System On Chip (SoC)
Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.
For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AGFA027R31C2E3EIC FPGA AGILEX-F 3184FBGA |
1,496 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
|
|
AGFA027R31C2E2VIC FPGA AGILEX-F 3184FBGA |
3,264 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
|
|
AGFA027R31C2E2VBIC FPGA AGILEX-F 3184BGA |
2,831 | - |
|
Datasheet | Agilex F | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
|
AGFB027R31C2E3EIC FPGA AGILEX-F 3184FBGA |
3,366 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
|
|
AGFB027R31C2E2VIC FPGA AGILEX-F 3184FBGA |
3,335 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
|
|
AGFB027R31C2E2VAAIC FPGA AGILEX-F 3184FBGA |
1,580 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
|
|
AGFB027R31C2E2VBIC FPGA AGILEX-F 3184BGA |
4,893 | - |
|
Datasheet | Agilex F | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
XCVC1502-1LLIVSVA2197IC VERSAL AI-CORE FPGA 2197BGA |
2,726 | - |
|
Datasheet | Versal™ AI Core | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ Prime FPGA, 80k Logic Cells | -40°C ~ 100°C (TJ) | - | - | 2197-FCBGA (45x45) |
|
XCVC1502-2LLEVSVA2197IC VERSAL AI-CORE FPGA 2197BGA |
1,950 | - |
|
Datasheet | Versal™ AI Core | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 450MHz, 1.08GHz | Versal™ AI Core FPGA, 800k Logic Cells | 0°C ~ 100°C (TJ) | - | - | 2197-FCBGA (45x45) |
|
|
AGFA023R31C2E4XIC FPGA AGILEX-F 3184FBGA |
4,574 | - |
|
Datasheet | Agilex F | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
|
AGFB023R31C2E4XIC FPGA AGILEX-F 3184FBGA |
4,019 | - |
|
Datasheet | Agilex F | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
XCZU46DR-L1FFVH1760IIC ZUP RFSOC A53 FPGA LP 1760BGA |
1,372 | - |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1760-FCBGA (42.5x42.5) |
|
|
XCZU46DR-2FFVH1760EIC ZUP RFSOC A53 FPGA 1760BGA |
1,807 | - |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1760-FCBGA (42.5x42.5) |
|
XCZU46DR-2FSVH1760EIC ZUP RFSOC A53 FPGA 1760BGA |
3,917 | - |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1760-FCBGA (42.5x42.5) |
|
|
XCZU46DR-L1FSVH1760IIC ZUP RFSOC A53 FPGA LP 1760BGA |
1,163 | - |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1760-FCBGA (42.5x42.5) |
|
|
AGFC023R25A1I1VIC FPGA AGILEX-F 2581FBGA |
1,067 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
|
|
AGIB027R31A2E3VIC FPGA AGILEX-I 3184BGA |
4,847 | - |
|
Datasheet | Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
|
AGFD023R25A1I1VIC FPGA AGILEX-F 2581FBGA |
4,033 | - |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
|
|
XCVE1752-2LLEVSVA2197IC VERSAL AI-EDGE FPGA 2197BGA |
4,624 | - |
|
Datasheet | Versal™ AI Core | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 450MHz, 1.08GHz | Versal™ AI Core FPGA, 1M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 2197-FCBGA (45x45) |
|
|
XCVE1752-1LLIVSVA2197IC VERSAL AI-EDGE FPGA 2197BGA |
2,022 | - |
|
Datasheet | Versal™ AI Core | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ AI Core FPGA, 1M Logic Cells | -40°C ~ 100°C (TJ) | - | - | 2197-FCBGA (45x45) |
System On Chip (SoC) FAQ
Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.
What should I check when selecting System On Chip (SoC) components?
Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.
Can Winsun help source specific System On Chip (SoC) part numbers?
Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.
Do you support shortage, obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.
How do I request a quote for System On Chip (SoC) components?
Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.
