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System On Chip (SoC)

Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
M2S010TS-1FG484I Microchip Technology

M2S010TS-1FG484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

2,701 -
Datasheet SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
PLCHIP-P13-51220X1 Divelbiss Corporation

PLCHIP-P13-51220X1

P13 PLC ON A CHIP SINGLE, LQFP-2

Divelbiss Corporation

4,490 -
Datasheet - 208-LQFP Box Active MCU PLC 256KB 32KB LCD, PWM, WDT CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART 12MHz - -40°C ~ 85°C (TJ) - - 208-LQFP (28x28)
XC7Z007S-2CLG225I AMD

XC7Z007S-2CLG225I

IC SOC CORTEX-A9 766MHZ 225BGA

AMD

1,911 -
Datasheet Zynq®-7000 225-LFBGA, CSPBGA Tray Active MCU, FPGA Single ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 766MHz Artix™-7 FPGA, 23K Logic Cells -40°C ~ 100°C (TJ) - - 225-CSPBGA (13x13)
BCM55045B1IFSBG Broadcom Limited

BCM55045B1IFSBG

10G XPON DPU CHIP

Broadcom Limited

4,453 -
Datasheet - - Tray Active - - - - - - - - - - - -
DRA829VMTGBALFR Texas Instruments

DRA829VMTGBALFR

DUAL ARM CORTEX-A72, QUAD CORTEX

Texas Instruments

3,532 -
Datasheet - 827-BFBGA, FCBGA Tape & Reel (TR) Last Time Buy DSP, MCU, MPU ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x - 1.5MB DMA, PWM, WDT MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB 2GHz, 1GHz, 1.35GHz, 1GHz - -40°C ~ 105°C (TJ) Automotive AEC-Q100 827-FCBGA (24x24)
R8A77980ALA01BA#GE Renesas Electronics Corporation

R8A77980ALA01BA#GE

SOC R-CAR V3H2-U2

Renesas Electronics Corporation

3,304 -
Datasheet - - Tray Active - - - - - - - - - - - -
A2F500M3G-1CSG288 Microchip Technology

A2F500M3G-1CSG288

IC SOC CORTEX-M3 100MHZ 288CSP

Microchip Technology

4,924 -
Datasheet SmartFusion® 288-TFBGA, CSPBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DMA, POR, WDT EBI/EMI, Ethernet, I2C, SPI, UART/USART 100MHz ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 0°C ~ 85°C (TJ) - - 288-CSP (11x11)
A2F500M3G-1CS288 Microchip Technology

A2F500M3G-1CS288

IC SOC CORTEX-M3 100MHZ 288CSP

Microchip Technology

1,707 -
Datasheet SmartFusion® 288-TFBGA, CSPBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DMA, POR, WDT EBI/EMI, Ethernet, I2C, SPI, UART/USART 100MHz ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 0°C ~ 85°C (TJ) - - 288-CSP (11x11)
M2S025-FG484 Microchip Technology

M2S025-FG484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

4,766 -
Datasheet SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2S025T-1FCS325 Microchip Technology

M2S025T-1FCS325

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology

1,707 -
Datasheet SmartFusion®2 325-TFBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2S025T-1FCSG325 Microchip Technology

M2S025T-1FCSG325

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology

1,239 -
Datasheet SmartFusion®2 325-TFBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2S025T-FCS325I Microchip Technology

M2S025T-FCS325I

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology

4,075 -
Datasheet SmartFusion®2 325-TFBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2S025T-FCSG325I Microchip Technology

M2S025T-FCSG325I

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology

3,659 -
Datasheet SmartFusion®2 325-TFBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2S025TS-FCS325 Microchip Technology

M2S025TS-FCS325

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology

1,068 -
Datasheet SmartFusion®2 325-TFBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2S025TS-FCSG325 Microchip Technology

M2S025TS-FCSG325

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology

1,367 -
Datasheet SmartFusion®2 325-TFBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
R8A779M4JXXXBG#GH Renesas Electronics Corporation

R8A779M4JXXXBG#GH

R-CAR M3NE

Renesas Electronics Corporation

2,629 -
Datasheet - - Tray Active - - - - - - - - - - - -
R8A779M5JXXXBG#GH Renesas Electronics Corporation

R8A779M5JXXXBG#GH

R-CAR M3NE-2G

Renesas Electronics Corporation

4,043 -
Datasheet - - Tray Active - - - - - - - - - - - -
A2F500M3G-1FG256 Microchip Technology

A2F500M3G-1FG256

IC SOC CORTEX-M3 100MHZ 256FBGA

Microchip Technology

3,330 -
Datasheet SmartFusion® 256-LBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DMA, POR, WDT EBI/EMI, Ethernet, I2C, SPI, UART/USART 100MHz ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A2F500M3G-CS288I Microchip Technology

A2F500M3G-CS288I

IC SOC CORTEX-M3 80MHZ 288CSP

Microchip Technology

3,523 -
Datasheet SmartFusion® 288-TFBGA, CSPBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DMA, POR, WDT EBI/EMI, Ethernet, I2C, SPI, UART/USART 80MHz ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops -40°C ~ 100°C (TJ) - - 288-CSP (11x11)
M2S025-1FCS325I Microchip Technology

M2S025-1FCS325I

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology

2,624 -
Datasheet SmartFusion®2 325-TFBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
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FREQUENTLY ASKED QUESTIONS

System On Chip (SoC) FAQ

Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.

What should I check when selecting System On Chip (SoC) components?

Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

Can Winsun help source specific System On Chip (SoC) part numbers?

Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

Do you support shortage, obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

How do I request a quote for System On Chip (SoC) components?

Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.