	-	-	-
DC-VA-H264-10B-60-1080-OPVXC-0000 DECODER H264 HD VID/AUD 10BIT System-On-Chip (SOC) Technologies Inc.	3,787	-	RFQ	Datasheet	*	Box	Active	-	-	-	-	-	-	-	-	-
A10S-P9-A5E-RC-SB ARRIA 10 SOC MODULE, 480KLE, 6GB Critical Link LLC	2,348	-	RFQ	Datasheet	MitySOM	Bag	Active	MPU, FPGA Core	ARM® Cortex®-A9	NEON™ SIMD	1.2GHz	-	4GB	Board-to-Board (BTB)	4.000" L x 4.000" W (101.50mm x 101.50mm)	0°C ~ 70°C
TE0745-02-93E31-A MOD SOM DDR3L 1GB Trenz Electronic GmbH	3,380	-	RFQ	Datasheet	TE0745	Bulk	Active	MCU, FPGA	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0808-05-BBE21-AZ MODULE MPSOC 2GB DDR4 Trenz Electronic GmbH	2,396	-	RFQ	Datasheet	-	Box	Discontinued at Digi-Key	FPGA Core	Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0817-01-7AI21-A MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	4,853	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Obsolete	MPU Core	Zynq UltraScale+ XCZU7CG-1FBVB900I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
ME-XU8-7EV-2I-D12E-R2.1 SOM ZYNQ US+ ZU7EV 4GB+2GB PL Enclustra FPGA Solutions	1,129	-	RFQ	Datasheet	-	Box	Obsolete	MPU, FPGA Core	ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU	-	533MHz, 1.333GHz	16GB	2GB, 4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0745-03-93E31-A SOM WITH AMD ZYNQ 7045-3E, 1 GBY Trenz Electronic GmbH	2,084	-	RFQ	Datasheet	Zynq	Bulk	Active	MPU Core	ARM Cortex-A9	Xilinx Zynq 7045 SoC XC7Z045-3FFG676E	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0745-02-93E31-AK SOM WITH XILINX ZYNQ 7045-3E AND Trenz Electronic GmbH	2,036	-	RFQ	Datasheet	TE0745	Bulk	Active	MPU Core	Zynq™ 7045 SoC XC7Z045-3FFG676E	ARM Cortex-A9	-	64MB	1GB	Board-to-Board (BTB) Socket	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
TE0745-03-93E31-AK SOM WITH AMD ZYNQ 7045-3E AND HE Trenz Electronic GmbH	2,929	-	RFQ	Datasheet	Zynq	Bulk	Active	MPU Core	ARM Cortex-A9	Xilinx Zynq 7045 SoC XC7Z045-3FFG676E	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C

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Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

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