System On Chip (SoC)

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Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Package/Case	Packaging	Product Status	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Grade	Qualification	Supplier Device Package
M2S025-1VFG256 IC SOC CORTEX-M3 166MHZ 256FBGA Microchip Technology	1,364	-	RFQ	Datasheet	SmartFusion®2	256-LBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	-	-	256-FPBGA (17x17)
M2S025-VF256I IC SOC CORTEX-M3 166MHZ 256FBGA Microchip Technology	4,704	-	RFQ	Datasheet	SmartFusion®2	256-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	-	-	256-FPBGA (14x14)
DRA829JMTGBALFRQ1 DUAL ARM CORTEX-A72, QUAD CORTEX Texas Instruments	2,428	-	RFQ	Datasheet	-	827-BFBGA, FCBGA	Tape & Reel (TR)	Last Time Buy	DSP, MCU, MPU	ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x	-	1.5MB	DMA, PWM, WDT	I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB	2GHz, 1GHz, 1.35GHz, 1GHz	-	-40°C ~ 105°C (TJ)	-	-	827-FCBGA (24x24)
M2S050-FCS325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	1,030	-	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 50K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x11)
M2S050-FCSG325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	4,867	-	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 50K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x11)
M2S060-FCS325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	4,247	-	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x11)
M2S060-FCSG325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	1,631	-	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x11)
XC7Z020-1CLG400CES IC SOC CORTEX-A9 667MHZ 400BGA AMD	2,418	-	RFQ	Datasheet	Zynq®-7000	400-LFBGA, CSPBGA	Tray	Obsolete	MCU, FPGA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	667MHz	Artix™-7 FPGA, 85K Logic Cells	0°C ~ 85°C (TJ)	-	-	400-CSPBGA (17x17)
R8A779M2JXXXBG#GS R-CAR M3E Renesas Electronics Corporation	2,196	-	RFQ	Datasheet	-	-	Tray	Active	-	-	-	-	-	-	-	-	-	-	-	-
R8A779M3JXXXBG#GS R-CAR M3E-2G Renesas Electronics Corporation	2,726	-	RFQ	Datasheet	-	-	Tray	Active	-	-	-	-	-	-	-	-	-	-	-	-
XA7Z010-1CLG400I IC SOC CORTEX-A9 667MHZ 400BGA AMD	2,042	-	RFQ	Datasheet	Zynq®-7000 XA	400-LFBGA, CSPBGA	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	667MHz	Artix™-7 FPGA, 28K Logic Cells	-40°C ~ 100°C (TJ)	Automotive	AEC-Q100	400-CSPBGA (17x17)
M2S025T-FG484 IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	1,031	-	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	-	-	484-FPBGA (23x23)
M2S025T-1VF400 IC SOC CORTEX-M3 166MHZ 400VFBGA Microchip Technology	2,033	-	RFQ	Datasheet	SmartFusion®2	400-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	-	-	400-VFBGA (17x17)
M2S025T-1VFG400 IC SOC CORTEX-M3 166MHZ 400VFBGA Microchip Technology	2,071	-	RFQ	Datasheet	SmartFusion®2	400-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	-	-	400-VFBGA (17x17)
M2S025T-VFG400I IC SOC CORTEX-M3 166MHZ 400VFBGA Microchip Technology	3,256	-	RFQ	Datasheet	SmartFusion®2	400-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	-	-	400-VFBGA (17x17)
M2S025TS-VF400 IC SOC CORTEX-M3 166MHZ 400VFBGA Microchip Technology	1,069	-	RFQ	Datasheet	SmartFusion®2	400-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	-	-	400-VFBGA (17x17)
M2S025TS-VFG400 IC SOC CORTEX-M3 166MHZ 400VFBGA Microchip Technology	2,577	-	RFQ	Datasheet	SmartFusion®2	400-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	-	-	400-VFBGA (17x17)
M2S025T-VF400I IC SOC CORTEX-M3 166MHZ 400VFBGA Microchip Technology	4,677	-	RFQ	Datasheet	SmartFusion®2	400-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	-	-	400-VFBGA (17x17)
XC7Z010-L1CLG225I IC SOC CORTEX-A9 667MHZ 225BGA AMD	2,657	-	RFQ	Datasheet	Zynq®-7000	225-LFBGA, CSPBGA	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	667MHz	Artix™-7 FPGA, 28K Logic Cells	-40°C ~ 100°C (TJ)	-	-	225-CSPBGA (13x13)
M2S025T-1VF256 IC SOC CORTEX-M3 166MHZ 256FBGA Microchip Technology	2,252	-	RFQ	Datasheet	SmartFusion®2	256-LFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	-	-	256-FPBGA (14x14)

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System On Chip (SoC) FAQ

Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.

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Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.

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Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.

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Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.

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