Memory
Use the filters and product table below to compare Memory components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.
If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
D5116AN9CXGXNY-U96-Ball 512Mx16 |
174 | - |
|
Datasheet | - | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
D0811PM2FDGUK-UIC DRAM 8GBIT 200FBGA |
109 | - |
|
Datasheet | LPDDR4 | 200-VFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 8Gbit | 512M x 16 | - | - | - | - | - | -25°C ~ 85°C | - | - | Surface Mount | 200-FBGA (10x14.5) |
|
EMMC08G-AR0A-01000AUTO TEMP EMMC 5.1 HS400 |
133 | - |
|
Datasheet | - | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
B1621XM2FDGVK-UIC DRAM 16GBIT PAR 200FBGA |
144 | - |
|
Datasheet | LPDDR4X | 200-VFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 16Gbit | 1G x 16 | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 200-FBGA (10x14.5) |
|
D1621XM4CDGVI-UIC DRAM 16GBIT PAR 200FBGA |
144 | - |
|
Datasheet | LPDDR4X | 200-WFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 16Gbit | 1G x 16 | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 200-FBGA (10x14.5) |
|
B1621PM2FDGUK-U16GB 200 BALL LPDDR4 3733MHZ |
136 | - |
|
Datasheet | LPDDR4 | 200-VFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 16Gbit | 512M x 32 | - | - | - | - | - | -25°C ~ 85°C | - | - | Surface Mount | 200-FBGA (10x14.5) |
|
D1621PM4CDGUI-UIC DRAM 16GBIT PAR 200FBGA |
114 | - |
|
Datasheet | LPDDR4 | 200-WFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 16Gbit | 512M x 16 | Parallel | 1.866 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 200-FBGA (10x14.5) |
|
EMMC64G-TY29-5B111IC FLASH 512GBIT EMMC 153WFBGA |
281 | - |
|
Datasheet | - | 153-WFBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (TLC) | 512Gbit | 64G x 8 | eMMC | - | - | - | 1.8V, 3.3V | -25°C ~ 85°C | - | - | Surface Mount | 153-WFBGA (11.5x13) |
|
EMMC64G-IY29-5B111IC FLSH 512GBIT EMMC 5.1 153FBGA |
152 | - |
|
Datasheet | I-Temp e•MMC™ | 153-BGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (TLC) | 512Gbit | 64G x 8 | eMMC_5.1 | - | - | - | - | -40°C ~ 85°C | - | - | Surface Mount | 153-FBGA (11.5x13) |
|
08EP08-N3GTC32-GA67IC FLASH RAM 64GBIT EMMC 136FBGA |
215 | - |
|
Datasheet | ePop | 136-FBGA | Tray | Active | Not Verified | Non-Volatile, Volatile | FLASH, RAM | FLASH - NAND, DRAM - LPDDR | 8GByte (NAND), 8Gbit (LPDDR3 DRAM) | - | eMMC 5.1 HS400 + LPDDR3 | - | - | - | 1.8V, 3.3V | -25°C ~ 85°C | - | - | Surface Mount | 136-FBGA (10x10) |
Memory FAQ
Common questions about filtering, comparing and sourcing Memory components.
How can I narrow the Memory selection?
Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.
Should I confirm the datasheet before selecting a part?
Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.
Can Winsun (HK) Electronics help source a specific Memory part number?
Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.
Do you support BOM, shortage or alternative-part requirements?
Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.