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System On Chip (SoC)

Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
M2S010T-1VF256I Microchip Technology

M2S010T-1VF256I

IC SOC CORTEX-M3 166MHZ 256FBGA

Microchip Technology

2,847 -
Datasheet SmartFusion®2 256-LFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules -40°C ~ 100°C (TJ) - - 256-FPBGA (14x14)
M2S010T-1VFG256I Microchip Technology

M2S010T-1VFG256I

IC SOC CORTEX-M3 166MHZ 256FBGA

Microchip Technology

3,446 -
Datasheet SmartFusion®2 256-LBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M2S010S-1FG484I Microsemi Corporation

M2S010S-1FG484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microsemi Corporation

3,691 -
Datasheet SmartFusion®2 484-BGA Tray Obsolete MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2S010S-1FGG484I Microsemi Corporation

M2S010S-1FGG484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microsemi Corporation

3,117 -
Datasheet SmartFusion®2 484-BGA Tray Obsolete MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2S010TS-VF400 Microchip Technology

M2S010TS-VF400

IC SOC CORTEX-M3 166MHZ 400VFBGA

Microchip Technology

3,514 -
Datasheet SmartFusion®2 400-LFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)
M2S010TS-VFG400 Microchip Technology

M2S010TS-VFG400

IC SOC CORTEX-M3 166MHZ 400VFBGA

Microchip Technology

3,219 -
Datasheet SmartFusion®2 400-LFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)
M2S010-1VF400I Microchip Technology

M2S010-1VF400I

IC SOC CORTEX-M3 166MHZ 400VFBGA

Microchip Technology

4,553 -
Datasheet SmartFusion®2 400-LFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules -40°C ~ 100°C (TJ) - - 400-VFBGA (17x17)
M2S010-1VFG400I Microchip Technology

M2S010-1VFG400I

IC SOC CORTEX-M3 166MHZ 400VFBGA

Microchip Technology

4,108 -
Datasheet SmartFusion®2 400-LFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules -40°C ~ 100°C (TJ) - - 400-VFBGA (17x17)
M2S010TS-1VF256 Microchip Technology

M2S010TS-1VF256

IC SOC CORTEX-M3 166MHZ 256FBGA

Microchip Technology

1,883 -
Datasheet SmartFusion®2 256-LFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules 0°C ~ 85°C (TJ) - - 256-FPBGA (14x14)
M2S010TS-1VFG256 Microchip Technology

M2S010TS-1VFG256

IC SOC CORTEX-M3 166MHZ 256FBGA

Microchip Technology

4,091 -
Datasheet SmartFusion®2 256-LBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M2S010TS-VF256I Microchip Technology

M2S010TS-VF256I

IC SOC CORTEX-M3 166MHZ 256FBGA

Microchip Technology

1,807 -
Datasheet SmartFusion®2 256-LFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules -40°C ~ 100°C (TJ) - - 256-FPBGA (14x14)
M2S010TS-VFG256I Microchip Technology

M2S010TS-VFG256I

IC SOC CORTEX-M3 166MHZ 256FBGA

Microchip Technology

3,761 -
Datasheet SmartFusion®2 256-LBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
R8A779M6JXXXBG#GD Renesas Electronics Corporation

R8A779M6JXXXBG#GD

R-CAR E3E

Renesas Electronics Corporation

4,384 -
Datasheet - - Tray Active - - - - - - - - - - - -
A2F200M3F-1CS288I Microchip Technology

A2F200M3F-1CS288I

IC SOC CORTEX-M3 100MHZ 288CSP

Microchip Technology

1,638 -
Datasheet SmartFusion® 288-TFBGA, CSPBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DMA, POR, WDT EBI/EMI, Ethernet, I2C, SPI, UART/USART 100MHz ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops -40°C ~ 100°C (TJ) - - 288-CSP (11x11)
M2S010T-FG484 Microchip Technology

M2S010T-FG484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

2,037 -
Datasheet SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2S010T-FGG484 Microchip Technology

M2S010T-FGG484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

4,274 -
Datasheet SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2S010-1FGG484 Microchip Technology

M2S010-1FGG484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

2,261 -
Datasheet SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2S010-1FG484 Microchip Technology

M2S010-1FG484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

1,481 -
Datasheet SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2S010-FG484I Microchip Technology

M2S010-FG484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

3,622 -
Datasheet SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2S010T-1VF400I Microchip Technology

M2S010T-1VF400I

IC SOC CORTEX-M3 166MHZ 400VFBGA

Microchip Technology

4,667 -
Datasheet SmartFusion®2 400-LFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules -40°C ~ 100°C (TJ) - - 400-VFBGA (17x17)
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WINSUN SOURCING SUPPORT

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FREQUENTLY ASKED QUESTIONS

System On Chip (SoC) FAQ

Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.

What should I check when selecting System On Chip (SoC) components?

Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

Can Winsun help source specific System On Chip (SoC) part numbers?

Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

Do you support shortage, obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

How do I request a quote for System On Chip (SoC) components?

Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.