Memory
Use the filters and product table below to compare Memory components by manufacturer, availability, pricing reference and technical specifications. Review datasheets and key parameters to narrow the selection for your application.
If you already have a target part number, package, rating or quantity, send the requirement to Winsun (HK) Electronics for availability checks, BOM sourcing, shortage support and quotation assistance.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
EMMC128-TY29-5B101IC FLASH 1TBIT EMMC 153FBGA |
102 | - |
|
Datasheet | - | 153-BGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (TLC) | 1Tbit | 128G x 8 | eMMC | - | - | - | - | -25°C ~ 85°C | - | - | Surface Mount | 153-FBGA (11.5x13) |
|
B3221XM3BDGVI-UIC DRAM 32GBIT PAR 200FBGA |
140 | - |
|
Datasheet | LPDDR4X | 200-WFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 32Gbit | 2G x 16 | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 200-FBGA (10x14.5) |
|
|
B3221PM3BDGUI-UIC DRAM 32GBIT PAR 200FBGA |
121 | - |
|
Datasheet | LPDDR4 | 200-WFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 32Gbit | 2G x 16 | Parallel | 1.866 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 200-FBGA (10x14.5) |
|
|
EMMC128-IY29-5B102IC FLASH 1TBIT EMMC 153FBGA |
4,870 | - |
|
Datasheet | e•MMC™ | 153-WFBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (TLC) | 1Tbit | 128G x 8 | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | - | - | Surface Mount | 153-FBGA (11.5x13) |
|
EMMC256-TY29-5B111IC FLASH 2TBIT EMMC 153WFBGA |
287 | - |
|
Datasheet | - | 153-WFBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (TLC) | 2Tbit | 256G x 8 | eMMC | - | - | - | 1.8V, 3.3V | -25°C ~ 85°C | - | - | Surface Mount | 153-WFBGA (11.5x13) |
|
EMMC256-TY29-5B101IC FLASH 2TBIT EMMC 153FBGA |
147 | - |
|
Datasheet | - | 153-BGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (TLC) | 2Tbit | 256G x 8 | eMMC | - | - | - | - | -25°C ~ 85°C | - | - | Surface Mount | 153-FBGA (11.5x13) |
|
|
EMMC256-TY29-5B102IC FLASH 2TBIT EMMC 153FBGA |
2,949 | - |
|
Datasheet | e•MMC™ | 153-VFBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (TLC) | 2Tbit | 256G x 8 | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -25°C ~ 85°C | - | - | Surface Mount | 153-FBGA (11.5x13) |
|
|
Q6422XM3BDGVK-UIC DRAM 64GBIT PAR 200FBGA |
144 | - |
|
Datasheet | LPDDR4X | 200-VFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 64Gbit | 4G x 16 | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 200-FBGA (10x14.5) |
|
EMMC256-IY29-5B101IC FLASH 2TBIT EMMC 5.1 153FBGA |
152 | - |
|
Datasheet | I-Temp e•MMC™ | 153-BGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (TLC) | 2Tbit | 256G x 8 | eMMC_5.1 | - | - | - | - | -40°C ~ 85°C | - | - | Surface Mount | 153-FBGA (11.5x13) |
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|
EMMC04G-WT32-01G10IC FLASH 32GBIT EMMC 153FBGA |
561 | - |
|
Datasheet | - | 153-VFBGA | Tray | Not For New Designs | - | Non-Volatile | FLASH | FLASH - NAND (MLC) | 32Gbit | 4G x 8 | eMMC_5.1 | - | - | - | 1.8V, 3.3V | -40°C ~ 85°C | - | - | Surface Mount | 153-FBGA (11.5x13) |
Memory FAQ
Common questions about filtering, comparing and sourcing Memory components.
How can I narrow the Memory selection?
Use the available manufacturer and technical parameter filters to reduce the product list. Compare the remaining part numbers against your electrical, package and application requirements.
Should I confirm the datasheet before selecting a part?
Yes. Always review the manufacturer datasheet to confirm ratings, package, operating conditions and other technical details before finalizing a component for your design.
Can Winsun (HK) Electronics help source a specific Memory part number?
Yes. Send the exact manufacturer part number and required quantity for availability, lead-time and quotation support.
Do you support BOM, shortage or alternative-part requirements?
Yes. You can submit a BOM or shortage list for sourcing assistance. Where appropriate, our team can also help review possible alternative-part options.
