System On Chip (SoC)

Use the filters and product table below to compare System On Chip (SoC) components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.

If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.

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Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Package/Case	Packaging	Product Status	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Grade	Qualification	Supplier Device Package
M2S025TS-1VFG400T2 IC SOC CORTEX-M3 166MHZ 400VFBGA Microchip Technology	3,514	-	RFQ	Datasheet	SmartFusion®2	400-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 125°C (TJ)	Automotive	AEC-Q100	400-VFBGA (17x17)
M2S060TS-1FGG484T2 IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	1,331	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	-40°C ~ 125°C (TJ)	Automotive	AEC-Q100	484-FPBGA (23x23)
M2S060TS-1FGG676T2 IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	3,114	-	RFQ	Datasheet	SmartFusion®2	676-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	-40°C ~ 125°C (TJ)	Automotive	AEC-Q100	676-FBGA (27x27)
M2S060TS-1VFG400T2 IC SOC CORTEX-M3 166MHZ 400VFBGA Microchip Technology	2,577	-	RFQ	Datasheet	SmartFusion®2	400-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	-40°C ~ 125°C (TJ)	Automotive	AEC-Q100	400-VFBGA (17x17)
M2S090TS-1FGG484T2 IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	2,544	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-40°C ~ 125°C (TJ)	Automotive	AEC-Q100	484-FPBGA (23x23)
M2S090TS-1FGG676T2 IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	3,991	-	RFQ	Datasheet	SmartFusion®2	676-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-40°C ~ 125°C (TJ)	Automotive	AEC-Q100	676-FBGA (27x27)
M2S005S-1TQG144T2 IC SOC CORTEX-M3 166MHZ 144TQFP Microchip Technology	2,674	-	RFQ	Datasheet	SmartFusion®2	144-LQFP	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	128KB	64KB	-	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	0°C ~ 85°C (TJ)	-	-	144-TQFP (20x20)
MPFS250TS-FC1152M IC SOC RISC-V 1152FCBGA Microchip Technology	1,476	-	RFQ	Datasheet	PolarFire®	1152-BBGA, FCBGA	Tray	Active	MPU, FPGA	RISC-V	128kB	2.2MB	DMA, PCI, PWM	CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG	-	FPGA - 254K Logic Modules	-	-	-	1152-FCBGA (35x35)
MPFS460T-FCG1152IPP IC SOC RISC-V 1152FCBGA Microchip Technology	1,150	-	RFQ	Datasheet	PolarFire®	1152-BBGA, FCBGA	Tray	Active	MPU, FPGA	RISC-V	128kB	3.95MB	DMA, PCI, PWM	CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG	-	FPGA - 461K Logic Modules	-40°C ~ 100°C	-	-	1152-FCBGA (35x35)
MPFS250T-FCVG784EES IC SOC RISC-V 784FCBGA Microchip Technology	4,320	-	RFQ	Datasheet	PolarFire®	784-BFBGA, FCBGA	Tray	Active	MPU, FPGA	RISC-V	128kB	2.2MB	DMA, PCI, PWM	CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG	-	FPGA - 254K Logic Modules	0°C ~ 100°C	-	-	784-FCBGA (23x23)

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FREQUENTLY ASKED QUESTIONS

System On Chip (SoC) FAQ

Common questions about filtering, comparing and sourcing System On Chip (SoC) components.

How can I narrow the System On Chip (SoC) selection?

Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.

Should I confirm the datasheet before selecting a part?

Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.

Can Winsun (HK) Electronics help source a specific System On Chip (SoC) part number?

Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.

Do you support BOM, shortage or alternative-part requirements?

Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.