System On Chip (SoC)
Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.
For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
M2S150T-1FCV484MFPGA 484-BGA |
2,406 | - |
|
Datasheet | SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -55°C ~ 125°C (TJ) | - | - | 484-FBGA (19x19) |
|
10AS016E3F29E2SGIC SOC CORTEX-A9 1.5GHZ 780FBGA |
1,821 | - |
|
Datasheet | Arria 10 SX | 780-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 160K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 780-FBGA, FC (29x29) |
|
10AS016C3U19E2LGIC SOC CORTEX-A9 1.5GHZ 484UBGA |
4,887 | - |
|
Datasheet | Arria 10 SX | 484-BFBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 160K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 484-UBGA (19x19) |
|
10AS022E4F27I3SGIC SOC CORTEX-A9 1.5GHZ 672FBGA |
1,972 | - |
|
Datasheet | Arria 10 SX | 672-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 220K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 672-FBGA, FC (27x27) |
|
A2F500M3G-FG484MIC SOC CORTEX-M3 80MHZ 484FBGA |
2,201 | - |
|
Datasheet | SmartFusion® | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 80MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | -55°C ~ 125°C (TJ) | - | - | 484-FPBGA (23x23) |
|
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A2F500M3G-FGG484MIC SOC CORTEX-M3 80MHZ 484FBGA |
4,087 | - |
|
Datasheet | SmartFusion® | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 80MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | -55°C ~ 125°C (TJ) | - | - | 484-FPBGA (23x23) |
|
|
10AS027E4F27E3SGIC SOC CORTEX-A9 1.5GHZ 672FBGA |
4,833 | - |
|
Datasheet | Arria 10 SX | 672-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 270K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 672-FBGA, FC (27x27) |
|
XCZU4CG-1SFVC784EIC SOC CORTEX-A53 784FCBGA |
2,905 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
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10AS022E4F27E3LGIC SOC CORTEX-A9 1.5GHZ 672FBGA |
3,026 | - |
|
Datasheet | Arria 10 SX | 672-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 220K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 672-FBGA, FC (27x27) |
|
|
10AS016E4F27I3LGIC SOC CORTEX-A9 1.5GHZ 672FBGA |
1,417 | - |
|
Datasheet | Arria 10 SX | 672-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 160K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 672-FBGA, FC (27x27) |
|
XC7Z045-1FBG676CESIC SOC CORTEX-A9 667MHZ 676FCBGA |
1,006 | - |
|
Datasheet | Zynq®-7000 | 676-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 350K Logic Cells | 0°C ~ 85°C (TJ) | - | - | 676-FCBGA (27x27) |
|
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10AS016E3F27E1HGIC SOC CORTEX-A9 1.5GHZ 672FBGA |
3,782 | - |
|
Datasheet | Arria 10 SX | 672-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 160K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 672-FBGA, FC (27x27) |
|
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10AS016E3F27I2SGIC SOC CORTEX-A9 1.5GHZ 672FBGA |
2,891 | - |
|
Datasheet | Arria 10 SX | 672-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 160K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 672-FBGA, FC (27x27) |
|
A5EC065BB23AE4SR0A5EC065BB23AE4SR0 |
2,109 | - |
|
Datasheet | Agilex E | 839-FBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ | - | 512kB | DDR, DMA, PCIe, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz, 1.8GHz | FPGA - 656K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 839-VPBGA (23x23) |
|
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10AS022E4F29I3SGIC SOC CORTEX-A9 1.5GHZ 780FBGA |
4,872 | - |
|
Datasheet | Arria 10 SX | 780-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 220K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 780-FBGA, FC (29x29) |
|
|
A5ED065BB23AE4SR0A5ED065BB23AE4SR0 |
1,033 | - |
|
Datasheet | Agilex E | 839-FBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ | - | 512kB | DDR, DMA, PCIe, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz, 1.8GHz | FPGA - 656K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 839-VPBGA (23x23) |
|
|
10AS022E3F27E2SGIC SOC CORTEX-A9 1.5GHZ 672FBGA |
1,550 | - |
|
Datasheet | Arria 10 SX | 672-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 220K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 672-FBGA, FC (27x27) |
|
|
10AS022C4U19I3LGIC SOC CORTEX-A9 1.5GHZ 484UBGA |
3,652 | - |
|
Datasheet | Arria 10 SX | 484-BFBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 220K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 484-UBGA (19x19) |
|
|
10AS022E4F29E3LGIC SOC CORTEX-A9 1.5GHZ 780FBGA |
4,612 | - |
|
Datasheet | Arria 10 SX | 780-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 220K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 780-FBGA, FC (29x29) |
|
|
10AS016E4F29I3LGIC SOC CORTEX-A9 1.5GHZ 780FBGA |
3,102 | - |
|
Datasheet | Arria 10 SX | 780-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 160K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 780-FBGA, FC (29x29) |
System On Chip (SoC) FAQ
Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.
What should I check when selecting System On Chip (SoC) components?
Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.
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Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.
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Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.
