System On Chip (SoC)
Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.
For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
M2S010TS-1FG484IIC SOC CORTEX-M3 166MHZ 484FBGA |
2,701 | - |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 10K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FPBGA (23x23) |
|
PLCHIP-P13-51220X1P13 PLC ON A CHIP SINGLE, LQFP-2 |
4,490 | - |
|
Datasheet | - | 208-LQFP | Box | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 208-LQFP (28x28) |
|
|
XC7Z007S-2CLG225IIC SOC CORTEX-A9 766MHZ 225BGA |
1,911 | - |
|
Datasheet | Zynq®-7000 | 225-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 766MHz | Artix™-7 FPGA, 23K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 225-CSPBGA (13x13) |
|
BCM55045B1IFSBG10G XPON DPU CHIP |
4,453 | - |
|
Datasheet | - | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
DRA829VMTGBALFRDUAL ARM CORTEX-A72, QUAD CORTEX |
3,532 | - |
|
Datasheet | - | 827-BFBGA, FCBGA | Tape & Reel (TR) | Last Time Buy | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 105°C (TJ) | Automotive | AEC-Q100 | 827-FCBGA (24x24) |
|
R8A77980ALA01BA#GESOC R-CAR V3H2-U2 |
3,304 | - |
|
Datasheet | - | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
A2F500M3G-1CSG288IC SOC CORTEX-M3 100MHZ 288CSP |
4,924 | - |
|
Datasheet | SmartFusion® | 288-TFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 100MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 0°C ~ 85°C (TJ) | - | - | 288-CSP (11x11) |
|
A2F500M3G-1CS288IC SOC CORTEX-M3 100MHZ 288CSP |
1,707 | - |
|
Datasheet | SmartFusion® | 288-TFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 100MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 0°C ~ 85°C (TJ) | - | - | 288-CSP (11x11) |
|
M2S025-FG484IC SOC CORTEX-M3 166MHZ 484FBGA |
4,766 | - |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FPBGA (23x23) |
|
M2S025T-1FCS325IC SOC CORTEX-M3 166MHZ 325BGA |
1,707 | - |
|
Datasheet | SmartFusion®2 | 325-TFBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 325-FCBGA (11x11) |
|
M2S025T-1FCSG325IC SOC CORTEX-M3 166MHZ 325BGA |
1,239 | - |
|
Datasheet | SmartFusion®2 | 325-TFBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 325-FCBGA (11x11) |
|
M2S025T-FCS325IIC SOC CORTEX-M3 166MHZ 325BGA |
4,075 | - |
|
Datasheet | SmartFusion®2 | 325-TFBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 325-FCBGA (11x11) |
|
M2S025T-FCSG325IIC SOC CORTEX-M3 166MHZ 325BGA |
3,659 | - |
|
Datasheet | SmartFusion®2 | 325-TFBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 325-FCBGA (11x11) |
|
M2S025TS-FCS325IC SOC CORTEX-M3 166MHZ 325BGA |
1,068 | - |
|
Datasheet | SmartFusion®2 | 325-TFBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 325-FCBGA (11x11) |
|
M2S025TS-FCSG325IC SOC CORTEX-M3 166MHZ 325BGA |
1,367 | - |
|
Datasheet | SmartFusion®2 | 325-TFBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 325-FCBGA (11x11) |
|
R8A779M4JXXXBG#GHR-CAR M3NE |
2,629 | - |
|
Datasheet | - | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
R8A779M5JXXXBG#GHR-CAR M3NE-2G |
4,043 | - |
|
Datasheet | - | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
A2F500M3G-1FG256IC SOC CORTEX-M3 100MHZ 256FBGA |
3,330 | - |
|
Datasheet | SmartFusion® | 256-LBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 100MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 0°C ~ 85°C (TJ) | - | - | 256-FPBGA (17x17) |
|
A2F500M3G-CS288IIC SOC CORTEX-M3 80MHZ 288CSP |
3,523 | - |
|
Datasheet | SmartFusion® | 288-TFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 80MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | -40°C ~ 100°C (TJ) | - | - | 288-CSP (11x11) |
|
M2S025-1FCS325IIC SOC CORTEX-M3 166MHZ 325BGA |
2,624 | - |
|
Datasheet | SmartFusion®2 | 325-TFBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 325-FCBGA (11x11) |
System On Chip (SoC) FAQ
Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.
What should I check when selecting System On Chip (SoC) components?
Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.
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Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.
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