System On Chip (SoC)

Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

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Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Package/Case	Packaging	Product Status	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Grade	Qualification	Supplier Device Package
M2S005S-FGG484 IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	1,203	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	128KB	64KB	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	0°C ~ 85°C (TJ)	-	-	484-FPBGA (23x23)
M2S005S-1VF256I IC SOC CORTEX-M3 166MHZ 256FBGA Microchip Technology	2,874	-	RFQ	Datasheet	SmartFusion®2	256-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	128KB	64KB	-	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	-40°C ~ 100°C (TJ)	-	-	256-FPBGA (14x14)
MIMX8SL1AVNFZABR MIMX8SL1AVNFZABR NXP USA Inc.	1,763	-	RFQ	Datasheet	i.MX8X	388-LFBGA	Tape & Reel (TR)	Active	MPU	ARM® Cortex®-A35, ARM® Cortex®-M4	-	256KB	DMA, PWM, WDT	AC'97, CANbus, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART	1.2GHz, 264MHz	-	-40°C ~ 125°C (TJ)	-	-	388-LBGA (15x15)
DRA821U2CGBALM DUAL ARM CORTEX-A72 QUAD CORTEX Texas Instruments	3,192	-	RFQ	Datasheet	Jacinto™	433-BFBGA, FCBGA	Bulk	Active	MCU, MPU	ARM® Cortex®-A72, ARM® Cortex®-R5F	-	1.5MB	DMA, PWM, WDT	Ethernet, I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB	750MHz, 500MHz	-	-40°C ~ 105°C (TJ)	-	-	433-FCBGA (17.2x17.2)
M2S005S-1VF400I IC SOC CORTEX-M3 166MHZ 400VFBGA Microchip Technology	1,671	-	RFQ	Datasheet	SmartFusion®2	400-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	128KB	64KB	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	-40°C ~ 100°C (TJ)	-	-	400-VFBGA (17x17)
M2S005S-1VFG400I IC SOC CORTEX-M3 166MHZ 400VFBGA Microchip Technology	1,778	-	RFQ	Datasheet	SmartFusion®2	400-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	128KB	64KB	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	-40°C ~ 100°C (TJ)	-	-	400-VFBGA (17x17)
M2S005-1FG484I IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	2,881	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	128KB	64KB	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	-40°C ~ 100°C (TJ)	-	-	484-FPBGA (23x23)
M2S005-1FGG484I IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	4,069	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	128KB	64KB	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	-40°C ~ 100°C (TJ)	-	-	484-FPBGA (23x23)
M2S005S-1FG484 IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	2,702	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	128KB	64KB	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	0°C ~ 85°C (TJ)	-	-	484-FPBGA (23x23)
M2S005S-1FGG484 IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	4,305	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	128KB	64KB	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	0°C ~ 85°C (TJ)	-	-	484-FPBGA (23x23)
M2S005S-FG484I IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	4,417	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	128KB	64KB	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	-40°C ~ 100°C (TJ)	-	-	484-FPBGA (23x23)
M2S005S-FGG484I IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	4,172	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	128KB	64KB	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	-40°C ~ 100°C (TJ)	-	-	484-FPBGA (23x23)
BCM47622A1KFEBG QUAD CORE A7 -DUAL 11AX WIFI COM Broadcom Limited	2,608	-	RFQ	Datasheet	-	-	Tray	Active	MPU	ARM® Cortex®-A7	-	-	DDR3, DDR4, LED	Ethernet, I2C, PCIe, SPI, UART/USART, USB, Wifi	1.5GHz	-	-	-	-	-
0W635-006-XTP IC DSP EZAIRO 5920 SMD onsemi	3,525	-	RFQ	Datasheet	-	-	Tape & Reel (TR)	Not For New Designs	-	-	-	-	-	-	-	-	-	-	-	-
TDA3MVRBFABFRQ1 IC SOC PROCESSOR Texas Instruments	4,803	-	RFQ	Datasheet	-	367-BFBGA, FCBGA	Tape & Reel (TR)	Active	DSP, MPU	ARM® Cortex®-M4, C66x	-	512kB	DMA, PWM, WDT	CAN, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB	212.8MHz, 745MHz	-	-40°C ~ 125°C (TJ)	-	-	367-FCBGA (15x15)
R8A779M7JXXXBG#GB R-CAR D3E Renesas Electronics Corporation	4,442	-	RFQ	Datasheet	-	-	Tray	Active	-	-	-	-	-	-	-	-	-	-	-	-
M2S005S-1FG484I IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	2,798	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	128KB	64KB	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	-40°C ~ 100°C (TJ)	-	-	484-FPBGA (23x23)
M2S005S-1FGG484I IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	3,665	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	128KB	64KB	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	-40°C ~ 100°C (TJ)	-	-	484-FPBGA (23x23)
BCM47622A1IFEBG QUAD CORE A7,DUAL 11AX WIFI PROC Broadcom Limited	4,934	-	RFQ	Datasheet	-	-	Tray	Active	MPU	ARM® Cortex®-A7	-	-	DDR3, DDR4, LED	Ethernet, I2C, PCIe, SPI, UART/USART, USB, Wifi	1.5GHz	-	-	-	-	-
M2S010-VF256 IC SOC CORTEX-M3 166MHZ 256FBGA Microchip Technology	4,674	-	RFQ	Datasheet	SmartFusion®2	256-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 10K Logic Modules	0°C ~ 85°C (TJ)	-	-	256-FPBGA (14x14)

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System On Chip (SoC) FAQ

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Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

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Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

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Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

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