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Microcontrollers, Microprocessor, FPGA Modules

Browse available Microcontrollers, Microprocessor, FPGA Modules part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0803-04-5DE11-A Trenz Electronic GmbH

TE0803-04-5DE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

1,094 -
Datasheet TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU5EV-1SFVC784E - - 128MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0813-01-5DE11-A Trenz Electronic GmbH

TE0813-01-5DE11-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,502 -
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU5EV-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0817-01-4AI21-A Trenz Electronic GmbH

TE0817-01-4AI21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

4,229 -
Datasheet Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq UltraScale+ XCZU4CG-1FBVB900I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0813-02-5DE81-A Trenz Electronic GmbH

TE0813-02-5DE81-A

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

4,640 -
Datasheet Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-9BE81-L Trenz Electronic GmbH

TE0808-05-9BE81-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,513 -
Datasheet TE0808 Bulk Active MPU Core - - - 128MB 4GB - 2.990" L x 2.050" W (76.00mm x 52.00mm) -
TE0808-05-9BE21-L Trenz Electronic GmbH

TE0808-05-9BE21-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

4,646 -
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU9EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-9BE21-F Trenz Electronic GmbH

TE0808-05-9BE21-F

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

1,690 -
Datasheet - Bulk Active - - - - - - - - -
TE0818-01-9BE21-A Trenz Electronic GmbH

TE0818-01-9BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,513 -
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU9EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
AM0010-02-5DE21MA Trenz Electronic GmbH

AM0010-02-5DE21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

1,495 -
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU5EV-1E - - 128MB 4GB Board-to-Board (BTB) Socket 2.220" L x 1.575" W (56.40mm x 40.00mm) 0°C ~ 85°C
TE0808-05-9BE81-A Trenz Electronic GmbH

TE0808-05-9BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,938 -
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core - - - 128MB 4GB - 2.990" L x 2.050" W (76.00mm x 52.00mm) -
TE0808-05-9BE21-E Trenz Electronic GmbH

TE0808-05-9BE21-E

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

4,206 -
Datasheet - Bulk Active - - - - - - - - -
TE0807-03-4AI21-A Trenz Electronic GmbH

TE0807-03-4AI21-A

MPSOC ZYNQ USCALE 4GB DDR4

Trenz Electronic GmbH

2,217 -
Datasheet TE0807 Box Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU4CG-1FBVB900I - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0808-04-9BE21-L Trenz Electronic GmbH

TE0808-04-9BE21-L

IC MOD SOM MPSOC 4GB XCZU9EG

Trenz Electronic GmbH

1,468 -
Datasheet TE0808 Box Active MPU Core - - - 128MB 4GB B2B - -
TE0808-05-9BE21-LZ Trenz Electronic GmbH

TE0808-05-9BE21-LZ

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

3,688 -
Datasheet Zynq UltraScale+ Bulk Obsolete MPU Core Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-02-9BE81-A Trenz Electronic GmbH

TE0818-02-9BE81-A

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

1,036 -
Datasheet Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-9BE81-AK Trenz Electronic GmbH

TE0808-05-9BE81-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,118 -
Datasheet - Bulk Discontinued at Digi-Key - - - - - - - - -
ME-AA1-480-2I3-D12E-NFX3-R2 Enclustra FPGA Solutions

ME-AA1-480-2I3-D12E-NFX3-R2

SOM ARRIA 10 10AS048 4GB

Enclustra FPGA Solutions

1,484 -
Datasheet - Bulk Active - - - - - - - - -
TE0807-03-7DI21-A Trenz Electronic GmbH

TE0807-03-7DI21-A

MPSOC ZYNQ USCALE 4GB DDR4

Trenz Electronic GmbH

3,063 -
Datasheet TE0807 Box Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU7EV-1FBVB900I - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0741-05-G2C-1-A Trenz Electronic GmbH

TE0741-05-G2C-1-A

MODULE FPGA KINTEX

Trenz Electronic GmbH

1,865 -
Datasheet Kintex™-7 Bulk Active FPGA Xilinx Kintex-7 FPGA XC7K410T-2FBG676C - - 32MB - Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 70°C
TE0841-02-31C21-A Trenz Electronic GmbH

TE0841-02-31C21-A

IC MODULE

Trenz Electronic GmbH

3,136 -
Datasheet TE0841 Bulk Discontinued at Digi-Key FPGA Core Kintex UltraScale KU035 - - 64MB 2GB B2B 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 70°C
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WINSUN SOURCING SUPPORT

Need Microcontrollers, Microprocessor, FPGA Modules Sourcing Support?

Send the manufacturer, part number, quantity and target delivery requirement. Winsun (HK) Electronics can assist with availability checks, quotation support, shortage sourcing and hard-to-find or obsolete components.

Global component sourcing support BOM, shortage and EOL support
FREQUENTLY ASKED QUESTIONS

Microcontrollers, Microprocessor, FPGA Modules FAQ

Common questions about selecting, comparing and sourcing Microcontrollers, Microprocessor, FPGA Modules components through Winsun (HK) Electronics.

What should I check when selecting Microcontrollers, Microprocessor, FPGA Modules components?

Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

Can Winsun help source specific Microcontrollers, Microprocessor, FPGA Modules part numbers?

Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

Do you support shortage, obsolete or hard-to-find Microcontrollers, Microprocessor, FPGA Modules parts?

Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

How do I request a quote for Microcontrollers, Microprocessor, FPGA Modules components?

Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.