System On Chip (SoC)
Browse available System On Chip (SoC) part numbers with manufacturer references, stock information, pricing, datasheets and key specifications. Use the table below to compare options for your project.
For BOM, shortage or hard-to-find requirements, send your part number and quantity to Winsun (HK) Electronics for availability, lead-time and quotation support.
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
PLCHIP-P10-51220P10 PLC ON A CHIP, LQFP-144, UP |
120 | - |
|
Datasheet | - | 144-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 144-LQFP (20x20) |
|
PSB21653EV1.4-GINCA -IP2 SINGLE-CHIP IP PHONE W |
429 | - |
|
Datasheet | * | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
R8J66744BG#R0SOC/SIP |
909 | - |
|
Datasheet | * | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
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SC1201UFH-266SC1201 - 32-BIT MICROPROCESSOR |
18,109 | - |
|
Datasheet | - | 481-BFBGA | Bulk | Active | MPU | X86 | - | - | AC97/AMC97, DMA, PCI, SmartCard, WDT | Access.bus, GPIO, PC/AT, UART | 266MHz | - | 0°C ~ 85°C (TC) | - | - | 481-BGA (40x40) |
|
PLCHIP-P13-51220P13 PLC ON A CHIP LQFP-208, UP T |
2,349 | - |
|
Datasheet | - | 208-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 208-LQFP (28x28) |
|
|
R8J66607B00FP#RF1SSOC/SIP |
2,826 | - |
|
Datasheet | * | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
SC1201UFH-266BSC1201 - 32-BIT MICROPROCESSOR |
4,606 | - |
|
Datasheet | - | 481-BFBGA | Bulk | Active | MPU | X86 | - | - | AC97/AMC97, DMA, PCI, SmartCard, WDT | Access.bus, GPIO, PC/AT, UART | 266MHz | - | 0°C ~ 85°C (TC) | - | - | 481-BGA (40x40) |
|
|
SC1200UFH-266SC1200 - 32-BIT MICROPROCESSOR |
348 | - |
|
Datasheet | - | 481-BFBGA | Bulk | Active | MPU | X86 | - | - | AC97/AMC97, DMA, PCI, SmartCard, WDT | Access.bus, GPIO, PC/AT, UART | 266MHz | - | 0°C ~ 85°C (TC) | - | - | 481-BGA (40x40) |
|
SC2200UCL-300MICRO PERIPHERAL IC PBGA432 |
7,946 | - |
|
Datasheet | Geode™ | 432-BGA Exposed Pad | Bulk | Active | MPU | x86 | - | - | AC97/AMC97, DMA, PCI, SmartCard, WDT | Access.bus, GPIO, PC/AT, UART | 300MHz | - | 0°C ~ 85°C (TC) | - | - | 432-EBGA (40x40) |
|
TDA4AL88TGAALZRQ1AUTOMOTIVE SYSTEM-ON-A-CHIP FOR |
210 | - |
|
Datasheet | - | 770-BFBGA, FCBGA | Tape & Reel (TR) | Active | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1GHz | - | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 770-FCBGA (23x23) |
|
DRA829JMTGBALFRDUAL ARM CORTEX-A72, QUAD CORTEX |
250 | - |
|
Datasheet | - | 827-BFBGA, FCBGA | Tape & Reel (TR) | Last Time Buy | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 105°C (TJ) | - | - | 827-FCBGA (24x24) |
|
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TDA4VE88TGAALZRQ1AUTOMOTIVE SYSTEM-ON-A-CHIP FOR |
175 | - |
|
Datasheet | - | 770-BFBGA, FCBGA | Tape & Reel (TR) | Active | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 2MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1GHz | - | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 770-FCBGA (23x23) |
|
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TDA4VM88TGBALFRNEXT GENERATION SOC FAMILY FOR L |
494 | - |
|
Datasheet | - | 827-BFBGA, FCBGA | Tape & Reel (TR) | Last Time Buy | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 105°C (TJ) | Automotive | AEC-Q100 | 827-FCBGA (24x24) |
|
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PXB4340EV1.1-GAOP ATM OAM PROCESSOR |
360 | - |
|
Datasheet | * | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
TDA4VM88TGBALFRQ1NEXT GENERATION SOC FAMILY FOR L |
218 | - |
|
Datasheet | - | 827-BFBGA, FCBGA | Tape & Reel (TR) | Last Time Buy | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 827-FCBGA (24x24) |
|
M2S050T-FGG484IC SOC CORTEX-M3 166MHZ 484FBGA |
4,377 | - |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FPBGA (23x23) |
|
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WDC6202GJL250XWIRELESS 27MM 6202 WITH XBUS |
4,631 | - |
|
Datasheet | * | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
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PXB4330EV2.1AOP ATM OAM PROCESSOR |
246 | - |
|
Datasheet | * | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
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5CSEBA5U19I7NIC SOC CORTEX-A9 800MHZ 484UBGA |
2,620 | - |
|
Datasheet | Cyclone® V SE | 484-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 85K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 484-UBGA (19x19) |
|
5CSEBA6U23C6NIC SOC CORTEX-A9 925MHZ 672UBGA |
1,644 | - |
|
Datasheet | Cyclone® V SE | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 672-UBGA (23x23) |
System On Chip (SoC) FAQ
Common questions about selecting, comparing and sourcing System On Chip (SoC) components through Winsun (HK) Electronics.
What should I check when selecting System On Chip (SoC) components?
Compare the manufacturer part number, electrical specifications, package, operating conditions and application requirements. The product datasheet should be used to confirm technical suitability.
Can Winsun help source specific System On Chip (SoC) part numbers?
Yes. Send the exact part number, manufacturer and required quantity. Winsun (HK) Electronics can assist with availability checks, quotation support and sourcing options based on your requirement.
Do you support shortage, obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Our sourcing team can review shortage and obsolete-part requirements and help check available supply channels or possible alternatives when appropriate.
How do I request a quote for System On Chip (SoC) components?
Submit an RFQ with the part number, manufacturer, quantity and target delivery requirement. Our sales team will review your request and follow up with current sourcing information.
